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Product information "MINUS PAD High Compression"

The thermal pads of the TG Minus Pad High Compression series feature exceptionally high compressibility. This makes them especially versatile in practical use, as a single pad can bridge varying height differences simultaneously. This is particularly useful when modifying graphics cards with a GPU water cooler or when replacing the thermal pads of a GPU cooler. A TG Minus Pad High Compression (HC Pad) can be applied to different components - such as VRAM, voltage regulators, and other contact surfaces - within the same setup.

In general, High Compression pads are ideal in situations where the exact required thickness of thermal pads is unknown. In such cases, the thickness of the existing pads is measured and replaced with slightly thicker High Compression pads. It is particularly noteworthy that these pads not only maintain their thermal conductivity under high compression, but that the thermal conductivity can even increase with higher contact pressure.


Properties

  • Very high compressibility
  • Excellent thermal conductivity, even under heavy compression
  • Adapts well to height tolerances
  • Electrically non-conductive
  • Highly versatile in application
  • Easy to handle
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How to select the Appropriate Minus Pad High Compression

The thermal pads from the TG Minus Pad High Compression series should always be chosen with a thickness slightly greater than the measured height difference. At the same time, care must be taken not to use pads that are too thick. It must always be ensured that - on a graphics card, for instance - direct contact between the GPU chip and the corresponding cooler surface is maintained.

Based on the measured height of the thickest pad that is factory-installed on the cooler, an HC Pad should be selected that is at least one step thicker. For example, if the stock thermal pad is 2.4 mm thick, a 3 mm thick HC Pad should be used. As previously mentioned, it is important to verify that all critical components still maintain proper contact. An HC Pad should be as thin as possible, but as thick as necessary.

Compressing the pads requires a corresponding amount of contact pressure. In the case of GPU coolers (whether standard air coolers or GPU water blocks), there are usually a relatively high number of pressure points via screws in relation to the surface area, which generally ensures sufficient pressure. In contrast, laptops often only use four screws to secure the chassis, meaning there is minimal contact pressure in the center due to the large area and few pressure points. Therefore, thicker HC Pads should not be used in laptops. 

It is important to note that while TG Minus Pad High Compression pads are highly compressible, they are still subject to physical limitations. Excessive contact pressure can damage components. Additionally, when force is applied on the Z-axis (height), the pads will expand in the X and Y directions. Internal testing has shown that varying height differences can be seamlessly compensated - as long as sufficient contact pressure is applied and there is enough space for the HC Pads to expand.

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compressibility_TG
Very high compressibility

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Excellent thermal conductivity

electrically_non-conductive_TG
Electrically non-conductive

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Highly versatile in application

Comparison table Pads

Minus Pad High Compression

Choose the thickness of Minus Pad High Compression according to the cooler's requirements and the actual gap. The pad can be compressed particularly strongly. What matters is that it fully touches both contact surfaces after installation. A pad that is too thin makes no contact, while one that is too thick can lift the cooler off the main chip. Compression depends on the original thickness, area and mounting pressure. External databases such as paddb.com can provide guidance on pad thickness. You can measure used pads with a caliper such as TG Caliper. Already-compressed areas are only a guide. The required original thickness may be greater. Check the contact imprint and follow the mounting instructions. An incorrect thickness cannot be compensated for by tightening further.
Minus Pad High Compression bridges gaps between components and the cooler. Cooling performance depends on pad thickness, compression and full contact. This series is characterized by its very high compressibility. This allows the pad to adapt well to different component heights. The Minus Pad series differ in heat transfer and deformability. Choose the series according to the required cooling performance and installation conditions. Therefore, check thickness and contact again when switching series. Minus Pad High Compression ranks slightly above Minus Pad Advance in performance.
The package contents of Minus Pad High Compression depend on the selected size, thickness and pack quantity. Therefore, check the quantity listed for the specific item number. The films on the pads protect them during transport and application. First remove the film on the contact side, then remove the second film after positioning the pad and before installing the cooler. If the stated quantity is missing, send us proof of purchase and photos of the packaging and contents.
Install Minus Pad High Compression on clean contact surfaces without additional thermal paste or liquid metal. At the same time, the main CPU/GPU chip can use the other thermal interface material intended for it. In that case, the materials are used at different contact points. Pads can be stacked, but cooling performance may decrease slightly. Make sure the total pad thickness matches the available gap, and account for the particularly high compressibility during installation.
A fixed replacement interval for Minus Pad High Compression is not generally necessary. During maintenance or if temperatures rise, check that the pad is still clean and makes full contact at all intended points. Small tears alone do not require replacement as long as they do not create a gap. Replace pads that are contaminated or no longer make even contact due to damage or permanent deformation.
Available instructions, technical data sheets, safety data sheets and conformity documents for Minus Pad High Compression can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
Minus Pad High Compression is not electrically conductive. Nevertheless, the pad must not obstruct sockets, connector contacts or moving parts, and it does not replace an insulator certified for mains or high voltage. For such a special application, the required electrical insulation must be verified separately.
Minus Pad High Compression can be used in laptops for VRAM, VRMs or other contact areas designed to have a gap. Its particularly high compressibility allows it to adapt well to different component heights. The correct thickness and full contact after installation remain essential. Even a highly compressible pad should not be unnecessarily thick, as it could otherwise lift the cooler. Follow the device's mounting instructions. On CPU and GPU dies, use the thermal interface material intended for that purpose.
Minus Pad High Compression can replace suitable thermal pads on memory, voltage regulators or other gap contact areas in a console. Follow the requirements of the specific console model for pad positions and thicknesses. A universal thickness in millimeters is not reliable. On the main chip, this type of pad is normally not a replacement for the intended paste or liquid metal interface.
Check the position and thickness of Minus Pad High Compression and the imprint on both contact sides. Account for its particularly high compressibility and check that contact is maintained everywhere after installation. Remove all protective films and check whether an overly thick pad is lifting the cooler off the CPU/GPU die. A pad that is too thin may fail to contact the cooler, preventing heat from being transferred through the pad as intended. Airflow or the liquid cooling loop must also be working properly. Do not increase mounting pressure beyond the permissible installation specification.
If your Minus Pad High Compression package includes an authentication card, check the code on the official website printed on it. A missing code or different packaging alone does not prove that a product is counterfeit, as package contents and packaging can vary by product and batch. If the code is invalid, send us photos of the product, packaging, code and proof of purchase so we can check them. Whenever possible, buy from a retailer on our reseller list.
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