Not in stock
The AM5 Mycro Direct-Die from Thermal Grizzly is a direct-die water cooler for AMD's Ryzen 7000 processors. As the name already suggests, the water cooler lies directly on the chiplets of the delidded Ryzen CPU. This makes the path from the CPU die to the water circuit much shorter. Micro fins on the top of the nickel-plated copper cooler are used for optimal transfer of waste heat. The AM5 Mycro Direct-Die is integrated into the circuit of a custom water cooling system via G1/4-inch connections.
Nickel-plated copper radiator with microfin structure
The AM5 Mycro Direct-Die replaces the motherboard's Socket Actuation Mechanism (SAM) and the heatspreader of the Ryzen 7000 processor. Thus, the processor has to be delidded. On the significantly larger surface of the nickel-plated copper heatspreader compared to the stock heatspreader, there are optimized microfins that dissipate the waste heat extremely effectively into the water circuit of the custom cooling loop. At the same time, optimal contact pressure of the CPU into the socket is enabled. The lid is made of CNC-milled polyoxymethylene (POM) and is equipped with one inlet and outlet each in the form of G1/4-inch threads.
- Water cooler for direct die mounting
- Microfin cooler made of nickel-plated copper
- Replaces SAM and heatspreader
- CNC machined POM cover
- G1/4 inch connections
- Only for delidded CPUs!
Maximum cooling performance
In tests**, the AM5 Mycro Direct die in combination with Conductonaut Extreme could establish itself as the high-end solution with the best temperatures. A Ryzen 7900X (5.0 GHz, 1.3 vCore) was cooled down to 64 °Celsius under load during testing. Compared to an everyday solution in the form of a 280 mm AiO, temperatures could be lowered by up to 26 °Celsius in comparable test sections. A comparable water cooler reached via Direct-Die temperatures that were 3 °Celsius higher than the AM5 Mycro Direct-Die. The AM5 Mycro Direct-Die's nickel-plated surface is compatible with traditional thermal pastes and gallium-based liquid metals. The nickel forms a barrier layer between the liquid metal and the copper cooler, preventing liquid metal from diffusing into the copper and minimizing alloying. As a result, multiple applications of liquid metal are generally not necessary. For the lowest maintenance system possible, a KryoSheet graphene thermal pad can be used as the thermal interface between the CPU and the AM5 Mycro Direct Die. Since KryoSheet pads are electrically conductive, a cover is included to protect the electronic components on the CPU package. Temperatures below 70 °Celsius were measured with a KryoSheet in the tests**.**It should be noted that the temperature improvements achieved depend on several factors. Besides the quality of the individual processors ("Silicon Lottery"), test results are influenced by the room temperature and the cooling used, among other things. For an AiO, for example, the cooling performance depends on factors like the pump speed as well as the fans used. The values given are guidelines that can be higher or lower in individual cases.
Scope of Delivery
- 1x AM5 Mycro Direct-Die
- 1x test certificate
- 4x screw
- 1x angle wrench
- 1x Insulation sheet
|Material:||Acetal, Nickel-plated copper|