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Product information "Minus Pad 8"

The performance thermal pads of the Thermal Grizzly minus pad series feature a highly elastic and adaptable surface combined with medium thermal conductivity, compensating for even the smallest of gaps between components. Available in a variety of different sizes and thicknesses.

Properties

  • Medium conductivity
  • High compressibility
  • Electrical insulation

Flexible, efficient and reliable

The easy to process and flexible minus pads are made up of different constituents, based on a ceramic silicon formula complex and nano aluminum oxide. Thus, the pads ensure a constant, optimal heat transfer. The lightest of touches is enough to attach them optimally.

All pads are ecofriendly and RoHS-compliant.

The minus pads 8 are available in the sizes of 30x30mm, 120x20mm, 100x100mm as well as in the thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm.

High compressibility
Medium conductivity
Electrically non-conductive
Easy to use
Comparison table Pads

Minus Pad 8

Choose the thickness of Minus Pad 8 according to the specific cooler's requirements or the actual gap and compression behavior. There is no universal pad thickness for a GPU, VRAM or SSD model. A pad that is too thin makes no contact, while one that is too thick can lift the cooler off the main chip. The already-compressed thickness of old pads is only a guide. Compression depends on the original thickness, area and mounting pressure. Check the contact imprint and follow the mounting instructions. An incorrect thickness cannot be compensated for by tightening further. External databases such as paddb.com can provide information on the pad thickness needed for your graphics card. You can measure used pads with a caliper such as TG Caliper. However, bear in mind that the area measured may have been compressed during use and that you may need a slightly larger thickness.
If your Minus Pad 8 package includes an authentication card, check the code on the official website printed on it. A missing code or different packaging alone does not prove that a product is counterfeit, as package contents and packaging can vary by product and batch. If the code is invalid, send us photos of the product, packaging, code and proof of purchase so we can check them. Whenever possible, buy from a retailer on our reseller list.
Minus Pad 8 bridges gaps between components and the cooler. Cooling performance depends on pad thickness, compression and full contact. The Minus Pad series differ in heat transfer and deformability. Therefore, check thickness and contact again when switching series. Minus Pad 8 ranks above Minus Pad Advance in performance. Basic is less expensive and intended for somewhat lower performance requirements, while Pro offers very good performance. Minus Pad Extreme (2) offers the highest performance among Thermal Grizzly pads.
Install Minus Pad 8 on clean contact surfaces without additional thermal paste or liquid metal. At the same time, the main CPU/GPU chip can use the other thermal interface material intended for it. In that case, the materials are used at different contact points. Pads can be stacked, but this may cause some loss of performance.
Available instructions, technical data sheets, safety data sheets and conformity documents for Minus Pad 8 can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
The package contents of Minus Pad 8 depend on the selected size, thickness and pack quantity. Therefore, check the quantity listed for the specific item number. The films on the pads protect them during transport and application and must be removed before installation. If the stated quantity is missing, send us proof of purchase and photos of the packaging and contents.
A fixed replacement interval for Minus Pad 8 is not generally necessary. During maintenance or if temperatures rise, check that the pad is still clean, undamaged and in contact at all intended points. After disassembly, replace pads that are torn, contaminated or permanently deformed in a way that makes them unsuitable.
Check the position and thickness of Minus Pad 8 and the imprint on both contact sides. Remove all protective films and check whether an overly thick pad is lifting the cooler off the CPU/GPU die. Airflow or the liquid cooling loop must also be working properly. Do not increase mounting pressure beyond the permissible installation specification. A pad that is too thin can prevent heat from being transferred.
Minus Pad 8 is intended as a gap filler between components such as VRAM, voltage regulators or SSD components and their cooler. Choose thickness and dimensions according to the cooler's requirements and the actual gap. For the thin interface on a CPU heatspreader or CPU/GPU die, use the thermal interface material intended for that purpose. A Minus Pad is not a replacement there for paste, a liquid metal interface or a suitable sheet.
Minus Pad 8 has an application temperature range of −100 to +250 °C. The temperature limits of the hardware being cooled and its mounting system also apply. Continuous industrial high-temperature applications require a separate assessment of material aging, pressure and contact. Minus Pad 8 is not silicone-free.
Minus Pad 8 can be used in laptops for VRAM, VRMs or other contact areas designed to have a gap. The correct thickness and sufficient mounting pressure are essential. Particularly in laptops, pads that are too thick or too firm can lift the cooler. On CPU and GPU dies, use the thermal interface material intended for that purpose.
Cut Minus Pad 8 to size with sharp scissors or a blade on a clean surface. If possible, leave the protective films on the material while cutting it, and remove one film before installation. Remove the second film only after positioning the pad, as this reduces deformation. The intended component area should be fully covered without obstructing adjacent mechanical contact points.
Minus Pad 8 may adhere slightly, but it is not a mounting adhesive. A heatsink must be held in place by its intended mounting system. Position the pad on clean contact surfaces, fit the cooler without sliding it sideways, and tighten it according to its instructions.
Minus Pad 8 can replace suitable thermal pads on memory, voltage regulators or other gap contact areas in a console. Follow the requirements of the specific console model for pad positions and thicknesses. A universal thickness in millimeters is not reliable. On the main chip, this type of pad is normally not a replacement for the intended paste or liquid metal interface.
Minus Pad 8 is not electrically conductive. Nevertheless, the pad must not obstruct sockets, connector contacts or moving parts, and it does not replace an insulator certified for mains or high voltage. For such a special application, the required electrical insulation must be verified separately.
Small tears are generally not a problem as long as they do not leave a gap after installation. Avoid creases and overlaps, as they can change the mounting height.
Color: pink
Degree of hardness: Shore 00-60
Electrically insulating: Yes(8KV/mm ASTM D149)
Flammability: V-0
Operating temperature: -100°C to +250°C
Size: 30 x 30 mm
Thickness: 2 mm

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