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Product information "TG Scraper"

Made from acrylic, the TG Scraper features a narrow tip specifically developed to remove, for example, silicone adhesive from the package (PCB) of a delidded processor or residual indium solder from the CPU dies. The ergonomic design ensures a firm and secure grip during use.

Scope of Delivery

  • 3x TG Scraper


Note

Careful and precise handling of the TG Scraper is essential to avoid damaging small electronic components on the CPU package or the dies.

When removing indium solder from the die(s), it is recommended to first gently scrape the surface with the TG Scraper, then clean remaining solder residue from the die surfaces using liquid metal.

Anwendungsbeispiel TG Scraper

TG Scraper

TG Scraper helps gently remove adhesive residue and indium from CPUs during delidding. Work on a stable surface using light pressure and a shallow angle. Do not press on die edges or small SMD components, and do not try to forcefully pry off hard solder residue. Avoid steep angles on the PCB surface, as this can cause scratches.