Thermal Grizzly Products
Thermal Grizzly's range of products provides different solutions for the thermal management of electronic components. All of our products are RoHs- and CE-compliant.
Our products are shipped in a special zipper storage bag, which protects the goods while also providing reusability after long storage.
In dosages of or more than 1.5 ml, our thermal grease comes with an applicator, to be screwed onto the syringe. This allows for easy application of the thermal grease on a heat transfer medium.
Thermal Grizzly — Cutting Edge Overclocking Products with Top Usability!
Our Conductonaut liquid metal thermal compound is designed for applications that require very high efficiency. Conductonaut is recommended for experienced users who are looking for a top performance product with best heat dissipation where temperature ranges are above 8 °C.
- Ultra high thermal conductivity
- Increased indium content
- Easy application with synthetic needle
Thermal Grizzly Carbonaut high-tech carbon thermal pads can be used as an excellent alternative to mid-range thermal compounds. They have the exclusive advantage of being reusable, with a very elastic and adaptable surface and very high thermal conductivity. Even the slightest unevenness can be compensated very well.
- Maximum thermal conductivity
- Constantly high performance
- Reusable
- Does not dry out
- Flexible and easy to use
Thermal Grizzly Kryonaut Extreme is based on our well known Kryonaut paste. For Kryonaut Extreme the maximum thermal conductivity was accomplished due to the smallest particle size, thinner minimum layer height and improved low temperature application.
- designed for Overclocking
- 14,2 W/m*K thermal conductivity
- no curing
- long-term durability
Kryonaut thermal grease was created especially for the extremely demanding applications and the highest expectations of the overclocking community. Kryonaut is also highly recommended as a top product for critical cooling systems in the industrial environment.
- designed for Overclocking
- excellent thermal conductivity
- no curing
- long-term durability
- no electrical conductivity!
Hydronaut can be used for overclocking due to it's excellent thermal conductivity, but it was created specifically for users with larger-scale cooling solutions, who are looking for a quality product with an excellent price-performance ratio, for example for their water cooling system.
- suited for Overclocking
- excellent thermal conductivity
- no curing
- silicone-free
- no electrical conductivity
Aeronaut thermal grease is the ideal beginner's product with high effectiveness. Great surface protection, as well as good heat transfer capabilites make Aeronaut the ideal choice for users who want to optimize their cooling solution in an effective way, or maybe want to use an alternative to the thermal grease included with their hardware, with a remarkable cost effectiveness to boot.
- very good thermal conductivity
- long-term durability
- no curing
- no electrical conductivity
The minus pad extreme thermal pad is silicone based with modelling clay like consistency. This allows a perfect surface shaping with maximum possible compression. The minus pad extreme is electrically insulating.
Due to the consistency only one-time use is recommended. The thermal conductivity was improved by about 260 % over the minus pad 8 which allows best cooling for tough cooling operations such as voltage regulators and memory ICs.
- Most excellent thermal conductivity
- No bleeding
- long-term stability
- high compression rate
The high performance thermal pads of the Thermal Grizzly Minus Pad series consist of a very elastic and flexible surface area with very high thermal conductivity, compensating for even the smallest of gaps between components. Available in a variety of different sizes and thicknesses.
The easy to process and flexible minus pads are made up of different constituents, based on a ceramic silicon formula complex and nano aluminum oxide. Thus, the pads ensure a constant, optimal heat transfer.
The lightest of touches is enough to attach them optimally. All pads are ecofriendly and RoHS-compliant.
- High thermal conductivity
- High compressibility
- Electrical insulation
Thermal Grizzly presents the WireView GPU, a device for measuring the power consumption of PCI expansion and plug-in cards, which was developed in collaboration with Jon „elmor“ Sandström. At the same time, the U-shaped design of the adapter enables optimised cable routing for clean cable management.
The Delid-Die-Mate Intel 13th Gen is a tool for removing the heat spreader ("delidden") on Intel processors for socket LGA1700. By removing the heat spreader, the CPUs can be cooled via "direct die", for example. With the so-called "direct die", the CPU cooler is mounted directly on the processor chip. By omitting the heat spreader in the cooling circuit, a significantly optimised heat transfer from the die to the CPU cooler is possible.
- Compatible with 12th/13th Intel Core generation
- Delidding tool
- Made of aluminium
The Ryzen 7000 Delid-Die-Mate is a tool for removing the heat spreaders ("delidding") on AMD Ryzen 7000 processors. By removing the heat spreader, the CPUs can be cooled via "Direct Die", for example. With the so-called "Direct Die" method, the CPU cooler is mounted directly on the CPU dies and the I/O die of the processor. By omitting the heat spreader in the cooling circuit, a significantly optimised heat transfer from the die to the CPU cooler is possible.
The AM5 Lapping-Tool was developed for grinding the heat spreaders of the AM5 processor series from AMD. The tolerances of the AM5 Lapping-Tool allow a gradual grinding of the heat spreader by 0.4 millimetres, up to a total height of 1.6 millimetres. When using the normal AMD mounting frame (SAM), a maximum sanding of 1.0 mm is provided until the middle steps are reached. A further 0.6 mm is only possible if the CPU is mounted e.g. with a suitable AM5 Contact Frame.
The practical AM5 Adapter & Offset Mounting Kit for AMD‘s socket AM5 motherboards includes cooler brackets for offset mounting of the CPU as well as adapter screws from UNC 6-32 to M3 and M4 threads
respectively.
With the 12th Gen CPU Contact Frame by der8auer, Thermal Grizzly provides an assembly aid for Intel mainboards with the LGA1700 socket. The contact frame replaces the mainboards stock ILM to improve the cooling performance of CPU coolers through optimized contact pressure.
The Contact Frame was designed in collaboration with Roman “der8auer” Hartung and is manufactured in Berlin - 100% Made in Germany. Roman Hartung is a mechatronics engineer, hardware enthusiast and content creator in the field of PC hardware. At the same time, he is a well-known overclocker who has already designed numerous products for overclocking PC hardware.
The AMD Ryzen 7000 Direct Die Frame is a CPU mounting frame for mounting Ryzen 7000 processors without the integrated heat spreader. By omitting the heat spreader, the CPU cooler can be mounted directly on the processor's chiplets, allowing for significantly lower temperatures during operation. This is not only interesting for extreme overclockers on the hunt for records, but also for gamers and content creators.
The AMD Ryzen 7000 CPU Guard is a foam gasket that protects the processor from liquid metal and thermal paste. With the Ryzen 7000 series, AMD changed the shape of the heat spreaders of its CPUs and provided them with cut outs under which components like SMDs are exposed. Additionally, the heat spreader does not close with the CPU package at these cut outs, so thermal paste or liquid metal can get into this area.
The AM5 M4 backplate is an optional mounting plate that replaces the original AM5 backplate. Some CPU coolers use a mounting kit that comes with M4 threaded screws. These are not compatible with the UNC 6-32 thread used on the AM5 backplate. With the AM5 M4 backplate, appropriate CPU coolers, especially AiO watercoolers, can be used.
The AM5 Short Backplate is a shortened mounting plate that replaces the original AM5 backplate. Some CPU coolers compatible with the AM4 socket use a custom retention kit for mounting. Since the AM4 backplate is primarily used for mounting coolers, omitting this backplate is generally not a problem.
The 12th Gen Lapping-Tool is specially designed for the Intel 12th Gen Contact Frame and simplifies the process of lapping the processor. Using the enclosed screws, the CPU is simply mounted on the Lapping-Tool with the Contact Frame. This simulates the actual final position of the CPU in the socket on the motherboard.
The Thermal Grizzly M.2 SSD Cooler is a passive cooling solution for next generation form factor SSDs. It's no secret that modern M.2 NVMe SSDs, in particular, get hot when in demanding use, so the speed of the drive has to be slowed down. To counteract this problem and get full performance, the Grizzly professionals have developed a compact passive cooler that significantly reduces the temperatures of an M.2 SSD.
The Thermal Grizzly M.2 SSD Cooler at a glance
- Black Passive Cooler for M.2 SSDs
- lower temperatures to reduce speed limitations
- Compatible with one-sided M.2 NVMe SSDs (2280)
- Easy installation
