Thermal Grizzly - cutting edge thermal compound products from Germany!
"Thermal compound products are the weakest link in transferring heat between component and heat sink. Our goal is to eliminate this weak point. We had the idea to do this by using high performance thermal compound products for several years now", says Eike Salow, computer scientist and founder of Thermal Grizzly.
"We know about the very high expectations of the evergrowing overclocker scene regarding high performance cooling solutions - and we strive to exceed them. To emphasize this claim, we worked closely with extreme overclocker Roman "der8auer" Hartung during development."
Thermal Grizzly Carbonaut high-tech carbon thermal pads can be used as an excellent alternative to mid-range thermal compounds. They have the exclusive advantage of being reusable, with a very elastic and adaptable surface and very high thermal conductivity. Even the slightest unevenness can be compensated very well.
- Maximum thermal conductivity
- Constantly high performance
- Reusable
- Does not dry out
- Flexible and easy to use
Thermal Grizzly Kryonaut Extreme is based on our well known Kryonaut paste. For Kryonaut Extreme the maximum thermal conductivity was accomplished due to the smallest particle size, thinner minimum layer height and improved low temperature application.
- designed for Overclocking
- 14,2 W/m*K thermal conductivity
- no curing
- long-term durability
The minus pad extreme thermal pad is silicone based with modelling clay like consistency. This allows a perfect surface shaping with maximum possible compression. The minus pad extreme is electrically insulating.
Due to the consistency only one-time use is recommended. The thermal conductivity was improved by about 260 % over the minus pad 8 which allows best cooling for tough cooling operations such as voltage regulators and memory ICs.
- Most excellent thermal conductivity
- No bleeding
- long-term stability
- high compression rate
The Ryzen 7000 Delid-Die-Mate is a tool for removing the heat spreaders ("delidding") on AMD Ryzen 7000 processors. By removing the heat spreader, the CPUs can be cooled via "Direct Die", for example. With the so-called "Direct Die" method, the CPU cooler is mounted directly on the CPU dies and the I/O die of the processor. By omitting the heat spreader in the cooling circuit, a significantly optimised heat transfer from the die to the CPU cooler is possible.
With the 12th Gen CPU Contact Frame by der8auer, Thermal Grizzly provides an assembly aid for Intel mainboards with the LGA1700 socket. The contact frame replaces the mainboards stock ILM to improve the cooling performance of CPU coolers through optimized contact pressure.
The Contact Frame was designed in collaboration with Roman “der8auer” Hartung and is manufactured in Berlin - 100% Made in Germany. Roman Hartung is a mechatronics engineer, hardware enthusiast and content creator in the field of PC hardware. At the same time, he is a well-known overclocker who has already designed numerous products for overclocking PC hardware.
The AMD Ryzen 7000 Direct Die Frame is a CPU mounting frame for mounting Ryzen 7000 processors without the integrated heat spreader. By omitting the heat spreader, the CPU cooler can be mounted directly on the processor's chiplets, allowing for significantly lower temperatures during operation. This is not only interesting for extreme overclockers on the hunt for records, but also for gamers and content creators.
The AMD Ryzen 7000 CPU Guard is a foam gasket that protects the processor from liquid metal and thermal paste. With the Ryzen 7000 series, AMD changed the shape of the heat spreaders of its CPUs and provided them with cut outs under which components like SMDs are exposed. Additionally, the heat spreader does not close with the CPU package at these cut outs, so thermal paste or liquid metal can get into this area.
The AM5 M4 backplate is an optional mounting plate that replaces the original AM5 backplate. Some CPU coolers use a mounting kit that comes with M4 threaded screws. These are not compatible with the UNC 6-32 thread used on the AM5 backplate. With the AM5 M4 backplate, appropriate CPU coolers, especially AiO watercoolers, can be used.
The AM5 Short Backplate is a shortened mounting plate that replaces the original AM5 backplate. Some CPU coolers compatible with the AM4 socket use a custom retention kit for mounting. Since the AM4 backplate is primarily used for mounting coolers, omitting this backplate is generally not a problem.
The 12th Gen Lapping-Tool is specially designed for the Intel 12th Gen Contact Frame and simplifies the process of lapping the processor. Using the enclosed screws, the CPU is simply mounted on the Lapping-Tool with the Contact Frame. This simulates the actual final position of the CPU in the socket on the motherboard.
The Thermal Grizzly M.2 SSD Cooler is a passive cooling solution for next generation form factor SSDs. It's no secret that modern M.2 NVMe SSDs, in particular, get hot when in demanding use, so the speed of the drive has to be slowed down. To counteract this problem and get full performance, the Grizzly professionals have developed a compact passive cooler that significantly reduces the temperatures of an M.2 SSD.
The Thermal Grizzly M.2 SSD Cooler at a glance
- Black Passive Cooler for M.2 SSDs
- lower temperatures to reduce speed limitations
- Compatible with one-sided M.2 NVMe SSDs (2280)
- Easy installation
Thermal Grizzly TG Shield is a high temperature conformal coating to protect components from liquid metal short circuits.
Thermal Grizzly TG Remove is an acetone based nano-cleaner for the best cleaning results of thermal paste. In addition TG Remove has a degreasing effect which helps preparing the surface for new application e. g. on CPUs.
Thermal Grizzly offers the perfect solution for this requirement with the PCIe 4.0 x16 30cm TG Riser Cable.
