FAQ – Thermal Interface Materials
Information and frequently asked questions about thermal pastes, thermal pads, putty, liquid metal and accessories.
Thermal Pastes
Kryonaut
If your Kryonaut package includes an authentication card, check the code on the official website printed on it. A missing code or different packaging alone does not prove that a product is counterfeit, as package contents and packaging can vary by product and batch. If the code is invalid, send us photos of the product, packaging, code and proof of purchase so we can check them. Whenever possible, buy from a retailer on our reseller list.
Kryonaut is designed for high cooling performance and demanding applications, including overclocking. The temperature you can achieve depends on power consumption, the cooler, the contact surfaces and installation. In terms of cooling performance, Kryonaut ranks just behind Duronaut and Duronaut Pro. Ideally, use independent tests for comparison. Thermal Grizzly has not published general W/(m·K) ratings since the end of 2020. A single thermal conductivity value does not allow a reliable comparison of cooling performance, as the test method, temperature, mounting pressure and contact surfaces all affect the result.
Available instructions, technical data sheets, safety data sheets and conformity documents for Kryonaut can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
There is no universal replacement interval for Kryonaut once installed in a system. Check temperatures under comparable loads and at comparable ambient temperatures. Replace the paste if temperatures show a confirmed deterioration or if you have removed the cooler. A universal service life cannot be specified. Temperature changes can gradually displace thermal paste from the contact area, a process known as pump-out. A thin, even layer of Kryonaut and correct cooler installation reduce this risk, but cannot eliminate it in every configuration. Duronaut and Duronaut Pro are designed for particularly high long-term stability. If temperatures rise again, also check the contact pattern. Kryonaut works best between two copper or nickel-plated surfaces.
Clean and degrease the CPU or GPU and the cooler's contact surface, then let them dry. Apply Kryonaut at room temperature to clean, dry contact surfaces. Use the spatula to spread the paste slowly into a thin layer, applying even pressure. Avoid fast wiping movements, as they can lift the paste off the surface again. A thick consistency is not a defect in itself. It is intentional, as it improves long-term stability. Do not use solvents or oils to thin the paste, and do not press on the edges of exposed dies. Warming the product with a hair dryer can make it easier to apply. The amount needed depends on the contact area. Cover it completely with a thin layer, especially on exposed dies. A thick layer or a large amount extending beyond the contact area is not necessary. However, applying too much does not result in worse temperatures. Excess paste is squeezed out of the gap.
First check that the cooler is seated correctly, the mounting pressure is even, the fans or pump are working correctly (for liquid cooling), and the contact surface is fully covered. When reinstalling the cooler, remove old residue and apply a fresh, thin layer of Kryonaut. Compare temperatures at the same room temperature and power consumption. CPU boost can turn improved heat transfer into higher performance rather than lower temperatures. Therefore, always check whether the CPU or GPU clock speed has changed as well.
Kryonaut can be used on CPU and GPU dies in laptops if the cooling system is designed for thermal paste and makes reliable contact. Cover the entire die with a thin layer. Larger gaps around memory and voltage regulators require suitable pads or putty. If pump-out keeps occurring, long-term stability and the specific cooler geometry matter more than a general comparison value. Duronaut or Duronaut Pro are generally better suited to laptops.
After use, seal the Kryonaut syringe tightly and store it in its original packaging in a dry place, protected from light and major temperature fluctuations. Shelf life is different from service life once installed in a system. Before using older paste, check it for contamination and unusual consistency. If you are unsure, we can check the batch using photos and purchase details. An unopened tube of Kryonaut can be used for up to 10 years, and an opened tube for up to 5 years without any problems.
Kryonaut was developed for a temperature range of −250 to +350 °C. This material specification is not a blanket approval for every continuous high-temperature process. For special applications, exposure duration, contact materials, layer thickness and mechanical loads must be assessed separately.
First remove Kryonaut from the surface using a dry, lint-free cloth. Then clean the surface with isopropyl alcohol or a material-compatible TIM cleaner such as TG Remove. TG Cleaning Wipes include both dry wipes and wet wipes soaked in cleaning agents. Keep cleaning agents out of sockets and connectors, and allow all surfaces to dry completely. Use fresh paste when reinstalling the cooler.
Kryonaut is intended for direct contact between the CPU or GPU and a correctly installed cooler. Conventional thermal pastes can be used on common copper, nickel or aluminum contact surfaces. Follow the cooler manufacturer's instructions. Larger gaps around VRAM or VRMs require suitable pads or putty. The paste is not suitable for bridging gaps larger than 0.2 mm.
Kryonaut is not electrically conductive. Nevertheless, only apply the paste to the intended contact surface. Residue in the socket or on connector contacts can interfere with mechanical and electrical contact. The paste is not a certified electrical insulator for high-voltage applications.
In principle, Kryonaut can be used directly on a silicon die if the cooler and its mounting system are designed for this purpose. For Thermal Grizzly direct-die coolers and the underside of our High Performance Heatspreaders, we recommend using liquid metal such as Conductonaut or Conductonaut Extreme. General suitability for thermal paste does not override this product-specific requirement. Kryonaut can be particularly susceptible to pump-out in direct-die CPU applications.
Kryonaut extreme
Kryonaut Extreme is specifically focused on maximum performance in demanding applications and extreme overclocking at very low temperatures. The temperature you can achieve depends on power consumption, the cooler, the contact surfaces and installation. A fixed temperature advantage over other thermal interface materials therefore cannot be specified for every system. Compare performance under the same conditions. Thermal Grizzly has not published general W/(m·K) ratings since the end of 2020. A single thermal conductivity value does not allow a reliable comparison of cooling performance, as the test method, temperature, mounting pressure and contact surfaces all affect the result.
There is no universal replacement interval for Kryonaut Extreme once installed in a system. Check temperatures under comparable loads and at comparable ambient temperatures. Replace the paste if temperatures show a confirmed deterioration or if you have removed the cooler. A universal service life cannot be specified. Temperature changes can gradually displace thermal paste from the contact area, a process known as pump-out. A thin, even layer of Kryonaut Extreme and correct cooler installation reduce this risk, but cannot eliminate it in every configuration. Duronaut and Duronaut Pro are designed for particularly high long-term stability. If temperatures rise again, also check the contact pattern.
Clean and degrease the CPU or GPU and the cooler's contact surface, then let them dry. Apply Kryonaut Extreme at room temperature to clean, dry contact surfaces. Use the spatula to spread the paste slowly into a thin layer, applying even pressure. Avoid fast wiping movements, as they can lift the paste off the surface again. A thick consistency is not a defect in itself. Do not use solvents or oils to thin the paste, and do not press on the edges of exposed dies. Warming the product with a hair dryer can make it easier to apply. The amount needed depends on the contact area. Cover it completely with a thin layer, especially on exposed dies. A thick layer or a large amount extending beyond the contact area is not necessary. However, applying too much does not result in worse temperatures. Excess paste is squeezed out of the gap.
If your Kryonaut Extreme package includes an authentication card, check the code on the official website printed on it. A missing code or different packaging alone does not prove that a product is counterfeit, as package contents and packaging can vary by product and batch. If the code is invalid, send us photos of the product, packaging, code and proof of purchase so we can check them. Whenever possible, buy from a retailer on our reseller list.
First check that the cooler is seated correctly, the mounting pressure is even, the fans or pump are working correctly (for liquid cooling), and the contact surface is fully covered. When reinstalling the cooler, remove old residue and apply a fresh, thin layer of Kryonaut Extreme. Compare temperatures at the same room temperature and power consumption. CPU boost can turn improved heat transfer into higher performance rather than lower temperatures. Therefore, always check whether the CPU or GPU clock speed has changed as well.
Available instructions, technical data sheets, safety data sheets and conformity documents for Kryonaut Extreme can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
Kryonaut Extreme is intended for direct contact between the CPU or GPU and a correctly installed cooler. Conventional thermal pastes can be used on common copper, nickel or aluminum contact surfaces. Follow the cooler manufacturer's instructions. Larger gaps around VRAM or VRMs require suitable pads or putty. The paste is not suitable for bridging gaps larger than 0.2 mm.
Kryonaut Extreme can be used on CPU and GPU dies in laptops if the cooling system is designed for thermal paste and makes reliable contact. Cover the entire die with a thin layer. Larger gaps around memory and voltage regulators require suitable pads or putty. If pump-out keeps occurring, long-term stability and the specific cooler geometry matter more than a general comparison value. Duronaut or Duronaut Pro are generally better suited to laptops.
Kryonaut Extreme was developed for a temperature range of −250 to +350 °C. This material specification is not a blanket approval for every continuous high-temperature process. For special applications, exposure duration, contact materials, layer thickness and mechanical loads must be assessed separately.
In principle, Kryonaut Extreme can be used directly on a silicon die if the cooler and its mounting system are designed for this purpose. For Thermal Grizzly direct-die coolers and the underside of our High Performance Heatspreaders, we recommend using liquid metal such as Conductonaut or Conductonaut Extreme. General suitability for thermal paste does not override this product-specific requirement. Kryonaut Extreme can be particularly susceptible to pump-out in direct-die CPU applications.
Kryonaut Extreme is not electrically conductive. Nevertheless, only apply the paste to the intended contact surface. Residue in the socket or on connector contacts can interfere with mechanical and electrical contact. The paste is not a certified electrical insulator for high-voltage applications.
First remove Kryonaut Extreme from the surface using a dry, lint-free cloth. Then clean the surface with isopropyl alcohol or a material-compatible TIM cleaner such as TG Remove. TG Cleaning Wipes include both dry wipes and wet wipes soaked in cleaning agents. Keep cleaning agents out of sockets and connectors, and allow all surfaces to dry completely. Use fresh paste when reinstalling the cooler.
After use, seal the Kryonaut Extreme syringe tightly and store it in its original packaging in a dry place, protected from light and major temperature fluctuations. Shelf life is different from service life once installed in a system. Before using older paste, check it for contamination and unusual consistency. If you are unsure, we can check the batch using photos and purchase details. An unopened tube of Kryonaut Extreme can be used for up to 10 years, and an opened tube for up to 5 years without any problems.
Hydronaut
There is no universal replacement interval for Hydronaut once installed in a system. Check temperatures under comparable loads and at comparable ambient temperatures. Replace the paste if temperatures show a confirmed deterioration or if you have removed the cooler. A universal service life cannot be specified. Temperature changes can gradually displace thermal paste from the contact area, a process known as pump-out. A thin, even layer of Hydronaut and correct cooler installation reduce this risk, but cannot eliminate it in every configuration. Duronaut and Duronaut Pro are designed for particularly high long-term stability. If temperatures rise again, also check the contact pattern.
Hydronaut is a silicone-free thermal paste for large contact surfaces, powerful cooling systems and applications where a silicone-free formulation is important. The temperature you can achieve depends on power consumption, the cooler, the contact surfaces and installation. A fixed temperature advantage over other thermal interface materials therefore cannot be specified for every system. Compare performance under the same conditions. Thermal Grizzly has not published general W/(m·K) ratings since the end of 2020. A single thermal conductivity value does not allow a reliable comparison of cooling performance, as the test method, temperature, mounting pressure and contact surfaces all affect the result.
Available instructions, technical data sheets, safety data sheets and conformity documents for Hydronaut can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
Hydronaut was developed for a temperature range of −200 to +350 °C. This material specification is not a blanket approval for every continuous high-temperature process. For special applications, exposure duration, contact materials, layer thickness and mechanical loads must be assessed separately. Thanks to its silicone-free matrix, Hydronaut is ideally suited to various industrial applications.
Clean and degrease the CPU or GPU and the cooler's contact surface, then let them dry. Apply Hydronaut at room temperature to clean, dry contact surfaces. Use the spatula to spread the paste slowly into a thin layer, applying even pressure. Avoid fast wiping movements, as they can lift the paste off the surface again. A thick consistency is not a defect in itself. Do not use solvents or oils to thin the paste, and do not press on the edges of exposed dies. Warming the product with a hair dryer can make it easier to apply. The amount needed depends on the contact area. Cover it completely with a thin layer, especially on exposed dies. A thick layer or a large amount extending beyond the contact area is not necessary. However, applying too much does not result in worse temperatures. Excess paste is squeezed out of the gap.
First check that the cooler is seated correctly, the mounting pressure is even, the fans or pump are working correctly (for liquid cooling), and the contact surface is fully covered. When reinstalling the cooler, remove old residue and apply a fresh, thin layer of Hydronaut. Compare temperatures at the same room temperature and power consumption. CPU boost can turn improved heat transfer into higher performance rather than lower temperatures. Therefore, always check whether the CPU or GPU clock speed has changed as well.
Hydronaut can be used on CPU and GPU dies in laptops if the cooling system is designed for thermal paste and makes reliable contact. Cover the entire die with a thin layer. Larger gaps around memory and voltage regulators require suitable pads or putty. If pump-out keeps occurring, long-term stability and the specific cooler geometry matter more than a general comparison value. Duronaut or Duronaut Pro are generally better suited to laptops.
Hydronaut is intended for direct contact between the CPU or GPU and a correctly installed cooler. Conventional thermal pastes can be used on common copper, nickel or aluminum contact surfaces. Follow the cooler manufacturer's instructions. Larger gaps around VRAM or VRMs require suitable pads or putty. The paste is not suitable for bridging gaps larger than 0.2 mm.
If your Hydronaut package includes an authentication card, check the code on the official website printed on it. A missing code or different packaging alone does not prove that a product is counterfeit, as package contents and packaging can vary by product and batch. If the code is invalid, send us photos of the product, packaging, code and proof of purchase so we can check them. Whenever possible, buy from a retailer on our reseller list.
Hydronaut is not electrically conductive. Nevertheless, only apply the paste to the intended contact surface. Residue in the socket or on connector contacts can interfere with mechanical and electrical contact. The paste is not a certified electrical insulator for high-voltage applications.
For direct-die applications such as delidded CPUs, we recommend our high-performance products and specifically liquid metal such as Conductonaut and Conductonaut Extreme.
Hydronaut is suitable for contact areas in consoles that are designed to use thermal paste. First check the exact console model and the thermal interface materials already in use. The VRAM and VRM pads must remain in place or be replaced with pads of a suitable thickness. A contact area originally designed for liquid metal, such as in a PS5, should not be converted to paste without first checking the cooling design.
First remove Hydronaut from the surface using a dry, lint-free cloth. Then clean the surface with isopropyl alcohol or a material-compatible TIM cleaner such as TG Remove. TG Cleaning Wipes include both dry wipes and wet wipes soaked in cleaning agents. Keep cleaning agents out of sockets and connectors, and allow all surfaces to dry completely. Use fresh paste when reinstalling the cooler.
After use, seal the Hydronaut syringe tightly and store it in its original packaging in a dry place, protected from light and major temperature fluctuations. Shelf life is different from service life once installed in a system. Before using older paste, check it for contamination and unusual consistency. If you are unsure, we can check the batch using photos and purchase details. An unopened tube of Hydronaut can be used for up to 10 years. An opened tube of Hydronaut should be used within 4 years.
Hydronaut PRO
-40 to 150
Hydronaut Pro offers improved heat transfer compared with Hydronaut while retaining its silicone-free carrier structure. Different package sizes of the same product cater to different consumption needs and do not change the formulation. Kryonaut Extreme, Hydronaut Pro and Duronaut Pro are separate products. Choose based on the product description, not just the color or package size.
For direct-die applications such as delidded CPUs, we recommend our high-performance products and specifically liquid metal such as Conductonaut and Conductonaut Extreme.
Aeronaut
Aeronaut is a general-purpose thermal paste for getting started and improving conventional CPU and GPU cooling. The temperature you can achieve depends on power consumption, the cooler, the contact surfaces and installation. A fixed temperature advantage over other thermal interface materials therefore cannot be specified for every system. Compare performance under the same conditions.
Available instructions, technical data sheets, safety data sheets and conformity documents for Aeronaut can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
Clean and degrease the CPU or GPU and the cooler's contact surface, then let them dry. Apply Aeronaut at room temperature to clean, dry contact surfaces. Use the spatula to spread the paste slowly into a thin layer, applying even pressure. Avoid fast wiping movements, as they can lift the paste off the surface again. A thick consistency is not a defect in itself. Do not use solvents or oils to thin the paste, and do not press on the edges of exposed dies. Warming the product with a hair dryer can make it easier to apply. The amount needed depends on the contact area. Cover it completely with a thin layer, especially on exposed dies. A thick layer or a large amount extending beyond the contact area is not necessary. However, applying too much does not result in worse temperatures. Excess paste is squeezed out of the gap.
There is no universal replacement interval for Aeronaut once installed in a system. Check temperatures under comparable loads and at comparable ambient temperatures. Replace the paste if temperatures show a confirmed deterioration or if you have removed the cooler. A universal service life cannot be specified. Temperature changes can gradually displace thermal paste from the contact area, a process known as pump-out. A thin, even layer of Aeronaut and correct cooler installation reduce this risk, but cannot eliminate it in every configuration. Duronaut and Duronaut Pro are designed for particularly high long-term stability. If temperatures rise again, also check the contact pattern.
If your Aeronaut package includes an authentication card, check the code on the official website printed on it. A missing code or different packaging alone does not prove that a product is counterfeit, as package contents and packaging can vary by product and batch. If the code is invalid, send us photos of the product, packaging, code and proof of purchase so we can check them. Whenever possible, buy from a retailer on our reseller list.
Aeronaut is intended for direct contact between the CPU or GPU and a correctly installed cooler. Conventional thermal pastes can be used on common copper, nickel or aluminum contact surfaces. Follow the cooler manufacturer's instructions. Larger gaps around VRAM or VRMs require suitable pads or putty. The paste is not suitable for bridging gaps larger than 0.2 mm.
First check that the cooler is seated correctly, the mounting pressure is even, the fans or pump are working correctly (for liquid cooling), and the contact surface is fully covered. When reinstalling the cooler, remove old residue and apply a fresh, thin layer of Aeronaut. Compare temperatures at the same room temperature and power consumption. CPU boost can turn improved heat transfer into higher performance rather than lower temperatures. Therefore, always check whether the CPU or GPU clock speed has changed as well.
First remove Aeronaut from the surface using a dry, lint-free cloth. Then clean the surface with isopropyl alcohol or a material-compatible TIM cleaner such as TG Remove. TG Cleaning Wipes include both dry wipes and wet wipes soaked in cleaning agents. Keep cleaning agents out of sockets and connectors, and allow all surfaces to dry completely. Use fresh paste when reinstalling the cooler.
Aeronaut was developed for a temperature range of −150 to +200 °C. This material specification is not a blanket approval for every continuous high-temperature process. For special applications, exposure duration, contact materials, layer thickness and mechanical loads must be assessed separately.
Aeronaut is not electrically conductive. Nevertheless, only apply the paste to the intended contact surface. Residue in the socket or on connector contacts can interfere with mechanical and electrical contact. The paste is not a certified electrical insulator for high-voltage applications.
Aeronaut can be used on CPU and GPU dies in laptops if the cooling system is designed for thermal paste and makes reliable contact. Cover the entire die with a thin layer. Larger gaps around memory and voltage regulators require suitable pads or putty. If pump-out keeps occurring, long-term stability and the specific cooler geometry matter more than a general comparison value. Duronaut or Duronaut Pro are generally better suited to laptops.
For direct-die applications such as delidded CPUs, we recommend our high-performance products and specifically liquid metal such as Conductonaut and Conductonaut Extreme.
Aeronaut is suitable for contact areas in consoles that are designed to use thermal paste. First check the exact console model and the thermal interface materials already in use. The VRAM and VRM pads must remain in place or be replaced with pads of a suitable thickness. A contact area originally designed for liquid metal, such as in a PS5, should not be converted to paste without first checking the cooling design.
After use, seal the Aeronaut syringe tightly and store it in its original packaging in a dry place, protected from light and major temperature fluctuations. Shelf life is different from service life once installed in a system. Before using older paste, check it for contamination and unusual consistency. If you are unsure, we can check the batch using photos and purchase details. An unopened tube of Aeronaut has a shelf life of 10 years. Once opened, Aeronaut should be used within 5 years.
Duronaut
Duronaut combines high cooling performance with a particular focus on long-term stability and low pump-out. The temperature you can achieve depends on power consumption, the cooler, the contact surfaces and installation. A fixed temperature advantage over other thermal interface materials therefore cannot be specified for every system. Thermal Grizzly has not published general W/(m·K) ratings since the end of 2020. A single thermal conductivity value does not allow a reliable comparison of cooling performance, as the test method, temperature, mounting pressure and contact surfaces all affect the result.
Clean and degrease the CPU or GPU and the cooler's contact surface, then let them dry. Apply Duronaut at room temperature to clean, dry contact surfaces. Use the spatula to spread the paste very slowly into a thin layer, applying even pressure. Avoid fast wiping movements, as they can lift the paste off the surface again. A thick consistency is not a defect in itself. It is necessary for high long-term stability. Do not use solvents or oils to thin the paste, and do not press on the edges of exposed dies. Warming the product with a hair dryer can make it easier to apply. The amount needed depends on the contact area. Cover it completely with a thin layer, especially on exposed dies. A thick layer or a large amount extending beyond the contact area is not necessary, but can make application easier. However, applying too much does not result in worse temperatures. Excess paste is squeezed out of the gap. TG Spatula Pro is particularly suitable for applying Duronaut. You can also find application video tutorials on the Thermal Grizzly YouTube channel.
There is no universal replacement interval for Duronaut once installed in a system. Check temperatures under comparable loads and at comparable ambient temperatures. Replace the paste if temperatures show a confirmed deterioration or if you have removed the cooler. A universal service life cannot be specified. Duronaut has been optimized for high long-term stability and minimal displacement from the contact area. Nevertheless, apply the paste in a thin, even layer and follow the cooler's mounting instructions. Complete freedom from pump-out cannot be guaranteed in every application. If temperatures rise, first check the cooler installation, cooling performance and contact pattern.
Duronaut can be used on CPU and GPU dies in laptops if the cooling system is designed for thermal paste and makes reliable contact. Cover the entire die with a thin layer. Larger gaps around memory and voltage regulators require suitable pads or putty. If pump-out keeps occurring, long-term stability and the specific cooler geometry matter more than a general comparison value. Duronaut is designed for particularly high long-term stability and low pump-out, making it well suited to these applications.
First check that the cooler is seated correctly, the mounting pressure is even, the fans or pump are working correctly (for liquid cooling), and the contact surface is fully covered. When reinstalling the cooler, remove old residue and apply a fresh, thin layer of Duronaut. Compare temperatures at the same room temperature and power consumption. CPU boost can turn improved heat transfer into higher performance rather than lower temperatures. Therefore, always check whether the CPU or GPU clock speed has changed as well.
In principle, Duronaut can be used directly on a silicon die if the cooler and its mounting system are designed for this purpose. For Thermal Grizzly direct-die coolers and the underside of our High Performance Heatspreaders, we recommend using liquid metal such as Conductonaut or Conductonaut Extreme. General suitability for thermal paste does not override this product-specific requirement. Duronaut can be affected by pump-out in direct-die CPU applications.
Duronaut is intended for direct contact between the CPU or GPU and a correctly installed cooler. Conventional thermal pastes can be used on common copper, nickel or aluminum contact surfaces. Follow the cooler manufacturer's instructions. Larger gaps around VRAM or VRMs require suitable pads or putty. The paste is not suitable for bridging gaps larger than 0.2 mm.
If your Duronaut package includes an authentication card, check the code on the official website printed on it. A missing code or different packaging alone does not prove that a product is counterfeit, as package contents and packaging can vary by product and batch. If the code is invalid, send us photos of the product, packaging, code and proof of purchase so we can check them. Whenever possible, buy from a retailer on our reseller list.
Duronaut was developed for a temperature range of −150 to +150 °C. This material specification is not a blanket approval for every continuous high-temperature process. For special applications, exposure duration, contact materials, layer thickness and mechanical loads must be assessed separately.
Duronaut is not electrically conductive. Nevertheless, only apply the paste to the intended contact surface. Residue in the socket or on connector contacts can interfere with mechanical and electrical contact. The paste is not a certified electrical insulator for high-voltage applications.
Duronaut is suitable for contact areas in consoles that are designed to use thermal paste. First check the exact console model and the thermal interface materials already in use. The VRAM and VRM pads must remain in place or be replaced with pads of a suitable thickness. A contact area originally designed for liquid metal, such as in a PS5, should not be converted to paste without first checking the cooling design.
Available instructions, technical data sheets, safety data sheets and conformity documents for Duronaut can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
First remove Duronaut from the surface using a dry, lint-free cloth. Then clean the surface with isopropyl alcohol or a material-compatible TIM cleaner such as TG Remove. TG Cleaning Wipes include both dry wipes and wet wipes soaked in cleaning agents. Keep cleaning agents out of sockets and connectors, and allow all surfaces to dry completely. Use fresh paste when reinstalling the cooler.
In 2026, Duronaut was complemented by the further-developed Duronaut Pro. Duronaut Pro offers even better performance while maintaining very good long-term stability.
Duronaut Pro
Duronaut Pro further improves the heat transfer of Duronaut while remaining focused on particularly high long-term stability and low pump-out. The temperature you can achieve depends on power consumption, the cooler, the contact surfaces and installation. A fixed temperature advantage over other thermal interface materials therefore cannot be specified for every system. Duronaut Pro is currently Thermal Grizzly's highest-performing conventional thermal paste. Thermal Grizzly has not published general W/(m·K) ratings since the end of 2020. A single thermal conductivity value does not allow a reliable comparison of cooling performance, as the test method, temperature, mounting pressure and contact surfaces all affect the result.
There is no universal replacement interval for Duronaut Pro once installed in a system. Check temperatures under comparable loads and at comparable ambient temperatures. Replace the paste if temperatures show a confirmed deterioration or if you have removed the cooler. A universal service life cannot be specified. Duronaut Pro has been optimized for high long-term stability and minimal displacement from the contact area. Nevertheless, apply the paste in a thin, even layer and follow the cooler's mounting instructions. Complete freedom from pump-out cannot be guaranteed in every application. If temperatures rise, first check the cooler installation, cooling performance and contact pattern.
Clean and degrease the CPU or GPU and the cooler's contact surface, then let them dry. Apply Duronaut Pro at room temperature to clean, dry contact surfaces. Use the spatula to spread the paste very slowly into a thin layer, applying even downward pressure. Avoid fast wiping movements, as they can lift the paste off the surface again. A thick consistency is not a defect in itself. It is necessary for long-term stability. Do not use solvents or oils to thin the paste, and do not press on the edges of exposed dies. Warming the product with a hair dryer can make it easier to apply. The amount needed depends on the contact area. Cover it completely with a thin layer, especially on exposed dies. A thick layer or a large amount extending beyond the contact area is not necessary, but is not detrimental either and often makes application easier. However, applying too much does not result in worse temperatures. Excess paste is squeezed out of the gap. TG Spatula Pro is particularly suitable for applying Duronaut Pro. You can also find application video tutorials on the Thermal Grizzly YouTube channel.
Duronaut Pro can be used on CPU and GPU dies in laptops if the cooling system is designed for thermal paste and makes reliable contact. Cover the entire die with a thin layer. Larger gaps around memory and voltage regulators require suitable pads or putty. If pump-out keeps occurring, long-term stability and the specific cooler geometry matter more than a general comparison value. Duronaut Pro is designed for particularly high long-term stability and low pump-out, making it well suited to these applications.
In principle, Duronaut Pro can be used directly on a silicon die if the cooler and its mounting system are designed for this purpose. For Thermal Grizzly direct-die coolers and the underside of our High Performance Heatspreaders, we recommend using liquid metal such as Conductonaut or Conductonaut Extreme. General suitability for thermal paste does not override this product-specific requirement. Duronaut Pro can be affected by pump-out in direct-die CPU applications.
Duronaut Pro is suitable for contact areas in consoles that are designed to use thermal paste. First check the exact console model and the thermal interface materials already in use. The VRAM and VRM pads must remain in place or be replaced with pads of a suitable thickness. A contact area originally designed for liquid metal, such as in a PS5, should not be converted to paste without first checking the cooling design.
If your Duronaut Pro package includes an authentication card, check the code on the official website printed on it. A missing code or different packaging alone does not prove that a product is counterfeit, as package contents and packaging can vary by product and batch. If the code is invalid, send us photos of the product, packaging, code and proof of purchase so we can check them. Whenever possible, buy from a retailer on our reseller list.
In addition to normal use, Duronaut Pro is also very well suited to extreme applications such as extreme overclocking with liquid nitrogen or dry ice.
Duronaut Pro is intended for direct contact between the CPU or GPU and a correctly installed cooler. Conventional thermal pastes can be used on common copper, nickel or aluminum contact surfaces. Follow the cooler manufacturer's instructions. Larger gaps around VRAM or VRMs require suitable pads or putty. The paste is not suitable for bridging gaps larger than 0.2 mm.
First check that the cooler is seated correctly, the mounting pressure is even, the fans or pump are working correctly (for liquid cooling), and the contact surface is fully covered. When reinstalling the cooler, remove old residue and apply a fresh, thin layer of Duronaut Pro. Compare temperatures at the same room temperature and power consumption. CPU boost can turn improved heat transfer into higher performance rather than lower temperatures. Therefore, always check whether the CPU or GPU clock speed has changed as well.
Available instructions, technical data sheets, safety data sheets and conformity documents for Duronaut Pro can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
Thermal Pads
KryoSheet
Choose the size of KryoSheet according to the actual CPU or GPU contact area. You can find a size guide in the KryoSheet downloads section. It lists the most common CPUs and GPUs. KryoSheet should be slightly larger than the area to be covered. Avoid contact with electrically sensitive elements such as SMD components or exposed contacts. If necessary, cover them with TG Shield or TG Kapton Insulation Sheet, for example.
KryoSheet is a dry alternative to thermal paste for low-maintenance, long-term use. KryoSheet and Carbonaut are electrically conductive. KryoSheet offers higher thermal conductivity, while Carbonaut provides a particularly flexible contact surface. PhaseSheet PTM, by contrast, is an electrically non-conductive phase-change material. Choose based on the contact area, mounting pressure and installation requirements. The temperature you can achieve depends on power consumption, the cooler, the contact surfaces and installation. A fixed temperature advantage over other thermal interface materials therefore cannot be specified for every system. Thermal Grizzly has not published general W/(m·K) ratings since the end of 2020. A single thermal conductivity value does not allow a reliable comparison of cooling performance, as the test method, temperature, mounting pressure and contact surfaces all affect the result.
KryoSheet is electrically conductive. The sheet must not touch exposed contacts or adjacent components that are electrically sensitive. If necessary, use suitable insulation outside the thermal contact area. Remove all loose offcuts. If necessary, cover them with TG Shield or TG Kapton Insulation Sheet, for example.
Work on a level surface and place KryoSheet on the side that will not move during installation. For example, place it on the CPU installed in the motherboard, so that only the cooler moves during installation. KryoSheet also includes an application oil. This can be applied to the CPU or GPU before installing KryoSheet and prevents the pad from slipping during installation.
KryoSheet is very well suited to exposed GPU dies and delivers very high performance. In direct-die CPU applications, the power density may be too high, resulting in moderate performance. For these applications, Thermal Grizzly recommends liquid metals such as Conductonaut or Conductonaut Extreme.
We advise against reusing KryoSheet. Removal and repositioning can create invisible microcracks that impair cooling performance. Use a new sheet when changing the cooler. Visible tears, holes or sharp creases are also reasons to replace it. Remove all loose conductive particles. If the sheet arrived damaged, document its condition before installation and contact your local retailer or Thermal Grizzly.
KryoSheet may be suitable for CPU or GPU contact surfaces in a laptop, provided the cooler sits flat and the available mounting pressure is sufficient. Remember that it is electrically conductive and keep the sheet away from adjacent components. Larger gaps, such as those around VRAM or VRMs, must be filled with thermal pads or putty.
Use KryoSheet as the sole thermal interface material between the two contact surfaces. Internal tests did not demonstrate any improvement from additionally using liquid metal or paste between KryoSheet and the surface. Application oil explicitly supplied for installation is a separate matter and must only be used according to the instructions.
The package contains KryoSheet in the selected size. The exact quantity and any installation aids are listed under the corresponding item number. If you think an accessory is missing, always compare the contents with this specific list. Products packaged from 2026 onward include application oil and TG Kapton Insulation Sheet for insulation. An authentication card is not automatically included with every sheet product. Report any listed parts that are missing, and include proof of purchase and a photo of the package.
Check the size and position of KryoSheet, ensure the contact surfaces are clean, and verify the cooler's seating and mounting pressure. KryoSheet requires moderate to high mounting force to work well. Also check the fans or pump (for liquid cooling), and compare temperatures at the same room temperature and power consumption. The sheet must not have slipped or become creased. Unsuitable insulation must not create a gap between the contact surfaces. Follow the cooler manufacturer's specified mounting forces. Tightening further does not compensate for an incorrect setup.
KryoSheet does not dry out like conventional thermal paste and can remain in the system long term if correctly installed and left undisturbed. Routine replacement after a fixed number of years is not intended. When disassembling, mechanical damage and contamination must be taken into account.
KryoSheet requires flat contact surfaces and even mounting pressure within the cooler's specifications. It cannot compensate for a larger mechanical gap or an incorrect mounting height. Tighten the screws only as specified by the cooler manufacturer. The required mounting pressure depends on the contact area and mounting bracket. A mounting pressure above 0.2 N/mm² achieves very good results.
The suitability of KryoSheet depends on the console model, contact area and mounting pressure. Not every sheet is suitable as a replacement for thermal paste at a contact area designed for it. A factory-installed liquid metal setup should not be modified without checking it first either. Pay particular attention to electrical conductivity and clearance from surrounding components. For a specific recommendation, tell us the console model and the contact area concerned.
Carefully lift KryoSheet off the contact surface and avoid pulling on the edges. Then clean the CPU or GPU and the cooler with a material-compatible cleaner and a lint-free cloth, for example TG Cleaning Wipes. Do not wash or soak the sheet itself in an attempt to restore it. Remove all loose conductive particles.
If you have doubts about authenticity, please contact our support team with proof of purchase and photos.
KryoSheet was developed for temperatures from −250 to +150 °C. This range alone does not establish suitability for every mechanical installation or special application. Also observe the temperature limits of the CPU, GPU, cooler and all adjacent materials.
Carbonaut
Choose the size of Carbonaut according to the actual CPU or GPU contact area. A size guide for common CPUs and GPUs is available in the downloads section of the Carbonaut product page. The pad must completely cover the contact area to be cooled. If necessary, carefully cut it to size using sharp scissors or a blade and remove all loose offcuts. Avoid contact with electrically sensitive elements such as SMD components or exposed contacts. If necessary, protect them with TG Shield or TG Kapton Insulation Sheet.
Carbonaut is a dry alternative to thermal paste for low-maintenance, long-term use. KryoSheet and Carbonaut are electrically conductive. KryoSheet offers higher thermal conductivity, while Carbonaut provides a particularly flexible contact surface. PhaseSheet PTM, by contrast, is an electrically non-conductive phase-change material. Choose based on the contact area, mounting pressure and installation requirements. The temperature you can achieve depends on power consumption, the cooler, the contact surfaces and installation. A fixed temperature advantage over other thermal interface materials therefore cannot be specified for every system. Thermal Grizzly has not published general W/(m·K) ratings since the end of 2020. A single thermal conductivity value does not allow a reliable comparison of cooling performance, as the test method, temperature, mounting pressure and contact surfaces all affect the result.
Use Carbonaut as the sole thermal interface material between the two contact surfaces. An additional layer of thermal paste or liquid metal is not required. Place the pad on the clean, dry contact surfaces and install the cooler according to its instructions.
Carbonaut does not lend itself well to reuse. We therefore advise against reusing it after removal and recommend a new sheet when changing the cooler. Removing and repositioning the material can damage or deform it, so unchanged cooling performance cannot be guaranteed. Visible tears, holes or sharp creases are reasons to replace it. Remove all loose conductive particles. If the sheet arrived damaged, document its condition before installation and contact your local retailer or Thermal Grizzly.
Available instructions, technical data sheets, safety data sheets and conformity documents for Carbonaut can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
Carbonaut is electrically conductive. The sheet must not touch exposed contacts or adjacent components that are electrically sensitive. If necessary, protect them with TG Shield or TG Kapton Insulation Sheet outside the thermal contact area. Remove all loose offcuts.
Carbonaut may be suitable for CPU or GPU contact surfaces in a laptop, provided the cooler sits flat and the available mounting pressure is sufficient. Remember that it is electrically conductive and keep the sheet away from adjacent components. Larger gaps, such as those around VRAM or VRMs, must be filled with thermal pads or putty.
Check the size and position of Carbonaut, ensure the contact surfaces are clean, and verify that the cooler is seated correctly. Carbonaut requires some mounting pressure for good results and even contact with both surfaces. Also check the fans or the pump in liquid-cooled systems, and compare temperatures at the same room temperature and power consumption. The sheet must not have slipped or become creased. Unsuitable insulation must not create a gap between the contact surfaces. Follow the cooler manufacturer's specified mounting forces. Tightening further does not compensate for an incorrect setup.
Work on a level surface and place Carbonaut on the side that will not move during installation. For example, place it on the CPU with the motherboard lying horizontally, and move only the cooler when fitting it. The contact surfaces must be clean and dry. Lower the cooler into place without sliding it sideways, and check that the electrically conductive pad does not touch any adjacent contacts. Do not use untested adhesives, oils or an additional layer of paste to hold it in place. A small amount of thermal paste at the corners can work well as a positioning aid.
Carbonaut is flexible and can work well even at relatively low mounting pressure. Nevertheless, both contact surfaces must sit evenly against it. It is not a replacement for a thermal pad several millimeters thick. The permissible mounting forces for your cooler and the component being cooled remain the governing limits. Carbonaut can work well at mounting pressures of 0.1 N/mm² and above.
Carefully lift Carbonaut off the contact surface and avoid pulling on the edges. Then clean the CPU or GPU and the cooler with a material-compatible cleaner and a lint-free cloth, for example TG Cleaning Wipes. Do not wash or soak the sheet itself in an attempt to restore it. Remove all loose conductive particles.
Carbonaut does not dry out like conventional thermal paste and can remain in the system long term if correctly installed and left undisturbed. Routine replacement after a fixed number of years is not intended. When disassembling, mechanical damage and contamination must be taken into account.
Carbonaut can work well on GPUs with low to moderate power consumption and power density. For high-end graphics cards, KryoSheet or PhaseSheet PTM should be used as an alternative. Carbonaut is not suitable for direct-die CPU applications.
PhaseSheet PTM
PhaseSheet PTM is available in a 50 × 40 mm size. If necessary, cut the material to size with sharp scissors or a blade on a clean surface, avoiding stretching or creasing it. If possible, leave the protective films on the material when cutting it, and remove one side only when installing the cooler. PhaseSheet PTM can extend beyond the area to be covered without any problems. This can make application easier. The sheet does not replace thicker gap fillers around memory or voltage regulators.
PhaseSheet PTM is an electrically non-conductive phase-change material. It conforms to the contact surfaces as it heats up and requires a break-in period and suitable mounting pressure. KryoSheet and Carbonaut, by contrast, are dry, electrically conductive sheets. PhaseSheet PTM is very well suited to CPUs and GPUs, offering very good durability together with very good performance similar to Duronaut.
PhaseSheet PTM is designed for long-lasting use. It softens when heated and solidifies again when cooled. This reduces displacement from the contact area during temperature changes, known as pump-out. Replacement is generally unnecessary even after many years.
PhaseSheet PTM may be suitable for CPU or GPU contact surfaces in a laptop, provided the cooler sits flat and the available mounting pressure is sufficient. PhaseSheet PTM needs several thermal cycles before its performance stabilizes. It does not replace the thicker thermal pads on VRAM or VRMs.
Cut PhaseSheet PTM to size if necessary. Carefully peel off one protective film, place the material on the cleaned contact surface, then remove the second film. It may help to press PhaseSheet PTM onto the surface before peeling off the second film. No film residue must remain on the sheet before the cooler is fitted. Peel the films off slowly without stretching the material excessively. Small tears in the surface are not a problem. You can also join a torn surface back together. This generally does not affect performance. Then lower the cooler straight into place without sliding it sideways. Do not use additional paste, adhesives or oils to make it stick.
Use PhaseSheet PTM as the sole thermal interface material between the two contact surfaces. An additional layer of paste or liquid metal is not intended and may impair heat transfer or mechanical fit.
Heat and mounting force make PhaseSheet PTM thinner, allowing it to conform to small surface irregularities. A mounting pressure of 0.2 N/mm² or higher is ideal. This specification is not a screw tightening torque. The permissible forces for the CPU, GPU and cooler must not be exceeded. It cannot compensate for larger gaps or tilted contact surfaces.
Check the size and position of PhaseSheet PTM, ensure the contact surfaces are clean, and verify the cooler's seating and mounting pressure. Also check the fans or pump (for liquid cooling), and compare temperatures at the same room temperature and power consumption. Both protective films must be removed. Assess cooling performance only after the specified thermal cycles. It can take more than ten thermal cycles to reach maximum performance. The phase change, and therefore the thermal cycle, begins at around 45 °C. For the break-in period, however, the pad should be heated to above 60 °C and then allowed to cool again. These values refer to the pad temperature, not the CPU or GPU core temperature. Follow the cooler manufacturer's specified mounting forces. Tightening further does not compensate for an incorrect setup.
PhaseSheet PTM is very well suited to exposed GPU dies. For delidded CPUs, the specific cooling solution is also a deciding factor. For direct-die coolers and the underside of the High Performance Heatspreaders, we recommend liquid metal. Due to the low mounting height, these products cannot be combined with every sheet.
With the system disconnected from power, carefully remove PhaseSheet PTM residue using a lint-free cloth such as TG Cleaning Wipes and a cleaner suitable for the contact surfaces, such as isopropyl alcohol. Clean both sides completely and let them dry before installing a new sheet. Do not use a metal blade on an exposed die.
Yes. The phase change, and therefore the thermal cycle, begins at around 45 °C. For the break-in period, however, the pad should be heated to above 60 °C and then allowed to cool again. Performance stabilizes after approximately ten of these thermal cycles. Depending on the setup, additional cycles may be required. The temperature values refer to the pad, not the CPU or GPU core temperature. Use normal, controlled load changes and cooling phases within the hardware's permissible temperature limits. A comparison made immediately after installation is not yet meaningful.
Small areas of damage and tears in PhaseSheet PTM can be compensated for during the phase change, provided the entire contact area remains covered without gaps. You can easily fit missing pieces back into place. Make sure the surface is completely covered.
The package contains PhaseSheet PTM in the selected size and the instructions. No other accessories are included.
The operating temperature range for PhaseSheet PTM is −75 to +150 °C. The phase change only begins above approximately 45 °C. Also observe the temperature limits of the CPU, GPU, cooler and all adjacent materials.
PhaseSheet PTM is not electrically conductive. Nevertheless, it should be neatly installed within the intended contact area. It is not a problem if PhaseSheet PTM covers other components such as SMDs or electrical contacts.
Available instructions, technical data sheets, safety data sheets and conformity documents for PhaseSheet PTM can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
Minus Pad 8
Choose the thickness of Minus Pad 8 according to the specific cooler's requirements or the actual gap and compression behavior. There is no universal pad thickness for a GPU, VRAM or SSD model. A pad that is too thin makes no contact, while one that is too thick can lift the cooler off the main chip. The already-compressed thickness of old pads is only a guide. Compression depends on the original thickness, area and mounting pressure. Check the contact imprint and follow the mounting instructions. An incorrect thickness cannot be compensated for by tightening further. External databases such as paddb.com can provide information on the pad thickness needed for your graphics card. You can measure used pads with a caliper such as TG Caliper. However, bear in mind that the area measured may have been compressed during use and that you may need a slightly larger thickness.
If your Minus Pad 8 package includes an authentication card, check the code on the official website printed on it. A missing code or different packaging alone does not prove that a product is counterfeit, as package contents and packaging can vary by product and batch. If the code is invalid, send us photos of the product, packaging, code and proof of purchase so we can check them. Whenever possible, buy from a retailer on our reseller list.
Minus Pad 8 bridges gaps between components and the cooler. Cooling performance depends on pad thickness, compression and full contact. The Minus Pad series differ in heat transfer and deformability. Therefore, check thickness and contact again when switching series. Minus Pad 8 ranks above Minus Pad Advance in performance. Basic is less expensive and intended for somewhat lower performance requirements, while Pro offers very good performance. Minus Pad Extreme (2) offers the highest performance among Thermal Grizzly pads.
Install Minus Pad 8 on clean contact surfaces without additional thermal paste or liquid metal. At the same time, the main CPU/GPU chip can use the other thermal interface material intended for it. In that case, the materials are used at different contact points. Pads can be stacked, but this may cause some loss of performance.
Available instructions, technical data sheets, safety data sheets and conformity documents for Minus Pad 8 can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
The package contents of Minus Pad 8 depend on the selected size, thickness and pack quantity. Therefore, check the quantity listed for the specific item number. The films on the pads protect them during transport and application and must be removed before installation. If the stated quantity is missing, send us proof of purchase and photos of the packaging and contents.
A fixed replacement interval for Minus Pad 8 is not generally necessary. During maintenance or if temperatures rise, check that the pad is still clean, undamaged and in contact at all intended points. After disassembly, replace pads that are torn, contaminated or permanently deformed in a way that makes them unsuitable.
Check the position and thickness of Minus Pad 8 and the imprint on both contact sides. Remove all protective films and check whether an overly thick pad is lifting the cooler off the CPU/GPU die. Airflow or the liquid cooling loop must also be working properly. Do not increase mounting pressure beyond the permissible installation specification. A pad that is too thin can prevent heat from being transferred.
Minus Pad 8 is intended as a gap filler between components such as VRAM, voltage regulators or SSD components and their cooler. Choose thickness and dimensions according to the cooler's requirements and the actual gap. For the thin interface on a CPU heatspreader or CPU/GPU die, use the thermal interface material intended for that purpose. A Minus Pad is not a replacement there for paste, a liquid metal interface or a suitable sheet.
Minus Pad 8 has an application temperature range of −100 to +250 °C. The temperature limits of the hardware being cooled and its mounting system also apply. Continuous industrial high-temperature applications require a separate assessment of material aging, pressure and contact. Minus Pad 8 is not silicone-free.
Minus Pad 8 can be used in laptops for VRAM, VRMs or other contact areas designed to have a gap. The correct thickness and sufficient mounting pressure are essential. Particularly in laptops, pads that are too thick or too firm can lift the cooler. On CPU and GPU dies, use the thermal interface material intended for that purpose.
Cut Minus Pad 8 to size with sharp scissors or a blade on a clean surface. If possible, leave the protective films on the material while cutting it, and remove one film before installation. Remove the second film only after positioning the pad, as this reduces deformation. The intended component area should be fully covered without obstructing adjacent mechanical contact points.
Minus Pad 8 may adhere slightly, but it is not a mounting adhesive. A heatsink must be held in place by its intended mounting system. Position the pad on clean contact surfaces, fit the cooler without sliding it sideways, and tighten it according to its instructions.
Minus Pad 8 can replace suitable thermal pads on memory, voltage regulators or other gap contact areas in a console. Follow the requirements of the specific console model for pad positions and thicknesses. A universal thickness in millimeters is not reliable. On the main chip, this type of pad is normally not a replacement for the intended paste or liquid metal interface.
Minus Pad 8 is not electrically conductive. Nevertheless, the pad must not obstruct sockets, connector contacts or moving parts, and it does not replace an insulator certified for mains or high voltage. For such a special application, the required electrical insulation must be verified separately.
Small tears are generally not a problem as long as they do not leave a gap after installation. Avoid creases and overlaps, as they can change the mounting height.
Minus Pad Basic
Choose the thickness of Minus Pad Basic according to the specific cooler's requirements or the actual gap and compression behavior. There is no universal pad thickness for a GPU, VRAM or SSD model. A pad that is too thin makes no contact, while one that is too thick can lift the cooler off the main chip. Compression depends on the original thickness, area and mounting pressure. Check the contact imprint and follow the mounting instructions. An incorrect thickness cannot be compensated for by tightening further. External databases such as paddb.com can provide guidance on the pad thickness needed for your graphics card. You can measure used pads with a caliper such as TG Caliper. The area measured may already be compressed. The measurement is therefore only a guide, and the required original thickness may be greater.
Install Minus Pad Basic on clean contact surfaces without additional thermal paste or liquid metal. At the same time, the main CPU/GPU chip can use the other thermal interface material intended for it. In that case, the materials are used at different contact points. Pads can be stacked, but cooling performance may decrease slightly. Make sure the total pad thickness matches the available gap.
Minus Pad Basic bridges gaps between components and the cooler. Cooling performance depends on pad thickness, compression and full contact. The Minus Pad series differ in heat transfer and deformability. Therefore, check thickness and contact again when switching series. Minus Pad Basic is the affordable entry-level option for applications with lower performance requirements. Minus Pad Advance offers higher performance, with Minus Pad 8 positioned above it. Minus Pad Pro offers very good performance. Minus Pad extreme and Minus Pad extreme 2 form the highest-performing group.
Cut Minus Pad Basic to size with sharp scissors or a blade on a clean surface. If possible, leave the protective films on the material when cutting it. First remove one film and position the pad on the contact surface. Only then peel off the second film, so the pad deforms less while being positioned. Both films must be removed before fitting the cooler. The intended component area should be fully covered without obstructing adjacent mechanical contact points.
Minus Pad Advance
Choose the thickness of Minus Pad Advance according to the specific cooler's requirements or the actual gap and compression behavior. There is no universal pad thickness for a GPU, VRAM or SSD model. A pad that is too thin makes no contact, while one that is too thick can lift the cooler off the main chip. Compression depends on the original thickness, area and mounting pressure. Check the contact imprint and follow the mounting instructions. An incorrect thickness cannot be compensated for by tightening further. External databases such as paddb.com can provide guidance on the pad thickness needed for your graphics card. You can measure used pads with a caliper such as TG Caliper. The area measured may already be compressed. The measurement is therefore only a guide, and the required original thickness may be greater.
Minus Pad Advance bridges gaps between components and the cooler. Cooling performance depends on pad thickness, compression and full contact. The Minus Pad series differ in heat transfer and deformability. Therefore, check thickness and contact again when switching series. Minus Pad Advance offers better performance and greater compressibility than Minus Pad Basic. Minus Pad 8 ranks above Advance in performance. Minus Pad Pro offers very good performance. Minus Pad extreme and Minus Pad extreme 2 form the highest-performing group.
Install Minus Pad Advance on clean contact surfaces without additional thermal paste or liquid metal. At the same time, the main CPU/GPU chip can use the other thermal interface material intended for it. In that case, the materials are used at different contact points. Pads can be stacked, but cooling performance may decrease slightly. Make sure the total pad thickness matches the available gap.
Check the position and thickness of Minus Pad Advance and the imprint on both contact sides. Remove all protective films and check whether an overly thick pad is lifting the cooler off the CPU/GPU die. Airflow or the liquid cooling loop must also be working properly. Do not increase mounting pressure beyond the permissible installation specification. A pad that is too thin may fail to contact the cooler, preventing heat from being transferred through the pad as intended.
The package contents of Minus Pad Advance depend on the selected size, thickness and pack quantity. Therefore, check the quantity listed for the specific item number. The films on the pads protect them during transport and application. First remove the film on the contact side, then remove the second film after positioning the pad and before installing the cooler. If the stated quantity is missing, send us proof of purchase and photos of the packaging and contents.
Minus Pad Advance is intended as a gap filler between components such as VRAM, voltage regulators or SSD components and their cooler. Choose thickness and dimensions according to the cooler's requirements and the actual gap. For the thin interface on a CPU heatspreader or CPU/GPU die, use the thermal interface material intended for that purpose. A Minus Pad is not a replacement there for paste, a liquid metal interface or a suitable sheet.
Carefully peel off the old Minus Pad Advance and remove residue from suitable contact surfaces using a lint-free cloth, such as TG Cleaning Wipes, and a material-compatible cleaner. Do not use a metal blade on small components. Let the contact surfaces dry. Remove one protective film from the new pad before placing it, and remove the second only once the pad is correctly positioned. Then install the cooler. Manufacturer labels on SSDs should not be removed solely to change a pad.
A fixed replacement interval for Minus Pad Advance is not generally necessary. During maintenance or if temperatures rise, check that the pad is still clean and makes full contact at all intended points. Small tears alone do not require replacement as long as they do not create a gap. Replace pads that are contaminated or no longer make even contact due to damage or permanent deformation.
Minus Pad Advance can be used in laptops for VRAM, VRMs or other contact areas designed to have a gap. The correct thickness and sufficient mounting pressure are essential. Particularly in laptops, pads that are too thick or too firm can lift the cooler. On CPU and GPU dies, use the thermal interface material intended for that purpose.
No. Minus Pad Advance is intended for larger gaps around components such as VRAM and VRMs. For direct contact with a CPU or GPU die, you need the thin thermal interface material specified for the cooler. An incorrect pad thickness can prevent other components from making contact or exert excessive forces on the die.
Minus Pad Advance can replace suitable thermal pads on memory, voltage regulators or other gap contact areas in a console. Follow the requirements of the specific console model for pad positions and thicknesses. A universal thickness in millimeters is not reliable. On the main chip, this type of pad is normally not a replacement for the intended paste or liquid metal interface.
Minus Pad Pro
Choose the thickness of Minus Pad Pro according to the specific cooler's requirements or the actual gap and compression behavior. There is no universal pad thickness for a GPU, VRAM or SSD model. A pad that is too thin makes no contact, while one that is too thick can lift the cooler off the main chip. Compression depends on the original thickness, area and mounting pressure. Check the contact imprint and follow the mounting instructions. An incorrect thickness cannot be compensated for by tightening further. External databases such as paddb.com can provide guidance on the pad thickness needed for your graphics card. You can measure used pads with a caliper such as TG Caliper. The area measured may already be compressed. The measurement is therefore only a guide, and the required original thickness may be greater.
Install Minus Pad Pro on clean contact surfaces without additional thermal paste or liquid metal. At the same time, the main CPU/GPU chip can use the other thermal interface material intended for it. In that case, the materials are used at different contact points. Pads can be stacked, but cooling performance may decrease slightly. Make sure the total pad thickness matches the available gap.
Minus Pad Pro bridges gaps between components and the cooler. Cooling performance depends on pad thickness, compression and full contact. The Minus Pad series differ in heat transfer and deformability. Therefore, check thickness and contact again when switching series. Minus Pad Pro offers very good performance and high compressibility. Minus Pad Basic is the affordable entry-level option, while Advance offers higher performance than Basic. Minus Pad 8 ranks above Advance in performance. Minus Pad extreme and Minus Pad extreme 2 form the highest-performing group.
The package contents of Minus Pad Pro depend on the selected size, thickness and pack quantity. Therefore, check the quantity listed for the specific item number. The films on the pads protect them during transport and application. First remove the film on the contact side, then remove the second film after positioning the pad and before installing the cooler. If the stated quantity is missing, send us proof of purchase and photos of the packaging and contents.
A fixed replacement interval for Minus Pad Pro is not generally necessary. During maintenance or if temperatures rise, check that the pad is still clean and makes full contact at all intended points. Small tears alone do not require replacement as long as they do not create a gap. Replace pads that are contaminated or no longer make even contact due to damage or permanent deformation.
Minus Pad Pro is intended as a gap filler between components such as VRAM, voltage regulators or SSD components and their cooler. Choose thickness and dimensions according to the cooler's requirements and the actual gap. For the thin interface on a CPU heatspreader or CPU/GPU die, use the thermal interface material intended for that purpose. A Minus Pad is not a replacement there for paste, a liquid metal interface or a suitable sheet.
Minus Pad Pro can be used in laptops for VRAM, VRMs or other contact areas designed to have a gap. The correct thickness and sufficient mounting pressure are essential. Particularly in laptops, pads that are too thick or too firm can lift the cooler. On CPU and GPU dies, use the thermal interface material intended for that purpose.
Check the position and thickness of Minus Pad Pro and the imprint on both contact sides. Remove all protective films and check whether an overly thick pad is lifting the cooler off the CPU/GPU die. Airflow or the liquid cooling loop must also be working properly. Do not increase mounting pressure beyond the permissible installation specification. A pad that is too thin may fail to contact the cooler, preventing heat from being transferred through the pad as intended.
Minus Pad Pro can be reused if it is clean and, at a suitable thickness, fully touches both contact surfaces. Small tears are generally not a problem as long as they do not leave a gap after installation. Avoid creases and overlaps, as they can change the mounting height. Replace the pad if it is contaminated, has gaps or no longer makes full contact due to permanent deformation.
Minus Pad Pro is not electrically conductive. Nevertheless, the pad must not obstruct sockets, connector contacts or moving parts, and it does not replace an insulator certified for mains or high voltage. For such a special application, the required electrical insulation must be verified separately.
Cut Minus Pad Pro to size with sharp scissors or a blade on a clean surface. If possible, leave the protective films on the material when cutting it. First remove one film and position the pad on the contact surface. Only then peel off the second film, so the pad deforms less while being positioned. Both films must be removed before fitting the cooler. The intended component area should be fully covered without obstructing adjacent mechanical contact points.
Carefully peel off the old Minus Pad Pro and remove residue from suitable contact surfaces using a lint-free cloth and a material-compatible cleaner, such as TG Cleaning Wipes. Do not use a metal blade on small components. Let the contact surfaces dry. Remove one protective film from the new pad before placing it, and remove the second only once the pad is correctly positioned. Then install the cooler. Manufacturer labels on SSDs should not be removed solely to change a pad.
Minus Pad Pro can replace suitable thermal pads on memory, voltage regulators or other gap contact areas in a console. Follow the requirements of the specific console model for pad positions and thicknesses. A universal thickness in millimeters is not reliable. On the main chip, this type of pad is normally not a replacement for the intended paste or liquid metal interface.
If your Minus Pad Pro package includes an authentication card, check the code on the official website printed on it. A missing code or different packaging alone does not prove that a product is counterfeit, as package contents and packaging can vary by product and batch. If the code is invalid, send us photos of the product, packaging, code and proof of purchase so we can check them. Whenever possible, buy from a retailer on our reseller list.
Available instructions, technical data sheets, safety data sheets and conformity documents for Minus Pad Pro can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
No. Minus Pad Pro is intended for larger gaps around components such as VRAM and VRMs. For direct contact with a CPU or GPU die, you need the thin thermal interface material specified for the cooler. An incorrect pad thickness can prevent other components from making contact or exert excessive forces on the die.
Minus Pad extreme
Choose the thickness of Minus Pad extreme according to the specific cooler's requirements or the actual gap and compression behavior. There is no universal pad thickness for a GPU, VRAM or SSD model. A pad that is too thin makes no contact, while one that is too thick can lift the cooler off the main chip. Compression depends on the original thickness, area and mounting pressure. Check the contact imprint and follow the mounting instructions. An incorrect thickness cannot be compensated for by tightening further. External databases such as paddb.com can provide guidance on the pad thickness needed for your graphics card. You can measure used pads with a caliper such as TG Caliper. The area measured may already be compressed. The measurement is therefore only a guide, and the required original thickness may be greater.
Minus Pad extreme bridges gaps between components and the cooler. Cooling performance depends on pad thickness, compression and full contact. The Minus Pad series differ in heat transfer and deformability. Therefore, check thickness and contact again when switching series. Together with Minus Pad extreme 2, Minus Pad extreme is among the highest-performing Thermal Grizzly pads. Basic is the affordable entry-level option, while Advance offers higher performance than Basic. Minus Pad 8 ranks above Advance in performance, while Pro offers very good performance.
Minus Pad extreme is intended as a gap filler between components such as VRAM, voltage regulators or SSD components and their cooler. Choose thickness and dimensions according to the cooler's requirements and the actual gap. For the thin interface on a CPU heatspreader or CPU/GPU die, use the thermal interface material intended for that purpose. A Minus Pad is not a replacement there for paste, a liquid metal interface or a suitable sheet.
Install Minus Pad extreme on clean contact surfaces without additional thermal paste or liquid metal. At the same time, the main CPU/GPU chip can use the other thermal interface material intended for it. In that case, the materials are used at different contact points. Pads can be stacked, but cooling performance may decrease slightly. Make sure the total pad thickness matches the available gap.
The package contents of Minus Pad extreme depend on the selected size, thickness and pack quantity. Therefore, check the quantity listed for the specific item number. The films on the pads protect them during transport and application. First remove the film on the contact side, then remove the second film after positioning the pad and before installing the cooler. If the stated quantity is missing, send us proof of purchase and photos of the packaging and contents.
A fixed replacement interval for Minus Pad extreme is not generally necessary if it is correctly installed and left undisturbed. If temperatures rise, check that the pad still makes full contact at all intended points. Small tears during the initial installation are generally not a problem as long as they do not create a gap. However, due to the substantial plastic deformation, we recommend only one installation. Use a new pad after disassembly.
Available instructions, technical data sheets, safety data sheets and conformity documents for Minus Pad extreme can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
Check the position and thickness of Minus Pad extreme and the imprint on both contact sides. Remove all protective films and check whether an overly thick pad is lifting the cooler off the CPU/GPU die. Airflow or the liquid cooling loop must also be working properly. Do not increase mounting pressure beyond the permissible installation specification. A pad that is too thin may fail to contact the cooler, preventing heat from being transferred through the pad as intended.
Minus Pad extreme is not electrically conductive. Nevertheless, the pad must not obstruct sockets, connector contacts or moving parts, and it does not replace an insulator certified for mains or high voltage. For such a special application, the required electrical insulation must be verified separately.
Minus Pad extreme can be used in laptops for VRAM, VRMs or other contact areas designed to have a gap. The correct thickness and sufficient mounting pressure are essential. Particularly in laptops, pads that are too thick or too firm can lift the cooler. On CPU and GPU dies, use the thermal interface material intended for that purpose.
Cut Minus Pad extreme to size with sharp scissors or a blade on a clean surface. If possible, leave the protective films on the material when cutting it. First remove one film and position the pad on the contact surface. Only then peel off the second film, so the pad deforms less while being positioned. Both films must be removed before fitting the cooler. The intended component area should be fully covered without obstructing adjacent mechanical contact points.
Minus Pad extreme may adhere slightly, but it is not a mounting adhesive. A heatsink must be held in place by its intended mounting system. Position the pad on clean contact surfaces, fit the cooler without sliding it sideways, and tighten it according to its instructions.
Small tears are generally not a problem as long as they do not leave a gap after installation and the contact area remains fully covered. Avoid creases and overlaps, as they can change the mounting height. This statement applies to small tears during the initial installation. Due to the substantial plastic deformation, we recommend only one installation for Minus Pad extreme.
Minus Pad extreme can replace suitable thermal pads on memory, voltage regulators or other gap contact areas in a console. Follow the requirements of the specific console model for pad positions and thicknesses. A universal thickness in millimeters is not reliable. On the main chip, this type of pad is normally not a replacement for the intended paste or liquid metal interface.
Minus Pad extreme has an application temperature range of −100 to +200 °C and is not silicone-free. The temperature limits of the hardware being cooled and its mounting system also apply. Continuous industrial high-temperature applications require a separate assessment of material aging, pressure and contact. This temperature range applies to the original extreme version.
No. Minus Pad extreme is intended for larger gaps around components such as VRAM and VRMs. For direct contact with a CPU or GPU die, you need the thin thermal interface material specified for the cooler. An incorrect pad thickness can prevent other components from making contact or exert excessive forces on the die.
Minus Pad extreme 2
Choose the thickness of Minus Pad extreme 2 according to the specific cooler's requirements or the actual gap and compression behavior. There is no universal pad thickness for a GPU, VRAM or SSD model. A pad that is too thin makes no contact, while one that is too thick can lift the cooler off the main chip. Compression depends on the original thickness, area and mounting pressure. Check the contact imprint and follow the mounting instructions. An incorrect thickness cannot be compensated for by tightening further. External databases such as paddb.com can provide guidance on the pad thickness needed for your graphics card. You can measure used pads with a caliper such as TG Caliper. The area measured may already be compressed. The measurement is therefore only a guide, and the required original thickness may be greater.
Minus Pad extreme 2 bridges gaps between components and the cooler. Cooling performance depends on pad thickness, compression and full contact. The Minus Pad series differ in heat transfer and deformability. Therefore, check thickness and contact again when switching series. Together with Minus Pad extreme, Minus Pad extreme 2 is among the highest-performing Thermal Grizzly pads. Compared with its predecessor, it offers a softer consistency and lower thermal contact resistance while maintaining similarly high thermal conductivity. Basic is the affordable entry-level option, while Advance offers higher performance than Basic. Minus Pad 8 ranks above Advance in performance, while Pro offers very good performance.
Minus Pad extreme 2 is intended as a gap filler between components such as VRAM, voltage regulators or SSD components and their cooler. Choose thickness and dimensions according to the cooler's requirements and the actual gap. For the thin interface on a CPU heatspreader or CPU/GPU die, use the thermal interface material intended for that purpose. A Minus Pad is not a replacement there for paste, a liquid metal interface or a suitable sheet.
The package contents of Minus Pad extreme 2 depend on the selected size, thickness and pack quantity. Therefore, check the quantity listed for the specific item number. The films on the pads protect them during transport and application. First remove the film on the contact side, then remove the second film after positioning the pad and before installing the cooler. If the stated quantity is missing, send us proof of purchase and photos of the packaging and contents.
Minus Pad extreme 2 can be used in laptops for VRAM, VRMs or other contact areas designed to have a gap. The correct thickness and sufficient mounting pressure are essential. Particularly in laptops, pads that are too thick or too firm can lift the cooler. On CPU and GPU dies, use the thermal interface material intended for that purpose.
Install Minus Pad extreme 2 on clean contact surfaces without additional thermal paste or liquid metal. At the same time, the main CPU/GPU chip can use the other thermal interface material intended for it. In that case, the materials are used at different contact points. Pads can be stacked, but cooling performance may decrease slightly. Make sure the total pad thickness matches the available gap.
Small tears are generally not a problem as long as they do not leave a gap after installation and the contact area remains fully covered. Avoid creases and overlaps, as they can change the mounting height.
Cut Minus Pad extreme 2 to size with sharp scissors or a blade on a clean surface. If possible, leave the protective films on the material when cutting it. First remove one film and position the pad on the contact surface. Only then peel off the second film, so the pad deforms less while being positioned. Both films must be removed before fitting the cooler. The intended component area should be fully covered without obstructing adjacent mechanical contact points.
Check the position and thickness of Minus Pad extreme 2 and the imprint on both contact sides. Remove all protective films and check whether an overly thick pad is lifting the cooler off the CPU/GPU die. Airflow or the liquid cooling loop must also be working properly. Do not increase mounting pressure beyond the permissible installation specification. A pad that is too thin may fail to contact the cooler, preventing heat from being transferred through the pad as intended.
A fixed replacement interval for Minus Pad extreme 2 is not generally necessary. During maintenance or if temperatures rise, check that the pad is still clean and makes full contact at all intended points. Small tears alone do not require replacement as long as they do not create a gap. Replace pads that are contaminated or no longer make even contact due to damage or permanent deformation.
Available instructions, technical data sheets, safety data sheets and conformity documents for Minus Pad extreme 2 can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
Minus Pad High Compression
Choose the thickness of Minus Pad High Compression according to the cooler's requirements and the actual gap. The pad can be compressed particularly strongly. What matters is that it fully touches both contact surfaces after installation. A pad that is too thin makes no contact, while one that is too thick can lift the cooler off the main chip. Compression depends on the original thickness, area and mounting pressure. External databases such as paddb.com can provide guidance on pad thickness. You can measure used pads with a caliper such as TG Caliper. Already-compressed areas are only a guide. The required original thickness may be greater. Check the contact imprint and follow the mounting instructions. An incorrect thickness cannot be compensated for by tightening further.
Minus Pad High Compression bridges gaps between components and the cooler. Cooling performance depends on pad thickness, compression and full contact. This series is characterized by its very high compressibility. This allows the pad to adapt well to different component heights. The Minus Pad series differ in heat transfer and deformability. Choose the series according to the required cooling performance and installation conditions. Therefore, check thickness and contact again when switching series. Minus Pad High Compression ranks slightly above Minus Pad Advance in performance.
The package contents of Minus Pad High Compression depend on the selected size, thickness and pack quantity. Therefore, check the quantity listed for the specific item number. The films on the pads protect them during transport and application. First remove the film on the contact side, then remove the second film after positioning the pad and before installing the cooler. If the stated quantity is missing, send us proof of purchase and photos of the packaging and contents.
Install Minus Pad High Compression on clean contact surfaces without additional thermal paste or liquid metal. At the same time, the main CPU/GPU chip can use the other thermal interface material intended for it. In that case, the materials are used at different contact points. Pads can be stacked, but cooling performance may decrease slightly. Make sure the total pad thickness matches the available gap, and account for the particularly high compressibility during installation.
A fixed replacement interval for Minus Pad High Compression is not generally necessary. During maintenance or if temperatures rise, check that the pad is still clean and makes full contact at all intended points. Small tears alone do not require replacement as long as they do not create a gap. Replace pads that are contaminated or no longer make even contact due to damage or permanent deformation.
Available instructions, technical data sheets, safety data sheets and conformity documents for Minus Pad High Compression can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
Minus Pad High Compression is not electrically conductive. Nevertheless, the pad must not obstruct sockets, connector contacts or moving parts, and it does not replace an insulator certified for mains or high voltage. For such a special application, the required electrical insulation must be verified separately.
Minus Pad High Compression can be used in laptops for VRAM, VRMs or other contact areas designed to have a gap. Its particularly high compressibility allows it to adapt well to different component heights. The correct thickness and full contact after installation remain essential. Even a highly compressible pad should not be unnecessarily thick, as it could otherwise lift the cooler. Follow the device's mounting instructions. On CPU and GPU dies, use the thermal interface material intended for that purpose.
Minus Pad High Compression can replace suitable thermal pads on memory, voltage regulators or other gap contact areas in a console. Follow the requirements of the specific console model for pad positions and thicknesses. A universal thickness in millimeters is not reliable. On the main chip, this type of pad is normally not a replacement for the intended paste or liquid metal interface.
Check the position and thickness of Minus Pad High Compression and the imprint on both contact sides. Account for its particularly high compressibility and check that contact is maintained everywhere after installation. Remove all protective films and check whether an overly thick pad is lifting the cooler off the CPU/GPU die. A pad that is too thin may fail to contact the cooler, preventing heat from being transferred through the pad as intended. Airflow or the liquid cooling loop must also be working properly. Do not increase mounting pressure beyond the permissible installation specification.
If your Minus Pad High Compression package includes an authentication card, check the code on the official website printed on it. A missing code or different packaging alone does not prove that a product is counterfeit, as package contents and packaging can vary by product and batch. If the code is invalid, send us photos of the product, packaging, code and proof of purchase so we can check them. Whenever possible, buy from a retailer on our reseller list.
Putty
TG Putty Basic
TG Putty Basic, Advance and Pro are moldable gap fillers for the same intended use. Thermal performance increases within the series from Basic to Advance to Pro. The correct amount, suitable gap height and full contact remain essential. Thermal Grizzly has not published general W/(m·K) ratings since the end of 2020. Putty generally performs slightly better than traditional pads. In terms of performance, TG Putty Basic is comparable to Minus Pad Advance, while TG Putty Advance sits between Minus Pad Advance and Minus Pad Pro. TG Putty Pro performs slightly better than Minus Pad Pro.
TG Putty Basic is an electrically non-conductive gap filler for contact areas such as VRAM and VRMs. It compensates for height differences of approximately 0.2 to 3.0 mm. Putty is not intended for the CPU IHS or for direct use on CPU and GPU dies. Use the thin thermal interface material specified by the cooler manufacturer there.
The package includes TG Putty Basic in the selected quantity, two gloves and three TG Spatula Pro spatulas. If an explicitly listed spatula or another accessory is missing, send us proof of purchase and a photo of the package contents.
If your TG Putty Basic package includes an authentication card, check the code on the official website printed on it. A missing code or different packaging alone does not prove that a product is counterfeit, as package contents and packaging can vary by product and batch. If the code is invalid, send us photos of the product, packaging, code and proof of purchase so we can check them. Whenever possible, buy from a retailer on our reseller list.
During installation, TG Putty Basic conforms to the gap and is displaced sideways. A little excess putty is generally not a problem, provided there is enough room for it to spread sideways. When installing the cooler, use the same mounting pressure as when assembling it with thermal pads.
TG Putty Basic can replace suitable pads or existing putty on VRAM, VRMs and other gap contact areas in laptops. Observe the specified gap range and bear in mind that the cooler often has limited rigidity. Use the appropriate thin thermal interface material on the CPU and GPU themselves. After assembly, check that all main contact surfaces still make contact.
TG Putty Basic can be used as a gap filler at suitable memory or voltage regulator contact areas in a console. Check the positions and clearances of the specific model. It is not a replacement for the thermal paste or liquid metal on the main chip, nor is it an adhesive for attaching heatsinks.
Store TG Putty Basic in its tightly sealed original container in a dry place, protected from direct sunlight and major temperature fluctuations. Only use clean tools to remove material from the container. Check older or previously opened products for contamination and noticeable changes. Unopened putty has a shelf life of approximately 10 years. Once opened, it should be used within 5 years.
If correctly installed, TG Putty Basic can remain in the system for an extended period. Routine annual replacement is not necessary. Monitor temperatures under comparable operating conditions. If contact, consistency or cleanliness has changed significantly, replace the material and check the cooler setup at the same time. An unlimited service life cannot be guaranteed.
Clean the intended contact areas and apply TG Putty Basic only where a gap between a component and the cooler needs to be bridged. Use a clean spatula or gloves to form suitably sized portions. The amount needed depends on the contact area and gap height. A small amount of excess putty can move sideways, provided there is enough room. When installing the cooler, use the same mounting pressure as when assembling it with thermal pads. The putty must fully touch both contact surfaces without lifting the cooler off the main chip. On the CPU or GPU die itself, use the thin thermal interface material intended for that purpose.
Available instructions, technical data sheets, safety data sheets and conformity documents for TG Putty Basic can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
TG Putty Advance
TG Putty Advance is an electrically non-conductive gap filler for contact areas such as VRAM and VRMs. It compensates for height differences of approximately 0.2 to 3.0 mm. Putty is not intended for the CPU IHS or for direct use on CPU and GPU dies. Use the thin thermal interface material specified by the cooler manufacturer there.
TG Putty Basic, Advance and Pro are moldable gap fillers for the same intended use. Thermal performance increases within the series from Basic to Advance to Pro. The correct amount, suitable gap height and full contact remain essential. Thermal Grizzly has not published general W/(m·K) ratings since the end of 2020. Putty generally performs slightly better than traditional pads. In terms of performance, TG Putty Basic is comparable to Minus Pad Advance, while TG Putty Advance sits between Minus Pad Advance and Minus Pad Pro. TG Putty Pro performs slightly better than Minus Pad Pro.
Use TG Putty Advance on its own at the respective gap contact area. Do not mix it with paste, liquid metal or other putty products, and do not layer it over old pads. At the same time, a different suitable thermal interface material may be used on the main CPU/GPU chip. The materials are then located in separate areas.
If correctly installed, TG Putty Advance can remain in the system for an extended period. Routine annual replacement is not necessary. Monitor temperatures under comparable operating conditions. If contact, consistency or cleanliness has changed significantly, replace the material and check the cooler setup at the same time. An unlimited service life cannot be guaranteed.
Clean the intended contact areas and apply TG Putty Advance only where a gap between a component and the cooler needs to be bridged. Use a clean spatula or gloves to form suitably sized portions. The amount needed depends on the contact area and gap height. A small amount of excess putty can move sideways, provided there is enough room. When installing the cooler, use the same mounting pressure as when assembling it with thermal pads. The putty must fully touch both contact surfaces without lifting the cooler off the main chip. On the CPU or GPU die itself, use the thin thermal interface material intended for that purpose.
TG Putty Advance can replace suitable pads or existing putty on VRAM, VRMs and other gap contact areas in laptops. Observe the specified gap range and bear in mind that the cooler often has limited rigidity. Use the appropriate thin thermal interface material on the CPU and GPU themselves. After assembly, check that all main contact surfaces still make contact.
TG Putty Advance can generally be reused within one to two years. However, this depends on the temperature range in which the putty was used and whether it has been contaminated, for example by dust. If in doubt, apply new putty.
Check that TG Putty Advance actually touches the intended components and the cooler, and that excess material is not lifting the cooler off the main chip. It must not be used on the CPU/GPU die instead of the specified TIM. Also check the cooler installation, pad or putty positions and airflow. More material does not automatically mean better cooling.
If your TG Putty Advance package includes an authentication card, check the code on the official website printed on it. A missing code or different packaging alone does not prove that a product is counterfeit, as package contents and packaging can vary by product and batch. If the code is invalid, send us photos of the product, packaging, code and proof of purchase so we can check them. Whenever possible, buy from a retailer on our reseller list.
TG Putty Advance has an operating temperature range of −40 to +120 °C. The temperature limits of the components being cooled also apply. Putty is used to thermally bridge suitable gaps, not as a mechanical adhesive. For a continuous special application, gap height, contact surfaces and temperature profile must be assessed together.
TG Putty Advance is not electrically conductive. An additional protective coating is therefore not required solely because of the putty. Nevertheless, keep sockets and connector contacts clean and apply the material only at the intended heat transfer interfaces. Putty is not a certified insulator for high-voltage applications.
The package includes TG Putty Advance in the selected quantity, two gloves and three TG Spatula Pro spatulas. If an explicitly listed spatula or another accessory is missing, send us proof of purchase and a photo of the package contents.
Store TG Putty Advance in its tightly sealed original container in a dry place, protected from direct sunlight and major temperature fluctuations. Only use clean tools to remove material from the container. Check older or previously opened products for contamination and noticeable changes. Unopened putty has a shelf life of approximately 10 years. Once opened, it should be used within 5 years.
Available instructions, technical data sheets, safety data sheets and conformity documents for TG Putty Advance can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
TG Putty Advance can be used as a gap filler at suitable memory or voltage regulator contact areas in a console. Check the positions and clearances of the specific model. It is not a replacement for the thermal paste or liquid metal on the main chip, nor is it an adhesive for attaching heatsinks.
TG Putty Pro
TG Putty Pro is an electrically non-conductive gap filler for contact areas such as VRAM and VRMs. It compensates for height differences of approximately 0.2 to 3.0 mm. Putty is not intended for the CPU IHS or for direct use on CPU and GPU dies. Use the thin thermal interface material specified by the cooler manufacturer there.
TG Putty Pro can replace suitable pads or existing putty on VRAM, VRMs and other gap contact areas in laptops. Observe the specified gap range and bear in mind that the cooler often has limited rigidity. Use the appropriate thin thermal interface material on the CPU and GPU themselves. After assembly, check that all main contact surfaces still make contact.
The package includes TG Putty Pro in the selected quantity, two gloves and three TG Spatula Pro spatulas. If an explicitly listed spatula or another accessory is missing, send us proof of purchase and a photo of the package contents.
Use TG Putty Pro on its own at the respective gap contact area. Do not mix it with paste, liquid metal or other putty products, and do not layer it over old pads. At the same time, a different suitable thermal interface material may be used on the main CPU/GPU chip. The materials are then located in separate areas.
If your TG Putty Pro package includes an authentication card, check the code on the official website printed on it. A missing code or different packaging alone does not prove that a product is counterfeit, as package contents and packaging can vary by product and batch. If the code is invalid, send us photos of the product, packaging, code and proof of purchase so we can check them. Whenever possible, buy from a retailer on our reseller list.
TG Putty Basic, Advance and Pro are moldable gap fillers for the same intended use. Thermal performance increases within the series from Basic to Advance to Pro. The correct amount, suitable gap height and full contact remain essential. Thermal Grizzly has not published general W/(m·K) ratings since the end of 2020. Putty generally performs slightly better than traditional pads. In terms of performance, TG Putty Basic is comparable to Minus Pad Advance, while TG Putty Advance sits between Minus Pad Advance and Minus Pad Pro. TG Putty Pro performs slightly better than Minus Pad Pro.
If correctly installed, TG Putty Pro can remain in the system for an extended period. Routine annual replacement is not necessary. Monitor temperatures under comparable operating conditions. If contact, consistency or cleanliness has changed significantly, replace the material and check the cooler setup at the same time. An unlimited service life cannot be guaranteed.
During installation, TG Putty Pro conforms to the gap and is displaced sideways. A little excess putty is generally not a problem, provided there is enough room for it to spread sideways. When installing the cooler, use the same mounting pressure as when assembling it with thermal pads.
Store TG Putty Pro in its tightly sealed original container in a dry place, protected from direct sunlight and major temperature fluctuations. Only use clean tools to remove material from the container. Check older or previously opened products for contamination and noticeable changes. Unopened putty has a shelf life of approximately 10 years. Once opened, it should be used within 5 years.
TG Putty Pro has an operating temperature range of −40 to +120 °C. The temperature limits of the components being cooled also apply. Putty is used to thermally bridge suitable gaps, not as a mechanical adhesive. For a continuous special application, gap height, contact surfaces and temperature profile must be assessed together.
TG Putty Pro is not electrically conductive. An additional protective coating is therefore not required solely because of the putty. Nevertheless, keep sockets and connector contacts clean and apply the material only at the intended heat transfer interfaces. Putty is not a certified insulator for high-voltage applications.
TG Putty can generally be reused within one to two years. However, this depends on the temperature range in which the putty was used and whether it has been contaminated, for example by dust. If in doubt, apply new putty.
Check that TG Putty Pro actually touches the intended components and the cooler, and that excess material is not lifting the cooler off the main chip. It must not be used on the CPU/GPU die instead of the specified TIM. Also check the cooler installation, pad or putty positions and airflow. More material does not automatically mean better cooling.
Available instructions, technical data sheets, safety data sheets and conformity documents for TG Putty Pro can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
Liquid Metal
Conductonaut
Yes. With a suitable direct-die cooling solution, Conductonaut can be used directly on silicon and is suitable for our cooling solutions designed for this purpose. Wet both contact surfaces with a very thin layer and protect the surrounding electronic components. The cooler must match the CPU and the reduced mounting height. Using liquid metal does not automatically make a standard CPU cooler suitable for direct-die cooling.
Conductonaut must not come into contact with aluminum. Nickel-plated copper is significantly better suited to a stable long-term application than bare copper. On uncoated copper, however, reactions and discoloration can occur that negatively affect performance. What matters is the actual contact surface, not the material of the fins or housing. If a coating is unknown, confirm its suitability before use.
Conductonaut and Conductonaut Extreme are electrically conductive liquid metal products designed for low thermal contact resistance. Conductonaut Extreme is designed for further-optimized heat transfer. The temperature you can achieve depends on power consumption, the cooler, the contact surfaces and installation. Liquid metals are particularly well suited to direct-die applications and applications with very high power density. Both products require careful wetting of suitable contact surfaces and protection of the surrounding electronics, and must not come into contact with aluminum. Thermal Grizzly has not published general W/(m·K) ratings since the end of 2020. A single thermal conductivity value does not allow a reliable comparison of cooling performance, as the test method, temperature, mounting pressure and contact surfaces all affect the result.
There is no fixed replacement interval for Conductonaut. Service life depends particularly on the contact material and wetting. Particularly on copper surfaces, inspection or reapplication may be needed after a few days or weeks. Monitor temperatures under comparable conditions and inspect the contact surfaces when disassembling. Individual examples of many years of use do not establish an unlimited service life. A liquid metal interface also requires matching contact surfaces that sit evenly against one another. Avoid excessive amounts and mechanical gaps through which material could escape. Apparent drying on copper can also be caused by a reaction with the surface. Therefore, check the material and contact pattern before adding more. Repeatedly adding more without this inspection increases the risk of droplets escaping.
With the system disconnected from power, first carefully collect any freely moving liquid metal using a cloth soaked in isopropyl alcohol or acetone. Avoid skin contact with the cleaning agents. Then clean the contact surfaces with cloths soaked in cleaner. Do not spread droplets across the PCB. Solvents may not remove discoloration or reaction layers that have already formed. TG Metal Polish and Restore can help remove these deposits mechanically.
With the system disconnected from power, check that both contact surfaces are fully wetted with an extremely thin layer, and verify the cooler's seating and mounting height. More liquid metal is not a solution for a mechanical gap. Also check the fans or pump (for liquid cooling) and power consumption. On uncoated copper, a reaction layer may make reapplication necessary. The contact pattern can help determine whether this is necessary. Nickel-plated copper surfaces can also develop reaction layers that require reapplication. Make sure both contact surfaces are completely covered with a very thin layer.
The suitability of Conductonaut in a laptop depends on the cooler base, contact geometry and protection of the electronics. A copper or nickel surface and a suitable cooler that makes secure contact are required. Contact with aluminum is not permitted. In mobile devices, escaping liquid metal increases the risk of damage. Without a validated setup, an electrically non-conductive thermal paste such as Duronaut is the simpler choice.
Clean and dry both contact surfaces. Apply a very small amount of Conductonaut and use the intended applicator to wet the die or heatspreader and the matching cooler surface with an extremely thin film. No freely moving droplets or pools should remain. Protect adjacent components, as liquid metal is electrically conductive. For this purpose, we recommend TG Kapton Insulation Sheet or TG Shield. GPUs can also be protected with the TG GPU Guard. Never use it on aluminum.
For example, Conductonaut can be used to properly renew an existing liquid metal interface in a PS5. The setup must safely contain the liquid metal within the contact area. Existing protective barriers must not be damaged. This is not a general recommendation to convert other consoles from thermal paste to liquid metal.
Available instructions, technical data sheets, safety data sheets and conformity documents for Conductonaut can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
If your Conductonaut package includes an authentication card, check the code on the official website printed on it. A missing code or different packaging alone does not prove that a product is counterfeit, as package contents and packaging can vary by product and batch. If the code is invalid, send us photos of the product, packaging, code and proof of purchase so we can check them. Whenever possible, buy from a retailer on our reseller list.
Yes. Conductonaut is electrically conductive and can cause short circuits. Protect surrounding components with insulation suitable for the installation, and use only a very small amount. For protection, we recommend TG Kapton Insulation Sheet or TG Shield. GPUs can also be protected with the TG GPU Guard. With direct-die coolers, the insulation must not change the contact height. For this purpose, a thin layer of TG Shield is recommended on exposed components such as SMD components and exposed contacts. Do not power on the system if liquid metal has entered the socket or reached electrical contacts.
Liquid metal containing gallium can react with metal surfaces and leave visible marks. A reaction layer can form on copper and nickel-plated copper. Markings on a heatspreader can also be affected. Discoloration alone does not indicate a cooling failure. If temperatures are elevated, material is peeling off or there is visible damage, have the setup inspected and send photos to support before carrying out further work.
Conductonaut can be applied at temperatures from 8 to 150 °C and operated at temperatures from −50 to +200 °C. Application testing is mandatory before mass production. At low temperatures, the state of the alloy can change. Therefore, Conductonaut is not a universally suitable solution for LN2 or arbitrary high-temperature applications.
Conductonaut Extreme
Yes. With a suitable direct-die cooling solution, Conductonaut Extreme can be used directly on silicon and is suitable for our cooling solutions designed for this purpose. Wet both contact surfaces with a very thin layer and protect the surrounding electronic components. The cooler must match the CPU and the reduced mounting height. Using liquid metal does not automatically make a standard CPU cooler suitable for direct-die cooling.
Conductonaut and Conductonaut Extreme are electrically conductive liquid metal products designed for low thermal contact resistance. Conductonaut Extreme is designed for further-optimized heat transfer. The temperature you can achieve depends on power consumption, the cooler, the contact surfaces and installation. Liquid metals are particularly well suited to direct-die applications and applications with very high power density. Both products require careful wetting of suitable contact surfaces and protection of the surrounding electronics, and must not come into contact with aluminum. Thermal Grizzly has not published general W/(m·K) ratings since the end of 2020. A single thermal conductivity value does not allow a reliable comparison of cooling performance, as the test method, temperature, mounting pressure and contact surfaces all affect the result.
Conductonaut Extreme must not come into contact with aluminum. Nickel-plated copper is significantly better suited to a stable long-term application than bare copper. On uncoated copper, however, reactions and discoloration can occur that negatively affect performance. What matters is the actual contact surface, not the material of the fins or housing. If a coating is unknown, confirm its suitability before use.
With the system disconnected from power, first carefully collect any freely moving liquid metal using a cloth soaked in isopropyl alcohol or acetone. Avoid skin contact with the cleaning agents. Then clean the contact surfaces with cloths soaked in cleaner. Do not spread droplets across the PCB. Solvents may not remove discoloration or reaction layers that have already formed. TG Metal Polish and Restore can help remove these deposits mechanically.
With the system disconnected from power, check that both contact surfaces are fully wetted with an extremely thin layer, and verify the cooler's seating and mounting height. More liquid metal is not a solution for a mechanical gap. Also check the fans or pump (for liquid cooling) and power consumption. On uncoated copper, a reaction layer may make reapplication necessary. The contact pattern can help determine whether this is necessary. Nickel-plated copper surfaces can also develop reaction layers that require reapplication. Make sure both contact surfaces are completely covered with a very thin layer.
There is no fixed replacement interval for Conductonaut Extreme. Service life depends particularly on the contact material and wetting. Particularly on copper surfaces, inspection or reapplication may be needed after a few days or weeks. Monitor temperatures under comparable conditions and inspect the contact surfaces when disassembling. Individual examples of many years of use do not establish an unlimited service life. A liquid metal interface also requires matching contact surfaces that sit evenly against one another. Avoid excessive amounts and mechanical gaps through which material could escape. Apparent drying on copper can also be caused by a reaction with the surface. Therefore, check the material and contact pattern before adding more. Repeatedly adding more without this inspection increases the risk of droplets escaping.
The suitability of Conductonaut Extreme in a laptop depends on the cooler base, contact geometry and protection of the electronics. A copper or nickel surface and a suitable cooler that makes secure contact are required. Contact with aluminum is not permitted. In mobile devices, escaping liquid metal increases the risk of damage. Without a validated setup, an electrically non-conductive thermal paste such as Duronaut is the simpler choice.
Clean and dry both contact surfaces. Apply a very small amount of Conductonaut Extreme and use the intended applicator to wet the die or heatspreader and the matching cooler surface with an extremely thin film. No freely moving droplets or pools should remain. Protect adjacent components, as liquid metal is electrically conductive. For this purpose, we recommend TG Kapton Insulation Sheet or TG Shield. GPUs can also be protected with the TG GPU Guard. Never use it on aluminum.
Yes. Conductonaut Extreme is electrically conductive and can cause short circuits. Protect surrounding components with insulation suitable for the installation, and use only a very small amount. For protection, we recommend TG Kapton Insulation Sheet or TG Shield. GPUs can also be protected with the TG GPU Guard. With direct-die coolers, the insulation must not change the contact height. For this purpose, a thin layer of TG Shield is recommended on exposed components such as SMD components and exposed contacts. Do not power on the system if liquid metal has entered the socket or reached electrical contacts.
If your Conductonaut Extreme package includes an authentication card, check the code on the official website printed on it. A missing code or different packaging alone does not prove that a product is counterfeit, as package contents and packaging can vary by product and batch. If the code is invalid, send us photos of the product, packaging, code and proof of purchase so we can check them. Whenever possible, buy from a retailer on our reseller list.
For example, Conductonaut Extreme can be used to properly renew an existing liquid metal interface in a PS5. The setup must safely contain the liquid metal within the contact area. Existing protective barriers must not be damaged. This is not a general recommendation to convert other consoles from thermal paste to liquid metal.
The liquid metal kit includes the syringe and the application and cleaning accessories specified in the item description. For Conductonaut Extreme, the listed contents include a metal dispensing tip and applicators. Check the package contents for your specific pack size. Liquid metal is not automatically included with a separately purchased cooler, heatspreader or delidding tool.
Available instructions, technical data sheets, safety data sheets and conformity documents for Conductonaut Extreme can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
We announce new versions and confirmed release dates for Conductonaut Extreme through our shop and official channels. Until an announcement is published there, we cannot confirm a fixed date or specific features of a successor.
Liquid metal containing gallium can react with metal surfaces and leave visible marks. A reaction layer can form on copper and nickel-plated copper. Markings on a heatspreader can also be affected. Discoloration alone does not indicate a cooling failure. If temperatures are elevated, material is peeling off or there is visible damage, have the setup inspected and send photos to support before carrying out further work.
Conductonaut Extreme is designed for applications around room temperature. If the product became too cold during transport, it may be necessary to heat Conductonaut Extreme to above 30 °C, for example with a hair dryer, to liquefy it again. Conductonaut Extreme is not suitable for extreme overclocking applications at sub-zero temperatures, such as with LN2 or dry ice.
Accessories
TG Shield
TG Shield is suitable for protecting electrically sensitive contacts or components from electrically conductive thermal interface materials such as liquid metal. With non-conductive paste, the coating is normally not needed for short-circuit protection. Use the integrated brush to apply a thin, continuous coat of TG Shield to the SMD components that need protection around the planned liquid metal contact area. The surface must be clean and dry. Keep the actual heat transfer surface, socket contacts and connectors clear. Allow the coating to dry completely before applying liquid metal, and check it for gaps.
Once fully dry, TG Shield forms an electrically insulating protective layer. Liquid metal such as Conductonaut remains electrically conductive itself. Therefore, vulnerable components must be protected without gaps and the heat transfer surfaces must be kept clean. The coating is not a substitute for correct dosing and does not constitute blanket approval for high-voltage applications. TG Shield itself is not electrically conductive when dry.
TG Shield requires approximately 30 minutes of drying time at 20 °C. Thicker layers and unfavorable ambient conditions can extend drying time. Therefore, apply liquid metal only once the layer has dried completely. For removal, use only agents suitable for both the coating and the underlying material. Acetone can dissolve the coating, but it can also attack plastics, markings and adhesives. Therefore, work carefully and do not immerse the entire circuit board. TG Remove can remove TG Shield.
Instructions, technical data sheets, drawings and available safety or conformity documents for TG Shield can be found in the downloads section of the product page. Check that the item number and revision match. A technical data sheet does not replace a safety data sheet. If a file or language version is missing, send us the exact product name and specify the document you need. Public CAD files, additional certificates or formulation details are not available for every product.
TG Shield is supplied in a 5 ml bottle with an integrated application brush. Close it carefully after use. If the bottle is damaged, has leaked or is missing the specified brush, send us proof of purchase and photos of the packaging and contents. For missing parts or accessories needed separately, send us the exact item number, proof of purchase and a photo with the relevant part marked. We will check whether a suitable part is available and what costs or shipping conditions apply. Do not use unverified replacement parts with different dimensions.
Close TG Shield immediately after use and store it in its original packaging according to the label and safety data sheet. Avoid heat, direct sunlight and contamination inside the container. A coating that has thickened significantly or become contaminated should not be thinned with arbitrarily chosen solvents. Unopened TG Shield has a shelf life of 5 years. Once opened, it should be used within 1 year.
TG Remove
TG Remove is intended for removing residue from compatible thermal interface materials and contains acetone. Apply the cleaner carefully to a suitable cloth and clean only compatible surfaces. Keep it away from sensitive plastics, PMMA, markings and adhesives. Work with the device switched off and disconnected from power, ensure good ventilation, and allow the contact surfaces to dry completely before reassembly. Avoid contact with skin.
Check the TG Remove downloads section for the current safety data sheet and any available declarations of conformity. If you need a specific document or language version, send us the exact item number and the type of document required. A technical data sheet does not replace a safety data sheet. Additional certificates or confidential formulation details are not automatically available.
TG Cleaning Wipes
TG Cleaning Wipes are a set of dry and wet cleaning wipes. They are ideal for removing thermal paste or residue from pastes, pads and sheets. TG Cleaning Wipes can also be used to collect liquid metal residue. First clean the surface with the dry wipe to remove the bulk of the residue. Then clean the surface with the wet wipe. As a final step, wipe the surface again with the dry wipe to remove the last traces completely.
Check the TG Cleaning Wipes downloads section for the current safety data sheet and any available declarations of conformity. If you need a specific document or language version, send us the exact item number and the type of document required. A technical data sheet does not replace a safety data sheet. Additional certificates or confidential formulation details are not automatically available.
TG Spatula Pro
TG Spatula Pro helps spread thick thermal pastes evenly with controlled pressure. Work slowly on clean contact surfaces and spread only the required amount into a thin layer. Do not apply high force to exposed dies or their edges. Use very slow movements with thick thermal pastes. Be sure to avoid fast wiping movements. You can also find video tutorials for products such as Duronaut and Duronaut Pro on the Thermal Grizzly YouTube channel.
