The minus pad extreme thermal pad is silicone based with modelling clay like consistency. This allows a perfect surface shaping with maximum possible compression. The minus pad extreme is electrically insulating.
Due to the consistency only one-time use is recommended. The thermal conductivity was improved by about 260 % over the minus pad 8 which allows best cooling for tough cooling operations such as voltage regulators and memory ICs.
- Most excellent thermal conductivity
- No bleeding
- long-term stability
- high compression rate
| Application | Rating |
|---|---|
| Thermal Conductivity¹ | ***** |
| Sub-Zero Overclocking | * |
| Overclocking | **** |
| Water Cooling | ***** |
| Air Cooling | ***** |
¹ within the capabilities of thermal pads
The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm.
| Specifications | |
|---|---|
| Hardness | Shore 00 - 65 |
| Thickness | 0,5–3,0 mm |
| Typical thickness tolerance | ± 0,1 mm |
| Flammability | V-0 |
| Electically insulating | Ja (8 KV/mm ASTM D149) |
| Density | 3.38 g/cm³ |
| Temperature Range | -100 °C / +200 °C |
