FAQ – Cooling & Direct-Die
Information and frequently asked questions about heatspreaders, backplates, mounting kits, delidding, and other accessories.
Heatspreader
AM5 HP Heatspreader
Check the cooler’s achievable mounting height, intended stop and clearance. Do not force the installation by arbitrarily shortening screws or adding washers. The AM5 High Performance Heatspreader replaces the original AM5 heatspreader and the AMD SAM. It enables direct-die cooling with standard coolers such as AIOs or air coolers. In most cases, you can continue using the standard AM5 backplate. Whether a different backplate is needed depends on your cooler, and a replacement is generally unnecessary if the cooler is AM5-compatible. If you are unsure about a combination, send us the exact cooler and motherboard models along with photos of the mounting hardware. The AM5 High Performance Heatspreader sits approximately 2 mm lower than the original AMD heatspreader. The cooler must be able to reach this lower position. Depending on the cooler, the AM5 Adapter & Offset Mounting Kit may help. Make sure your cooler’s mounting height can be adjusted to allow it to sit 2 mm lower. An additional contact frame is not required because the HPHS replaces the CPU retention mechanism.
The AM5 High Performance Heatspreader is intended exclusively for compatible, delidded AM5 CPUs. The current version supports Ryzen 7000 and Ryzen 9000, including X3D and X3D2, as well as the Ryzen 5 7400F. Ryzen 8000G is excluded. For older versions, check the exact revision because the underside was modified in 2026. The AM5 High Performance Heatspreader replaces both the standard heatspreader and the AMD SAM.
Install the AM5 High Performance Heatspreader with the system switched off and disconnected from power, following the instructions for the specific revision. Lay the motherboard flat and support any loose backplate. Use only the specified screws, start all screws loosely and tighten them evenly in the specified sequence. Tightening gradually in a cross pattern avoids excessive stress on the CPU dies.
We recommend a very thin, even layer of a suitable liquid metal, such as Conductonaut, between the exposed CPU dies and the AM5 High Performance Heatspreader. Protect the surrounding SMD components and prevent contact between the liquid metal and electrically conductive components such as SMDs under all circumstances. On the outer surface facing the cooler, you can use a thermal interface material suitable for both contact surfaces, such as KryoSheet or Duronaut Pro. Do not use additional sheets or insulating layers underneath the HPHS that alter the intended mounting height.
The underside of the AM5 High Performance Heatspreader was revised in 2026. The current product page lists compatibility with Ryzen 9000, including X3D and X3D2, as well as the Ryzen 5 7400F. If you have an older HPHS, check its exact version before changing the CPU. We announce further models and release dates through our shop and official channels.
With the AM5 High Performance Heatspreader, first check the mounting height, correct screw set, even seating and the contact pattern of the thermal interface material. In most cases, excessive temperatures are caused by insufficient contact between the CPU and cooler. Bear in mind that the High Performance Heatspreader has a mounting height 2 mm lower than the original heatspreader of an AMD CPU. Then check the fans or pump, coolant flow and power draw. Compare temperatures under the same load and at the same room temperature. Due to CPU boost behaviour, better cooling may also result in higher performance. If die contact is incomplete, correct the mounting setup instead of simply tightening the screws further.
The definitive dimensions, threads and mounting distances for the AM5 High Performance Heatspreader are provided in the technical drawing or instructions for the specific revision. If a required dimension is missing, send us the part number and identify the exact area of interference, if any. For cooler installation, it is particularly important to note that the contact surface sits approximately 2 mm lower than the original AM5 heatspreader.
The AM5 High Performance Heatspreader comes with an insulating sheet, four button-head screws, a 5/64-inch hex key and a Torx T20 key. The insulating sheet is only to be used when graphene pads are installed between the CPU dies and the heatspreader. If any parts are missing or you need replacements, send us the part number, proof of purchase and a photo of the accessories you received. We will check the availability of suitable replacement parts. Do not use unverified screws or spacers from other products.
The AM5 High Performance Heatspreader is designed around AMD’s specified keep-out zone. However, some motherboards do not comply with it. When checking compatibility, consider not only the socket but also the exact motherboard revision, the components around the socket and the cooler mounting hardware. Particularly compact motherboards may have clearance conflicts even when the socket is compatible. If you are unsure, send us the full motherboard model and photos of the socket area from above and the rear of the motherboard.
Switch off the system and disconnect it from power. After installing the AM5 High Performance Heatspreader, check that the CPU and heatspreader are seated correctly and that the screws have been tightened evenly according to the instructions. An incorrect mounting gap or uneven pressure from the CPU cooler can affect socket contact and RAM detection. Also check BIOS support and visible contamination. If in doubt, inspect the socket itself for bent pins. If the socket or die is damaged, do not run further tests. Instead, send us photos and the full system specifications.
Lay the motherboard flat before loosening the AM5 High Performance Heatspreader. Remove the cooler, then loosen the High Performance Heatspreader screws gradually in a cross pattern. Lift it very slowly and vertically to check whether the CPU is still sticking to its underside. If it is, lift the heatspreader far enough to turn it over safely. Then remove the CPU from the heatspreader and clean it using a method suitable for the thermal interface material you used.
Instructions, datasheets and any available technical drawings for the AM5 High Performance Heatspreader can be found in the downloads section of the product page. Make sure the document matches your version and revision. If a file you need is missing, send us the part number and specify the information you require. Please note that public CAD files are not available for every product.
Intel HP Heatspreader V1
On compatible delidded LGA1700 CPUs, the Intel High Performance Heatspreader V1 replaces both the original heatspreader and the motherboard’s ILM. It allows you to use a suitable air cooler or AIO. An additional contact frame or direct-die frame is not required, as the HPHS holds the CPU in place. Use the LGA1700 mounting hardware supplied with your cooler and its backplate, if applicable. Check that the cooler can reach the required mounting height and makes full contact with the HPHS. Do not force the installation by arbitrarily shortening screws or adding washers. If you are unsure about a combination, send us the exact cooler and motherboard models along with photos of the mounting hardware.
The Intel High Performance Heatspreader V1 is approved for delidded 12th, 13th and 14th generation Intel Core desktop CPUs on LGA1700. It replaces both the original heatspreader and the motherboard’s ILM. It is not an accessory for LGA1851 or LGA1954. The cooler and its mounting hardware must accommodate the changed mounting height. Before installation, check the current compatibility list and the available clearance on your motherboard.
We recommend a very thin, even layer of liquid metal, such as Conductonaut, between the exposed CPU die and the Intel High Performance Heatspreader V1. Protect the surrounding SMD components with a thin layer of TG Shield and prevent any contact between the liquid metal and electrically conductive components. On the outer surface between the HPHS and the cooler, you can use a thermal interface material suitable for both contact surfaces, such as thermal paste or KryoSheet. KryoSheet and Carbonaut are not recommended underneath the Intel HPHS because their additional thickness changes the mounting pressure. Additional insulating layers must not raise the HPHS.
Install the Intel High Performance Heatspreader V1 according to the instructions with the system switched off and disconnected from power. Lay the motherboard flat and support any loose backplate. Place the CPU in the socket and apply the thermal interface material to the CPU die. We specifically recommend liquid metal here. Use only the specified screws and start them loosely. Tighten them evenly and gradually in a cross pattern as instructed to avoid uneven loading of the CPU die. Then install the CPU cooler using its appropriate mounting hardware. The tightening instructions for the HPHS and the cooler may differ. An incorrect mounting gap cannot be corrected by tightening the screws further.
When checking the fit of the Intel High Performance Heatspreader V1, consider not only the socket but also the exact motherboard revision, the components around the socket and the cooler mounting hardware. Particularly compact motherboards may have clearance conflicts even when the socket is compatible. Compare the dimensioned drawing with your setup. If you are unsure, send us the full motherboard model and photos of the socket area from above and the rear of the motherboard.
First check that the CPU die makes full contact with the Intel High Performance Heatspreader V1 and that the HPHS makes full contact with the cooler. Insufficient contact at either interface can cause high temperatures. Check the mounting height, screw set, even seating and the contact pattern of the thermal interface material. If contact is incomplete, correct the mounting setup instead of simply tightening the screws further. Then check the fans or pump, coolant flow and power draw. Compare temperatures under the same load and at the same room temperature. Due to CPU boost behaviour, better cooling may also result in higher performance.
Switch off the system and disconnect it from power. Check that the CPU, Intel High Performance Heatspreader V1 and cooler are seated correctly and that the screws have been tightened evenly according to the instructions. An incorrect mounting gap or uneven pressure can affect socket contact and RAM detection. Do not install an additional contact frame underneath the HPHS. Also check BIOS support for the CPU and RAM, visible contamination and, if in doubt, the socket for bent pins. If the socket or die is damaged, do not run further tests. Instead, send us photos and the full system specifications.
The definitive dimensions, threads and mounting distances for the Intel High Performance Heatspreader V1 are provided in the technical drawing or instructions for the specific revision. Also check the cooler height and the clearance around the socket to confirm the fit. Do not apply nominal dimensions from other versions. If a required dimension is missing, send us the part number and identify the exact area of interference.
The Intel High Performance Heatspreader V1 includes the heatspreader, four 3/8-inch-long button-head screws with UNC threads, a 5/64-inch hex key and a Torx T20 key. If any parts are missing or you need replacements, send us the part number, proof of purchase and a photo of the accessories you received. We will check the availability of suitable replacement parts. Do not use unverified screws or spacers from other products.
Lay the motherboard flat and remove the CPU cooler first. Then loosen the Intel High Performance Heatspreader V1 mounting screws gradually in a cross pattern. Lift the heatspreader slowly and vertically, checking whether the CPU is sticking to its underside. If it is, secure the CPU against falling out and carefully turn the heatspreader over once there is enough clearance. Remove the CPU without tilting or levering against the edges of the exposed die. Clean the contact surfaces using a method suitable for the thermal interface material used.
Backplates & Mounting Kits
AM5 Short Backplate
You need the AM5 Short Backplate if, for example, a suitable AM4 cooler is to be installed on AM5 using its own backplate or a corresponding mounting system. It supports the motherboard’s SAM, which is normally secured by the original AM5 backplate. If your cooler is already compatible with the stock AM5 backplate, replacing it is generally unnecessary. Using an AM5 High Performance Heatspreader alone does not require a Short Backplate either.
Install the AM5 Short Backplate according to the instructions with the system switched off and disconnected from power. Lay the motherboard flat and remove the CPU before loosening the socket retention mechanism. Position the Short Backplate in the specified orientation with its insulating layer intact, then secure the socket retention mechanism using the specified screws. Next, install the separate cooler mounting hardware according to its instructions. Tighten the screws evenly and gradually in the specified sequence. Before switching on, check that the retention mechanism is secure and that the cooler makes full contact with the CPU. Additional mounting pressure cannot compensate for an incorrect mounting gap.
The AM5 Short Backplate is designed to secure the SAM on AM5 motherboards. The key considerations are whether your cooler requires its own backplate and whether its mounting system fits together with the Short Backplate. It neither removes the CPU heatspreader nor automatically adjusts the cooler height.
AM5 M4 Backplate
The AM5 M4 Backplate replaces the original AM5 backplate when your cooler’s mounting system requires M4 threads. Examples include older water blocks or LN2 pots that use M4 screws for mounting. The stock UNC 6-32 threads are not suitable for this. If your cooler is already compatible with the original AM5 backplate, replacing it is generally unnecessary. This also applies when using an AM5 High Performance Heatspreader.
Install the AM5 M4 Backplate according to the instructions with the system switched off and disconnected from power. Lay the motherboard flat and remove the CPU from the socket before loosening the socket retention mechanism. Ensure the correct orientation and an intact insulating layer. Use the specified screws for both the socket retention mechanism and the cooler. M4 screws must not be screwed into UNC 6-32 threads. Start all screws loosely, then tighten them evenly and gradually according to the instructions for each mounting assembly. Afterwards, check that the CPU and cooler are seated correctly. An incorrect mounting gap cannot be corrected by tightening the screws further.
For the AM5 M4 Backplate, pay particular attention to clearance on the rear of the motherboard, the exact motherboard revision and your cooler’s mounting hardware. The backplate must sit in its intended position with its insulating layer intact. It must not rest against components or solder joints. Compare the dimensioned drawing with your setup. If you are unsure, send us the full motherboard and cooler models along with photos of the rear of the motherboard and the mounting hardware.
According to the datasheet, the AM5 M4 Backplate measures 104 × 65 × 3 mm and provides M4 threads for the corresponding cooler mounting hardware. The insulating layer must remain undamaged. In addition to the dimensions, check screw length, mounting height and clearance on the rear of the motherboard.
AM5 Offset Mounting Kit
With suitable coolers, the AM5 Adapter & Offset Mounting Kit allows offset mounting closer to the CPU hotspot. It also includes adapters from UNC 6-32 to M3 and M4. These can be used to adapt compatible cooler mounting hardware and achieve a lower mounting position in direct-die setups. Whether you need the kit depends on the cooler, its achievable mounting height and the available space on the motherboard.
Install the AM5 Adapter & Offset Mounting Kit according to the instructions with the system switched off and disconnected from power. Lay the motherboard flat. Use only the specified screws and spacers, start all screws loosely and tighten them evenly in the specified sequence. You do not necessarily have to use the offset brackets. The UNC 6-32 to M3 or M4 adapters fit the stock AMD AM5 backplate and can be used independently if required for your cooling setup.
The AM5 Adapter & Offset Mounting Kit is intended for explicitly supported cooler and AM5 mounting combinations. It can adjust the mounting position or height, but it does not make every AM4 cooler or AIO compatible with direct-die cooling. Mycro Direct-Die coolers do not require this additional offset kit. Switching to direct-die cooling changes the contact and mounting height. Simply removing the IHS or using a different backplate is not enough. The cooler and CPU retention hardware must also be approved for this setup and allow the mounting height to be adjusted.
The offset brackets use UNC 6-32 threads. The included adapters convert these to M3 or M4. For clearance, at least 6 mm of space is required below the lower cooler mounting screws before any tall motherboard components. Check any other required installation dimensions against the drawing for your version or ask our support team.
The kit contains four offset brackets with UNC 6-32 threads, four M3 adapter screws, four M4 adapter screws, four M3 thumb nuts and four M4 thumb nuts. If any parts are missing or you need replacements, send us the part number, proof of purchase and a photo of the accessories you received. We will check the availability of suitable replacement parts. Do not use unverified screws or spacers from other products.
Delidding & Direct-Die
TG Kapton Insulation Sheet
Cut TG Kapton Insulation Sheet to size with clean, sharp scissors or a blade on a suitable surface, never directly on the circuit board or CPU substrate. Apply the film to clean, dry surfaces that need electrical insulation. The actual heat transfer surface must remain clear. Avoid torn edges, wrinkles and overlapping layers under the cooler. In direct-die installations, even a thin additional layer can change the contact height. Use the protection method specified in the cooler's instructions for these installations.
TG Kapton Insulation Sheet is used to electrically insulate suitable contact areas. Its protective effect requires a clean surface. The film must not get between the cooler and the contact surface, as this would impair heat transfer. For applications with specific voltage requirements, thickness and electrical specifications must be checked separately.
Both versions are suitable for continuous temperature exposure up to 180 °C. The standard TG Kapton Insulation Sheet withstands temperatures up to 280 °C for short periods. The transparent, yellowish film allows the covered components to remain visible. TG Kapton Insulation Sheet Black Edition withstands temperatures up to 260 °C for short periods. Its matte black surface is suitable when components should also be visually concealed or when the yellowish film does not suit the design.
Instructions, data sheets and, where available, technical drawings for TG Kapton Insulation Sheet can be found in the downloads section of the product page. Make sure the document matches your version and revision. If the required file is missing, tell us the item number and the information you are looking for. Please note that a public CAD file is not available for every product.
TG Scraper
TG Scraper helps gently remove adhesive residue and indium from CPUs during delidding. Work on a stable surface using light pressure and a shallow angle. Do not press on die edges or small SMD components, and do not try to forcefully pry off hard solder residue. Avoid steep angles on the PCB surface, as this can cause scratches.
