The minus pad extreme thermal pad is silicone based with modelling clay like consistency. This allows a perfect surface shaping with maximum possible compression. The minus pad extreme is electrically insulating.

Due to the consistency only one-time use is recommended. The thermal conductivity was improved by about 260 % over the minus pad 8 which allows best cooling for tough cooling operations such as voltage regulators and memory ICs. 

  • Most excellent thermal conductivity
  • No bleeding
  • long-term stability
  • high compression rate
Application Rating
Thermal Conductivity¹ *****
Sub-Zero Overclocking *
Overclocking ****
Water Cooling *****
Air Cooling *****

¹ within the capabilities of thermal pads 

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm.

Hardness Shore 00 - 65
Thickness 0,5–3,0 mm
Typical thickness tolerance ± 0,1 mm
Flammability V-0
Electically insulating Ja (8 KV/mm ASTM D149)
Density 3.38 g/cm³
Temperature Range -100 °C / +200 °C


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