LATEST NEWS

Update: HEATSPREADER & MYCRO DIRECT DIE FOR INTEL CPUS

Due to customer feedback, we have temporarily discontinued the sale of the Intel High Performance Heatspreader V1 and the Intel Mycro Direct-Die V1! We will keep you informed about further developments on this topic!

RYZEN DIRECT DIE FRAMES V2: HOW THE DDF IS MADE

With this blog post on the release of the Direct Die Frame V2, we would like to provide an insight into production at Thermal Grizzly. We will show the individual production steps of the Ryzen Direct Die Frame V2 and also discuss quality control. This is carried out during operation so that we can react in real time to any problems that may arise. The new Ryzen Direct Die Frame V2 will be available in the next few weeks and will extend the compatibility of the DDF to include the Ryzen 7000X3D CPUs.

LATEST PRODUCTS

Intel Mycro Direct-Die V1

The Intel Mycro Direct Die V1 is a water cooler for Intel processors that is placed directly on the CPU die of a delidded CPU. Made of nickel-plated copper, the direct-die water cooler offers outstanding thermal conductivity. This is further enhanced by the optimized structure of the microfins on the top.

Intel HEATSPREADER

The Intel High Performance Heatspreader V1 is an upgrade heatspreader for Intel processors. The nickel-plated copper heatspreader has a 207 percent larger, diamond-milled precision surface. This increased surface area compared to the original heatspreader enables maximum heat dissipation for air and water coolers.

Ryzen Direct Die Frame V2

The Ryzen 7000 Direct Die Frame V2 is an updated version of the CPU mounting frame, specially developed for increased compatibility with AMD AM5 CPUs, including the Ryzen 7000X3D processors. This frame allows for the mounting of delidded CPUs without an integrated heatspreader and provides a simplified installation. Made from robust, anodized aluminum.

HOW DO YOU LIKE THE NEW THERMAL GRIZZLY ONLINE STORE?

We are looking forward to your feedback!