Skip to main content Skip to search Skip to main navigation

Product information " Minus Pad Pro"

The Thermal Grizzly Minus Pad Pro thermal pads are part of the Basic, Advance, and Pro series. The Pro pads offer extremely high thermal conductivity and outstanding compressibility - at a slightly higher price. 

The electrically non-conductive Minus Pad Pro thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

Properties

  • Excellent thermal conductivity
  • Outstanding compressibility
  • Easy to use
  • Electrically non-conductive
1-Content_MP-P_Matrix_US
2-Content_MP_Pro

Comparison of the Minus Pad Basic, Advance, and Pro series

  • Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.
  • Minus Pad Advance: Improved thermal conductivity, higher compressibility.
  • Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher price.

Available in dimensions of 120 x 20 mm and 100 x 100 mm, as well as in thicknesses of 0.5 mm, 1 mm, 1.5 mm, 2 mm, and 3 mm.

thermal_conductivity_TG
Excellent thermal conductivity

compressibility_TG
Outstanding compressibility

check_TG
Easy to use

electrically_non-conductive_TG
Electrically non-conductive

Comparison table Pads

Minus Pad Pro

Choose the thickness of Minus Pad Pro according to the specific cooler's requirements or the actual gap and compression behavior. There is no universal pad thickness for a GPU, VRAM or SSD model. A pad that is too thin makes no contact, while one that is too thick can lift the cooler off the main chip. Compression depends on the original thickness, area and mounting pressure. Check the contact imprint and follow the mounting instructions. An incorrect thickness cannot be compensated for by tightening further. External databases such as paddb.com can provide guidance on the pad thickness needed for your graphics card. You can measure used pads with a caliper such as TG Caliper. The area measured may already be compressed. The measurement is therefore only a guide, and the required original thickness may be greater.
Install Minus Pad Pro on clean contact surfaces without additional thermal paste or liquid metal. At the same time, the main CPU/GPU chip can use the other thermal interface material intended for it. In that case, the materials are used at different contact points. Pads can be stacked, but cooling performance may decrease slightly. Make sure the total pad thickness matches the available gap.
Minus Pad Pro bridges gaps between components and the cooler. Cooling performance depends on pad thickness, compression and full contact. The Minus Pad series differ in heat transfer and deformability. Therefore, check thickness and contact again when switching series. Minus Pad Pro offers very good performance and high compressibility. Minus Pad Basic is the affordable entry-level option, while Advance offers higher performance than Basic. Minus Pad 8 ranks above Advance in performance. Minus Pad extreme and Minus Pad extreme 2 form the highest-performing group.
The package contents of Minus Pad Pro depend on the selected size, thickness and pack quantity. Therefore, check the quantity listed for the specific item number. The films on the pads protect them during transport and application. First remove the film on the contact side, then remove the second film after positioning the pad and before installing the cooler. If the stated quantity is missing, send us proof of purchase and photos of the packaging and contents.
A fixed replacement interval for Minus Pad Pro is not generally necessary. During maintenance or if temperatures rise, check that the pad is still clean and makes full contact at all intended points. Small tears alone do not require replacement as long as they do not create a gap. Replace pads that are contaminated or no longer make even contact due to damage or permanent deformation.
Minus Pad Pro is intended as a gap filler between components such as VRAM, voltage regulators or SSD components and their cooler. Choose thickness and dimensions according to the cooler's requirements and the actual gap. For the thin interface on a CPU heatspreader or CPU/GPU die, use the thermal interface material intended for that purpose. A Minus Pad is not a replacement there for paste, a liquid metal interface or a suitable sheet.
Minus Pad Pro can be used in laptops for VRAM, VRMs or other contact areas designed to have a gap. The correct thickness and sufficient mounting pressure are essential. Particularly in laptops, pads that are too thick or too firm can lift the cooler. On CPU and GPU dies, use the thermal interface material intended for that purpose.
Check the position and thickness of Minus Pad Pro and the imprint on both contact sides. Remove all protective films and check whether an overly thick pad is lifting the cooler off the CPU/GPU die. Airflow or the liquid cooling loop must also be working properly. Do not increase mounting pressure beyond the permissible installation specification. A pad that is too thin may fail to contact the cooler, preventing heat from being transferred through the pad as intended.
Minus Pad Pro can be reused if it is clean and, at a suitable thickness, fully touches both contact surfaces. Small tears are generally not a problem as long as they do not leave a gap after installation. Avoid creases and overlaps, as they can change the mounting height. Replace the pad if it is contaminated, has gaps or no longer makes full contact due to permanent deformation.
Minus Pad Pro is not electrically conductive. Nevertheless, the pad must not obstruct sockets, connector contacts or moving parts, and it does not replace an insulator certified for mains or high voltage. For such a special application, the required electrical insulation must be verified separately.
Cut Minus Pad Pro to size with sharp scissors or a blade on a clean surface. If possible, leave the protective films on the material when cutting it. First remove one film and position the pad on the contact surface. Only then peel off the second film, so the pad deforms less while being positioned. Both films must be removed before fitting the cooler. The intended component area should be fully covered without obstructing adjacent mechanical contact points.
Carefully peel off the old Minus Pad Pro and remove residue from suitable contact surfaces using a lint-free cloth and a material-compatible cleaner, such as TG Cleaning Wipes. Do not use a metal blade on small components. Let the contact surfaces dry. Remove one protective film from the new pad before placing it, and remove the second only once the pad is correctly positioned. Then install the cooler. Manufacturer labels on SSDs should not be removed solely to change a pad.
Minus Pad Pro can replace suitable thermal pads on memory, voltage regulators or other gap contact areas in a console. Follow the requirements of the specific console model for pad positions and thicknesses. A universal thickness in millimeters is not reliable. On the main chip, this type of pad is normally not a replacement for the intended paste or liquid metal interface.
If your Minus Pad Pro package includes an authentication card, check the code on the official website printed on it. A missing code or different packaging alone does not prove that a product is counterfeit, as package contents and packaging can vary by product and batch. If the code is invalid, send us photos of the product, packaging, code and proof of purchase so we can check them. Whenever possible, buy from a retailer on our reseller list.
Available instructions, technical data sheets, safety data sheets and conformity documents for Minus Pad Pro can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
No. Minus Pad Pro is intended for larger gaps around components such as VRAM and VRMs. For direct contact with a CPU or GPU die, you need the thin thermal interface material specified for the cooler. An incorrect pad thickness can prevent other components from making contact or exert excessive forces on the die.
Downloads "Minus Pad Pro"
Color: gray
Size: 120 x 20 mm
Thickness: 1.5 mm

Goes perfectly with it:

Skip product gallery
TG Cleaning Wipes
TG Cleaning Wipes

Wet and dry cleaning wipes for cleaning surfaces

Regular price: $12.75
TG Remove
TG Remove

Effective acetone-based nano-cleaner for removing thermal paste and liquid metal

Regular price: $13.92
TG Shield
TG Shield

High-temperature protective coating, protects against liquid metal, thermal paste, and short circuits

Regular price: $13.92