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Product information "minus pad extreme"

The minus pad extreme thermal pad is silicone based with modelling clay like consistency. This allows a perfect surface shaping with maximum possible compression. 


Gráfico de radar Minus Pad Extreme

usage

Due to the consistency only one-time use is recommended. The thermal conductivity was improved by about 260 % over the minus pad 8 which allows best cooling for tough cooling operations such as voltage regulators and memory ICs.

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm.

overclocking_TG
Optimized for overclocking

thermal_conductivity_TG
Most excellent thermal conductivity

no_hardening_TG
No curing

electrically_non-conductive_TG
Electrically non-conductive

Product information "minus pad extreme"

The minus pad extreme thermal pad is silicone based with modelling clay like consistency. This allows a perfect surface shaping with maximum possible compression. 


Gráfico de radar Minus Pad Extreme

usage

Due to the consistency only one-time use is recommended. The thermal conductivity was improved by about 260 % over the minus pad 8 which allows best cooling for tough cooling operations such as voltage regulators and memory ICs.

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm.

overclocking_TG
Optimized for overclocking

thermal_conductivity_TG
Most excellent thermal conductivity

no_hardening_TG
No curing

electrically_non-conductive_TG
Electrically non-conductive

Minus Pad extreme

Choose the thickness of Minus Pad extreme according to the specific cooler's requirements or the actual gap and compression behavior. There is no universal pad thickness for a GPU, VRAM or SSD model. A pad that is too thin makes no contact, while one that is too thick can lift the cooler off the main chip. Compression depends on the original thickness, area and mounting pressure. Check the contact imprint and follow the mounting instructions. An incorrect thickness cannot be compensated for by tightening further. External databases such as paddb.com can provide guidance on the pad thickness needed for your graphics card. You can measure used pads with a caliper such as TG Caliper. The area measured may already be compressed. The measurement is therefore only a guide, and the required original thickness may be greater.
Minus Pad extreme bridges gaps between components and the cooler. Cooling performance depends on pad thickness, compression and full contact. The Minus Pad series differ in heat transfer and deformability. Therefore, check thickness and contact again when switching series. Together with Minus Pad extreme 2, Minus Pad extreme is among the highest-performing Thermal Grizzly pads. Basic is the affordable entry-level option, while Advance offers higher performance than Basic. Minus Pad 8 ranks above Advance in performance, while Pro offers very good performance.
Minus Pad extreme is intended as a gap filler between components such as VRAM, voltage regulators or SSD components and their cooler. Choose thickness and dimensions according to the cooler's requirements and the actual gap. For the thin interface on a CPU heatspreader or CPU/GPU die, use the thermal interface material intended for that purpose. A Minus Pad is not a replacement there for paste, a liquid metal interface or a suitable sheet.
Install Minus Pad extreme on clean contact surfaces without additional thermal paste or liquid metal. At the same time, the main CPU/GPU chip can use the other thermal interface material intended for it. In that case, the materials are used at different contact points. Pads can be stacked, but cooling performance may decrease slightly. Make sure the total pad thickness matches the available gap.
The package contents of Minus Pad extreme depend on the selected size, thickness and pack quantity. Therefore, check the quantity listed for the specific item number. The films on the pads protect them during transport and application. First remove the film on the contact side, then remove the second film after positioning the pad and before installing the cooler. If the stated quantity is missing, send us proof of purchase and photos of the packaging and contents.
A fixed replacement interval for Minus Pad extreme is not generally necessary if it is correctly installed and left undisturbed. If temperatures rise, check that the pad still makes full contact at all intended points. Small tears during the initial installation are generally not a problem as long as they do not create a gap. However, due to the substantial plastic deformation, we recommend only one installation. Use a new pad after disassembly.
Available instructions, technical data sheets, safety data sheets and conformity documents for Minus Pad extreme can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
Check the position and thickness of Minus Pad extreme and the imprint on both contact sides. Remove all protective films and check whether an overly thick pad is lifting the cooler off the CPU/GPU die. Airflow or the liquid cooling loop must also be working properly. Do not increase mounting pressure beyond the permissible installation specification. A pad that is too thin may fail to contact the cooler, preventing heat from being transferred through the pad as intended.
Minus Pad extreme is not electrically conductive. Nevertheless, the pad must not obstruct sockets, connector contacts or moving parts, and it does not replace an insulator certified for mains or high voltage. For such a special application, the required electrical insulation must be verified separately.
Minus Pad extreme can be used in laptops for VRAM, VRMs or other contact areas designed to have a gap. The correct thickness and sufficient mounting pressure are essential. Particularly in laptops, pads that are too thick or too firm can lift the cooler. On CPU and GPU dies, use the thermal interface material intended for that purpose.
Cut Minus Pad extreme to size with sharp scissors or a blade on a clean surface. If possible, leave the protective films on the material when cutting it. First remove one film and position the pad on the contact surface. Only then peel off the second film, so the pad deforms less while being positioned. Both films must be removed before fitting the cooler. The intended component area should be fully covered without obstructing adjacent mechanical contact points.
Minus Pad extreme may adhere slightly, but it is not a mounting adhesive. A heatsink must be held in place by its intended mounting system. Position the pad on clean contact surfaces, fit the cooler without sliding it sideways, and tighten it according to its instructions.
Small tears are generally not a problem as long as they do not leave a gap after installation and the contact area remains fully covered. Avoid creases and overlaps, as they can change the mounting height. This statement applies to small tears during the initial installation. Due to the substantial plastic deformation, we recommend only one installation for Minus Pad extreme.
Minus Pad extreme can replace suitable thermal pads on memory, voltage regulators or other gap contact areas in a console. Follow the requirements of the specific console model for pad positions and thicknesses. A universal thickness in millimeters is not reliable. On the main chip, this type of pad is normally not a replacement for the intended paste or liquid metal interface.
Minus Pad extreme has an application temperature range of −100 to +200 °C and is not silicone-free. The temperature limits of the hardware being cooled and its mounting system also apply. Continuous industrial high-temperature applications require a separate assessment of material aging, pressure and contact. This temperature range applies to the original extreme version.
No. Minus Pad extreme is intended for larger gaps around components such as VRAM and VRMs. For direct contact with a CPU or GPU die, you need the thin thermal interface material specified for the cooler. An incorrect pad thickness can prevent other components from making contact or exert excessive forces on the die.
Color: blue, pink
Degree of hardness: Shore 00-65
Density: 3.38g/cm³
Electrically insulating: Yes(8KV/mm ASTM D149)
Flammability: V-0
Operating temperature: -100°C to +200°C
Size: 120 x 20 mm
Thickness: 1 mm
Typical height tolerance: ±0,1 mm

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