Skip to main content Skip to search Skip to main navigation

Product information "minus pad extreme"

The minus pad extreme thermal pad is silicone based with modelling clay like consistency. This allows a perfect surface shaping with maximum possible compression. 


overclocking_TG
Optimized for overclocking

thermal_conductivity_TG
Most excellent thermal conductivity

no_hardening_TG
No curing

electrically_non-conductive_TG
Electrically non-conductive

MPE_Matrix_US

usage

Due to the consistency only one-time use is recommended. The thermal conductivity was improved by about 260 % over the minus pad 8 which allows best cooling for tough cooling operations such as voltage regulators and memory ICs.

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm.

Product information "minus pad extreme"

The minus pad extreme thermal pad is silicone based with modelling clay like consistency. This allows a perfect surface shaping with maximum possible compression. 


overclocking_TG
Optimized for overclocking

thermal_conductivity_TG
Most excellent thermal conductivity

no_hardening_TG
No curing

electrically_non-conductive_TG
Electrically non-conductive

MPE_Matrix_US

usage

Due to the consistency only one-time use is recommended. The thermal conductivity was improved by about 260 % over the minus pad 8 which allows best cooling for tough cooling operations such as voltage regulators and memory ICs.

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm.

Color: blue, pink
Degree of hardness: Shore 00-65
Density: 3.38g/cm³
Electrically insulating: Yes(8KV/mm ASTM D149)
Flammability: V-0
Operating temperature: -100°C to +200°C
Size: 100 x 100 mm
Thickness: 3 mm
Typical height tolerance: ±0,1 mm