Heatspreader
Product information "Intel High Performance Heatspreader V1"
The Intel High Performance Heatspreader V1 is an upgrade heatspreader for Intel processors. The nickel-plated copper heatspreader has a 207 percent larger, diamond-milled precision surface. This increased surface area compared to the original heatspreader enables maximum heat dissipation for air and water coolers, while the precision milling ensures extremely low surface roughness for the best contact with the heat sink.
The nickel-plated surface of the Intel High Performance Heatspreader V1 is compatible with traditional thermal pastes and gallium-based liquid metals. The nickel forms a barrier layer between the liquid metal and the copper cooler so that liquid metal does not diffuse into the copper and alloy formation is minimized. This means that multiple applications of liquid metal are generally not necessary.
For the best possible temperatures under load, we recommend using liquid metal as a thermal interface material (TIM) between the CPU (CPU tiles/CPU chiplets) and the high-performance heatspreader.
properties
- Replaces ILM and heatspreader
- 207% larger surface area
- Made from nickel-plated copper
- Diamond-milled precision surface
- Compatible with air and water coolers
- CPU compatibility list available online
- Only for delidded CPUs! Attention: Loss of warranty!
Replaces ILM and heatspreader
207% larger surface area
enables maximum heat dissipation
Compatible with air and water coolers
Attention:
Removing the heatspreader (“delidding”) of a processor is at your own risk! The manufacturer's warranty expires when the CPU is delidded! Damage caused by delidding the CPU is not covered by the manufacturer's warranty!
Removing the Integrated Loading Mechanism (ILM) of the mainboard may invalidate the manufacturer's warranty of the mainboard manufacturer!
Scope of delivery
- 1x Intel High Performance Heatspreader V1
- 4x pan-head screws UNC thread 3/8"
- 1x hexagon socket wrench 5/64"
- 1x angle wrench Torx T20
Compatibility
The Intel High Performance Heatspreader V1 is compatible with the following processors:
- Intel 12th Gen CPUs
- Intel 13th Gen CPUs
- Intel 14th Gen CPUs
Note on use with Kapton Insulation Sheets, Carbonaut, and KryoSheet
A thin layer of TG Shield should be used to insulate electronic components. The internal contour of the High Performance Heatspreader (HPHS) is optimized for the use of liquid metal, which can be applied in a very thin layer. The HPHS rests directly on the CPU package (PCB). When Kapton Insulation Sheets are used, there is a risk that the CPU die may not make contact with the HPHS if the HPHS rests on the Kapton Insulation Sheet and the resulting height difference between the CPU die and the HPHS becomes too large.
When thermal sheets such as Carbonaut and KryoSheet are used between the CPU die and the HPHS, the small height difference between the CPU die and the HPHS may result in excessive mounting pressure being applied to the CPU. This can cause operational issues, which may include incorrect memory detection or memory instability.
Note on the use of KryoSheet and monoblocks
The Intel High Performance Heatspreader V1 has been extensively tested internally in various usage scenarios. During development, particular emphasis was placed on stable operation of the processor and memory. In our test series, KryoSheet used as a TIM between the CPU die and the Intel High Performance Heatspreader V1 did not achieve any significant temperature improvements and proved problematic with regard to contact pressure.
For this reason, we cannot recommend thermal sheets, as their additional thickness can significantly affect contact pressure and thereby impair functionality.
When using monoblocks for the motherboard, the mounting height and thermal pads may need to be adjusted. It is important to check whether sufficient contact exists between the Intel High Performance Heatspreader V1 and the monoblock. For any questions, Thermal Grizzly Support can be contacted at any time.
| Color: | Silver nickel-plated |
|---|---|
| Material: | nickel-plated copper |
| Socket manufacturer: | Intel |
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