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Product information " Minus Pad Basic"

The electrically non-conductive Minus Pad Basic thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

Properties

  • Good thermal conductivity
  • Lower compressibility
  • Easy to use
  • Electrically non-conductive
  • Excellent price-performance ratio
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Comparison of the Minus Pad Basic, Advance, and Pro series

  • Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.
  • Minus Pad Advance: Improved thermal conductivity, higher compressibility.
  • Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher price.

Available in dimensions of 120 x 20 mm and 100 x 100 mm, as well as in thicknesses of 0.5 mm, 1 mm, 1.5 mm, 2 mm, and 3 mm.

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Good thermal conductivity

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Easy to use

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Electrically non-conductive

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Excellent price-performance ratio

Comparison table Pads

Minus Pad Basic

Choose the thickness of Minus Pad Basic according to the specific cooler's requirements or the actual gap and compression behavior. There is no universal pad thickness for a GPU, VRAM or SSD model. A pad that is too thin makes no contact, while one that is too thick can lift the cooler off the main chip. Compression depends on the original thickness, area and mounting pressure. Check the contact imprint and follow the mounting instructions. An incorrect thickness cannot be compensated for by tightening further. External databases such as paddb.com can provide guidance on the pad thickness needed for your graphics card. You can measure used pads with a caliper such as TG Caliper. The area measured may already be compressed. The measurement is therefore only a guide, and the required original thickness may be greater.
Install Minus Pad Basic on clean contact surfaces without additional thermal paste or liquid metal. At the same time, the main CPU/GPU chip can use the other thermal interface material intended for it. In that case, the materials are used at different contact points. Pads can be stacked, but cooling performance may decrease slightly. Make sure the total pad thickness matches the available gap.
Minus Pad Basic bridges gaps between components and the cooler. Cooling performance depends on pad thickness, compression and full contact. The Minus Pad series differ in heat transfer and deformability. Therefore, check thickness and contact again when switching series. Minus Pad Basic is the affordable entry-level option for applications with lower performance requirements. Minus Pad Advance offers higher performance, with Minus Pad 8 positioned above it. Minus Pad Pro offers very good performance. Minus Pad extreme and Minus Pad extreme 2 form the highest-performing group.
Cut Minus Pad Basic to size with sharp scissors or a blade on a clean surface. If possible, leave the protective films on the material when cutting it. First remove one film and position the pad on the contact surface. Only then peel off the second film, so the pad deforms less while being positioned. Both films must be removed before fitting the cooler. The intended component area should be fully covered without obstructing adjacent mechanical contact points.
Downloads "Minus Pad Basic"
Color: black
Size: 120 x 20 mm
Thickness: 2 mm

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