MINUS PAD High Compression
The Minus Pad High Compression thermal pads impress with their exceptionally high compressibility and very good thermal conductivity, offering performance comparable to the Minus Pad Advance.
A major advantage: the pads can be compressed significantly, meaning that a single material thickness is often sufficient to cover various components such as VRAM, voltage regulators, and other contact surfaces simultaneously. This is particularly practical when the exact height between the cooler and the component is unknown, since a precision of 0.5 mm is not critical in this case.
Ideal for GPU water block installations or when mounting graphics card coolers.
The electrically non-conductive pads are also excellently suited for use in notebooks, SSDs, and other sensitive electronic components such as voltage regulators and memory modules.
- Very high compressibility
- Very good thermal conductivity
- Electrically non-conductive
- Versatile use
- Easy handling
- Tolerant to height differences