LATEST NEWS
NEW PRODUCTS: HEATSPREADER & MYCRO DIRECT DIE FOR INTEL CPUS
Today we are introducing two new products that are already available in our store and teasing a third. The Intel High Performance Heatspreader V1 offers a 207% larger surface area compared to the stock heatspreader, while the Intel Mycro Direct Die water cooler version 1 integrates beheaded Intel processors directly into the water cooling system.
RYZEN DIRECT DIE FRAMES V2: HOW THE DDF IS MADE
With this blog post on the release of the Direct Die Frame V2, we would like to provide an insight into production at Thermal Grizzly. We will show the individual production steps of the Ryzen Direct Die Frame V2 and also discuss quality control. This is carried out during operation so that we can react in real time to any problems that may arise. The new Ryzen Direct Die Frame V2 will be available in the next few weeks and will extend the compatibility of the DDF to include the Ryzen 7000X3D CPUs.
LATEST PRODUCTS
Intel Mycro Direct-Die V1
The Intel Mycro Direct Die V1 is a water cooler for Intel processors that is placed directly on the CPU die of a delidded CPU. Made of nickel-plated copper, the direct-die water cooler offers outstanding thermal conductivity. This is further enhanced by the optimized structure of the microfins on the top.
Intel HEATSPREADER
The Intel High Performance Heatspreader V1 is an upgrade heatspreader for Intel processors. The nickel-plated copper heatspreader has a 207 percent larger, diamond-milled precision surface. This increased surface area compared to the original heatspreader enables maximum heat dissipation for air and water coolers.
Ryzen Direct Die Frame V2
The Ryzen 7000 Direct Die Frame V2 is an updated version of the CPU mounting frame, specially developed for increased compatibility with AMD AM5 CPUs, including the Ryzen 7000X3D processors. This frame allows for the mounting of delidded CPUs without an integrated heatspreader and provides a simplified installation. Made from robust, anodized aluminum.