Thermal Grizzly - cutting edge thermal compound products from Germany!
"Thermal compound products are the weakest link in transferring heat between component and heat sink. Our goal is to eliminate this weak point. We had the idea to do this by using high performance thermal compound products for several years now", says Eike Salow, computer scientist and founder of Thermal Grizzly.
"We know about the very high expectations of the evergrowing overclocker scene regarding high performance cooling solutions - and we strive to exceed them. To emphasize this claim, we worked closely with extreme overclocker Roman "der8auer" Hartung during development."
The Conductonaut Extreme liquid metal thermal compound is the further development of Conductonaut and was developed for applications with maximum power density. As a gallium-based liquid metal, Conductonaut Extreme is a metallic alloy that is liquid at room temperature, allowing for the minimum possible layer thickness.
- Optimised thermal conductivity compared to conventional liquid metal
- Increased material compatibility
- Optimum application due to metal needle
- Available in 1g or 5g syringes
- Attention: Electrically conductive!
- Do not bring into contact with aluminium!
Thermal Grizzly Carbonaut high-tech carbon thermal pads can be used as an excellent alternative to mid-range thermal compounds. They have the exclusive advantage of being reusable, with a very elastic and adaptable surface and very high thermal conductivity. Even the slightest unevenness can be compensated very well.
- Maximum thermal conductivity
- Constantly high performance
- Reusable
- Does not dry out
- Flexible and easy to use
Thermal Grizzly Kryonaut Extreme is based on our well known Kryonaut paste. For Kryonaut Extreme the maximum thermal conductivity was accomplished due to the smallest particle size, thinner minimum layer height and improved low temperature application.
- designed for Overclocking
- no curing
- long-term durability
The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.
This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.
- Outstanding thermal conductivity
- Easy to use
- Consistently high performance
- Extreme durability
- Attention: Electrically conductive! Follow instructions!
The minus pad extreme thermal pad is silicone based with modelling clay like consistency. This allows a perfect surface shaping with maximum possible compression. The minus pad extreme is electrically insulating.
Due to the consistency only one-time use is recommended. The thermal conductivity was improved by about 260 % over the minus pad 8 which allows best cooling for tough cooling operations such as voltage regulators and memory ICs.
- Most excellent thermal conductivity
- No bleeding
- long-term stability
- high compression rate
The AM5 High Performance Heatspreader is an upgrade heatspreader for AMD's Ryzen 7000 processors. The nickel-plated copper heatspreader features a 240 percent larger diamond-milled precision surface. This increased surface area over the original heatspreader allows for maximum heat dissipation with air and water coolers, while precision milling ensures extremely low surface roughness for best contact with the heat sink.
- Replaces SAM and heatspreader
- 240% larger surface area (22 cm²)
- Made of nickel-plated copper
- Precision diamond milled surface
- Compatible with air and water coolers
- Only for delidded CPUs!
The AM5 Mycro Direct-Die RGB is a water cooler for AMD's Ryzen 7000 processors that sits directly on the chiplets of a delidded CPU. Made of nickel-plated copper, the Direct-Die water cooler offers outstanding thermal conductivity. This is further increased by an optimized structure of the microfins on the top. In addition, compared to normal water cooling, direct-die cooling eliminates the need for a layer of thermal conductive material as well as the CPU's heatspreader. This significantly improves the heat transfer from the CPU to the water cooling circuit.
Visually, the AM5 Mycro Direct-Die RGB offers a stylish appearance. On the nickel-plated base plate is a block of acrylic glass, which is subjected to a annealing process after milling. The annealing process removes internal surface stresses from the acrylic. This ensures that no stress cracks form in the acrylic glass even after a long period of use.
A cover made of anodized aluminum is magnetically attached to this. 13 RGB LEDs integrated into the cover illuminate the side acrylic glass and the G1/4-inch threads. The cover can be mounted so that the RGB connection cable can be routed up or down. The RGB lighting is connected via a 3-pin ARGB header (+5V/DATA/GND).
The AM5 Mycro Direct-Die is a water cooler for AMD's Ryzen 7000 processors that sits directly on the chiplets of a delidded CPU. Made of nickel-plated copper, the Direct-Die water cooler offers outstanding thermal conductivity. This is further increased by an optimized structure of the microfins on the top. In addition, compared to a normal water cooler, Direct-Die cooling eliminates a layer of thermal conductive material as well as the CPU's heatspreader. This significantly improves the heat transfer from the CPU to the water cooling circuit. The top part of the AM5 Mycro Direct-Die is made of CNC-machined polyoxymethylene (POM) and is equipped with one inlet and outlet each in the form of G1/4-inch threads.
The WireView GPU is a device for measuring the power consumption of graphics cards that was developed in collaboration with Jon "elmor" Sandström It is plugged into the PCIe power connectors of the graphics card and connected to the power supply unit via the PCIe power cables. The power consumption data is displayed via an OLED display.
At the same time, the WireView GPU takes on a cable management function, as its "U"shape enables optimised routing of the cables. The PCIe power cables are connected to the WireView GPU in such a way that they can be laid neatly over the backplate of the graphics card. This avoids cable bulges when routing the power cables and simplifies cable management.
- Measuring power consumption
- Logging of power consumption
- Optimised cable routing
- Easy mounting
- High compatibility
The Delid-Die-Mate Intel 13th/14th Gen is a tool for removing the heat spreader ("delidden") on Intel processors for socket LGA1700. By removing the heat spreader, the CPUs can be cooled via "direct die", for example. With the so-called "direct die", the CPU cooler is mounted directly on the processor chip. By omitting the heat spreader in the cooling circuit, a significantly optimised heat transfer from the die to the CPU cooler is possible.
- Compatible with 12th/13th/14th Intel Core generation
- Delidding tool
- Made of aluminium
The lapping tool for Intel's 13th/14th Gen processors allows the heat spreader to be safely lapped. The CPU is simply mounted on the lapping tool using the enclosed screws. The tolerances of the lapping tool allow the heat spreader to be ground down by 0.2 millimetres. The 13th Gen Lapping Tool is compatible with Intel 12th Generation Core CPUs. Sandpaper in grit sizes 400, 1200 and 2,500 is included.
- Simplifies CPU sanding
- For Intel Core 13th/14th Gen (Compatible with 12th Gen)
- CNC-milled acrylic glass
- Complete set with sandpaper
- Single use recommended
With the Intel 13th/14th Gen CPU Contact Frame by der8auer we have updated the well-known mounting aid for Intel mainboards with socket LGA1700. Compared to its predecessor, the assembly of the frame has been significantly simplified by utilising a revised inner contour. For example, there is no longer any need to use a specific torque during assembly.
The Contact Frame was designed in collaboration with Roman "der8auer" Hartung and is manufactured in Berlin - 100% Made in Germany. Roman Hartung is a mechatronic engineer, hardware enthusiast and content creator in the field of PC hardware. At the same time, he is a well-known overclocker who has designed numerous products for overclocking PC hardware.
The Ryzen 7000 Delid-Die-Mate is a tool for removing the heat spreaders ("delidding") on AMD Ryzen 7000 processors. By removing the heat spreader, the CPUs can be cooled via "Direct Die", for example. With the so-called "Direct Die" method, the CPU cooler is mounted directly on the CPU dies and the I/O die of the processor. By omitting the heat spreader in the cooling circuit, a significantly optimised heat transfer from the die to the CPU cooler is possible.
The Ryzen 7000 Lapping Tool was developed for grinding the heat spreaders of the AM5 processor series from AMD. The tolerances of the Ryzen 7000 Lapping Tool allow gradual grinding of the heat spreader by 0.4 millimetres, up to a total height of 1.6 millimetres. When using the normal AMD mounting frame (SAM), a maximum sanding of 1.0 mm is provided until the middle steps are reached. A further 0.6 mm is only possible if the CPU is mounted e.g. with a suitable AM5 Contact Frame (product to follow shortly). The steps of the AM5 Lapping Tool are diamond-milled to achieve a high degree of transparency. This makes it visible during grinding which steps have already been reached and which have not.
- Simplifies the grinding of the AM5 CPU
- CNC-milled acrylic glass
- Complete set with sandpaper
- One-time use
The practical AM5 Adapter & Offset Mounting Kit for AMD‘s socket AM5 motherboards includes cooler brackets for offset mounting of the CPU as well as adapter screws from UNC 6-32 to M3 and M4 threads
respectively.
With the 12th Gen CPU Contact Frame by der8auer, Thermal Grizzly provides an assembly aid for Intel mainboards with the LGA1700 socket. The contact frame replaces the mainboards stock ILM to improve the cooling performance of CPU coolers through optimized contact pressure.
The Contact Frame was designed in collaboration with Roman “der8auer” Hartung and is manufactured in Berlin - 100% Made in Germany. Roman Hartung is a mechatronics engineer, hardware enthusiast and content creator in the field of PC hardware. At the same time, he is a well-known overclocker who has already designed numerous products for overclocking PC hardware.
The AMD Ryzen 7000 Direct Die Frame is a CPU mounting frame for mounting Ryzen 7000* processors without the integrated heat spreader. By omitting the heat spreader, the CPU cooler can be mounted directly on the processor's chiplets, allowing for significantly lower temperatures during operation. This is not only interesting for extreme overclockers on the hunt for records, but also for gamers and content creators.
The AMD Ryzen 7000 CPU Guard is a foam gasket that protects the processor from liquid metal and thermal paste. With the Ryzen 7000 series, AMD changed the shape of the heat spreaders of its CPUs and provided them with cut outs under which components like SMDs are exposed. Additionally, the heat spreader does not close with the CPU package at these cut outs, so thermal paste or liquid metal can get into this area.
The AM5 M4 backplate is an optional mounting plate that replaces the original AM5 backplate. Some CPU coolers use a mounting kit that comes with M4 threaded screws. These are not compatible with the UNC 6-32 thread used on the AM5 backplate. With the AM5 M4 backplate, appropriate CPU coolers, especially AiO watercoolers, can be used.
The AM5 Short Backplate is a shortened mounting plate that replaces the original AM5 backplate. Some CPU coolers compatible with the AM4 socket use a custom retention kit for mounting. Since the AM4 backplate is primarily used for mounting coolers, omitting this backplate is generally not a problem.
