Thermal Grizzly AM5 High Performance Heatspreader

Heatspreader

The diamond-milled precision surface of the Intel High Performance Heatspreader V1 offers a 207% larger contact surface for CPU coolers. The nickel-plated copper cooler replaces the standard heatspreader of the CPU and the Integrated Loading Mechanism (ILM) of the mainboard and can only be used with delidded processors. Please follow all the instructions below!

$64.23

Content: 1 pieces

CPU Type

AM5

Intel

piece

EAN: 4260711990991 Copied!

MPN: TG-HPHS-i-V1 Copied!

Product information "Intel High Performance Heatspreader V1"

The Intel High Performance Heatspreader V1 is an upgrade heatspreader for Intel processors. The nickel-plated copper heatspreader has a 207 percent larger, diamond-milled precision surface. This increased surface area compared to the original heatspreader enables maximum heat dissipation for air and water coolers, while the precision milling ensures extremely low surface roughness for the best contact with the heat sink.

The nickel-plated surface of the Intel High Performance Heatspreader V1 is compatible with traditional thermal pastes and gallium-based liquid metals. The nickel forms a barrier layer between the liquid metal and the copper cooler so that liquid metal does not diffuse into the copper and alloy formation is minimized. This means that multiple applications of liquid metal are generally not necessary.

For the best possible temperatures under load, we recommend using liquid metal as a thermal interface material (TIM) between the CPU (CPU tiles/CPU chiplets) and the high-performance heatspreader.

properties

Replaces ILM and heatspreader
207% larger surface area
Made from nickel-plated copper
Diamond-milled precision surface
Compatible with air and water coolers
CPU compatibility list available online
Only for delidded CPUs! Attention: Loss of warranty!

Attention

Removing the heatspreader (“delidding”) of a processor is at your own risk!

The manufacturer's warranty expires when the CPU is delidded!

Damage caused by delidding the CPU is not covered by the manufacturer's warranty!

Removing the Integrated Loading Mechanism (ILM) of the mainboard may invalidate the manufacturer's warranty of the mainboard manufacturer!

Replaces ILM and heatspreader

207% larger surface area

enables maximum heat dissipation

Compatible with air and water coolers

Scope of delivery

1x Intel High Performance Heatspreader V1
4x pan-head screws UNC thread 3/8"
1x hexagon socket wrench 5/64"
1x angle wrench Torx T20

Compatibility

The Intel High Performance Heatspreader V1 is compatible with the following processors:

Intel 12th Gen CPUs
Intel 13th Gen CPUs
Intel 14th Gen CPUs

Note on use with Kapton Insulation Sheets, Carbonaut, and KryoSheet

A thin layer of TG Shield should be used to insulate electronic components. The internal contour of the High Performance Heatspreader (HPHS) is optimized for the use of liquid metal, which can be applied in a very thin layer. The HPHS rests directly on the CPU package (PCB). When Kapton Insulation Sheets are used, there is a risk that the CPU die may not make contact with the HPHS if the HPHS rests on the Kapton Insulation Sheet and the resulting height difference between the CPU die and the HPHS becomes too large.

When thermal sheets such as Carbonaut and KryoSheet are used between the CPU die and the HPHS, the small height difference between the CPU die and the HPHS may result in excessive mounting pressure being applied to the CPU. This can cause operational issues, which may include incorrect memory detection or memory instability.

Note on the use of KryoSheet and monoblocks

The Intel High Performance Heatspreader V1 has been extensively tested internally in various usage scenarios. During development, particular emphasis was placed on stable operation of the processor and memory. In our test series, KryoSheet used as a TIM between the CPU die and the Intel High Performance Heatspreader V1 did not achieve any significant temperature improvements and proved problematic with regard to contact pressure.

For this reason, we cannot recommend thermal sheets, as their additional thickness can significantly affect contact pressure and thereby impair functionality.

When using monoblocks for the motherboard, the mounting height and thermal pads may need to be adjusted. It is important to check whether sufficient contact exists between the Intel High Performance Heatspreader V1 and the monoblock. For any questions, Thermal Grizzly Support can be contacted at any time.

Intel HP Heatspreader V1

Which cooler mounting hardware, backplate and additional frames do I need for Intel High Performance Heatspreader V1?

On compatible delidded LGA1700 CPUs, the Intel High Performance Heatspreader V1 replaces both the original heatspreader and the motherboard’s ILM. It allows you to use a suitable air cooler or AIO. An additional contact frame or direct-die frame is not required, as the HPHS holds the CPU in place. Use the LGA1700 mounting hardware supplied with your cooler and its backplate, if applicable. Check that the cooler can reach the required mounting height and makes full contact with the HPHS. Do not force the installation by arbitrarily shortening screws or adding washers. If you are unsure about a combination, send us the exact cooler and motherboard models along with photos of the mounting hardware.

Which CPUs is Intel High Performance Heatspreader V1 designed for, and how does it replace the original heatspreader?

The Intel High Performance Heatspreader V1 is approved for delidded 12th, 13th and 14th generation Intel Core desktop CPUs on LGA1700. It replaces both the original heatspreader and the motherboard’s ILM. It is not an accessory for LGA1851 or LGA1954. The cooler and its mounting hardware must accommodate the changed mounting height. Before installation, check the current compatibility list and the available clearance on your motherboard.

Which thermal interface material is suitable for Intel High Performance Heatspreader V1, and how is it applied?

We recommend a very thin, even layer of liquid metal, such as Conductonaut, between the exposed CPU die and the Intel High Performance Heatspreader V1. Protect the surrounding SMD components with a thin layer of TG Shield and prevent any contact between the liquid metal and electrically conductive components. On the outer surface between the HPHS and the cooler, you can use a thermal interface material suitable for both contact surfaces, such as thermal paste or KryoSheet. KryoSheet and Carbonaut are not recommended underneath the Intel HPHS because their additional thickness changes the mounting pressure. Additional insulating layers must not raise the HPHS.

How do I install Intel High Performance Heatspreader V1, and what screw tightening sequence, mounting force or torque specification applies?

Install the Intel High Performance Heatspreader V1 according to the instructions with the system switched off and disconnected from power. Lay the motherboard flat and support any loose backplate. Place the CPU in the socket and apply the thermal interface material to the CPU die. We specifically recommend liquid metal here. Use only the specified screws and start them loosely. Tighten them evenly and gradually in a cross pattern as instructed to avoid uneven loading of the CPU die. Then install the CPU cooler using its appropriate mounting hardware. The tightening instructions for the HPHS and the cooler may differ. An incorrect mounting gap cannot be corrected by tightening the screws further.

Will Intel High Performance Heatspreader V1 fit my motherboard, and could it interfere with any components?

When checking the fit of the Intel High Performance Heatspreader V1, consider not only the socket but also the exact motherboard revision, the components around the socket and the cooler mounting hardware. Particularly compact motherboards may have clearance conflicts even when the socket is compatible. Compare the dimensioned drawing with your setup. If you are unsure, send us the full motherboard model and photos of the socket area from above and the rear of the motherboard.

Why are temperatures with Intel High Performance Heatspreader V1 too high or higher than expected?

First check that the CPU die makes full contact with the Intel High Performance Heatspreader V1 and that the HPHS makes full contact with the cooler. Insufficient contact at either interface can cause high temperatures. Check the mounting height, screw set, even seating and the contact pattern of the thermal interface material. If contact is incomplete, correct the mounting setup instead of simply tightening the screws further. Then check the fans or pump, coolant flow and power draw. Compare temperatures under the same load and at the same room temperature. Due to CPU boost behaviour, better cooling may also result in higher performance.

Why does my PC fail to boot or detect the RAM after installing Intel High Performance Heatspreader V1?

Switch off the system and disconnect it from power. Check that the CPU, Intel High Performance Heatspreader V1 and cooler are seated correctly and that the screws have been tightened evenly according to the instructions. An incorrect mounting gap or uneven pressure can affect socket contact and RAM detection. Do not install an additional contact frame underneath the HPHS. Also check BIOS support for the CPU and RAM, visible contamination and, if in doubt, the socket for bent pins. If the socket or die is damaged, do not run further tests. Instead, send us photos and the full system specifications.

What are the dimensions, threads or connection spacings of Intel High Performance Heatspreader V1?

The definitive dimensions, threads and mounting distances for the Intel High Performance Heatspreader V1 are provided in the technical drawing or instructions for the specific revision. Also check the cooler height and the clearance around the socket to confirm the fit. Do not apply nominal dimensions from other versions. If a required dimension is missing, send us the part number and identify the exact area of interference.

What is included with Intel High Performance Heatspreader V1, and how can I obtain missing parts?

The Intel High Performance Heatspreader V1 includes the heatspreader, four 3/8-inch-long button-head screws with UNC threads, a 5/64-inch hex key and a Torx T20 key. If any parts are missing or you need replacements, send us the part number, proof of purchase and a photo of the accessories you received. We will check the availability of suitable replacement parts. Do not use unverified screws or spacers from other products.

How do I prevent damage or the CPU falling out when removing Intel High Performance Heatspreader V1?

Lay the motherboard flat and remove the CPU cooler first. Then loosen the Intel High Performance Heatspreader V1 mounting screws gradually in a cross pattern. Lift the heatspreader slowly and vertically, checking whether the CPU is sticking to its underside. If it is, secure the CPU against falling out and carefully turn the heatspreader over once there is enough clearance. Remove the CPU without tilting or levering against the edges of the exposed die. Clean the contact surfaces using a method suitable for the thermal interface material used.

Downloads "Heatspreader"

Color:	Silver nickel-plated
Material:	nickel-plated copper
Socket manufacturer:	Intel

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