TG Minus Pad Advance Thermal Pads

Minus Pad Advance

The Thermal Grizzly Minus Pad Advance thermal pads are part of the Basic, Advance, and Pro series. The Advance pads are easy to use and offer better thermal conductivity and higher compressibility compared to the Basic pads.

Not in stock

$18.60

Content: 20000 mm² ($0.09 / 100 mm²)

Size

100 x 100 mm

120 x 20 mm

Thickness

0.5 mm

1,0 mm

1.5 mm

2,0 mm

3,0 mm

Content

2 pcs.

4 pcs.

EAN: 4260711991370 Copied!

MPN: TG-MP-A-100-100-10-2 Copied!

Product information " Minus Pad Advance"

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

Properties

Very good thermal conductivity
High compressibility
Easy to use
Electrically non-conductive

Comparison of the Minus Pad Basic, Advance, and Pro series

Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.
Minus Pad Advance: Improved thermal conductivity, higher compressibility.
Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher price.

Available in dimensions of 120 x 20 mm and 100 x 100 mm, as well as in thicknesses of 0.5 mm, 1 mm, 1.5 mm, 2 mm, and 3 mm.

Very good thermal conductivity

High compressibility

Easy to use

Electrically non-conductive

Minus Pad Advance

What thickness of Minus Pad Advance do I need, and how do I account for compression and mounting pressure?

Choose the thickness of Minus Pad Advance according to the specific cooler's requirements or the actual gap and compression behavior. There is no universal pad thickness for a GPU, VRAM or SSD model. A pad that is too thin makes no contact, while one that is too thick can lift the cooler off the main chip. Compression depends on the original thickness, area and mounting pressure. Check the contact imprint and follow the mounting instructions. An incorrect thickness cannot be compensated for by tightening further. External databases such as paddb.com can provide guidance on the pad thickness needed for your graphics card. You can measure used pads with a caliper such as TG Caliper. The area measured may already be compressed. The measurement is therefore only a guide, and the required original thickness may be greater.

What cooling performance does Minus Pad Advance offer, and what matters when comparing the thermal pad ranges?

Minus Pad Advance bridges gaps between components and the cooler. Cooling performance depends on pad thickness, compression and full contact. The Minus Pad series differ in heat transfer and deformability. Therefore, check thickness and contact again when switching series. Minus Pad Advance offers better performance and greater compressibility than Minus Pad Basic. Minus Pad 8 ranks above Advance in performance. Minus Pad Pro offers very good performance. Minus Pad extreme and Minus Pad extreme 2 form the highest-performing group.

Can I combine Minus Pad Advance with thermal paste, liquid metal or other thermal interface materials?

Install Minus Pad Advance on clean contact surfaces without additional thermal paste or liquid metal. At the same time, the main CPU/GPU chip can use the other thermal interface material intended for it. In that case, the materials are used at different contact points. Pads can be stacked, but cooling performance may decrease slightly. Make sure the total pad thickness matches the available gap.

Why are temperatures with Minus Pad Advance too high or higher than expected?

Check the position and thickness of Minus Pad Advance and the imprint on both contact sides. Remove all protective films and check whether an overly thick pad is lifting the cooler off the CPU/GPU die. Airflow or the liquid cooling loop must also be working properly. Do not increase mounting pressure beyond the permissible installation specification. A pad that is too thin may fail to contact the cooler, preventing heat from being transferred through the pad as intended.

What is included with Minus Pad Advance, and how can I obtain missing parts?

The package contents of Minus Pad Advance depend on the selected size, thickness and pack quantity. Therefore, check the quantity listed for the specific item number. The films on the pads protect them during transport and application. First remove the film on the contact side, then remove the second film after positioning the pad and before installing the cooler. If the stated quantity is missing, send us proof of purchase and photos of the packaging and contents.

Which components and contact points is Minus Pad Advance suitable for?

Minus Pad Advance is intended as a gap filler between components such as VRAM, voltage regulators or SSD components and their cooler. Choose thickness and dimensions according to the cooler's requirements and the actual gap. For the thin interface on a CPU heatspreader or CPU/GPU die, use the thermal interface material intended for that purpose. A Minus Pad is not a replacement there for paste, a liquid metal interface or a suitable sheet.

How do I remove Minus Pad Advance or clean the contact surfaces?

Carefully peel off the old Minus Pad Advance and remove residue from suitable contact surfaces using a lint-free cloth, such as TG Cleaning Wipes, and a material-compatible cleaner. Do not use a metal blade on small components. Let the contact surfaces dry. Remove one protective film from the new pad before placing it, and remove the second only once the pad is correctly positioned. Then install the cooler. Manufacturer labels on SSDs should not be removed solely to change a pad.

How long does Minus Pad Advance last in use, and when should I replace it?

A fixed replacement interval for Minus Pad Advance is not generally necessary. During maintenance or if temperatures rise, check that the pad is still clean and makes full contact at all intended points. Small tears alone do not require replacement as long as they do not create a gap. Replace pads that are contaminated or no longer make even contact due to damage or permanent deformation.

Where can I use Minus Pad Advance in a laptop, and what should I consider during installation?

Minus Pad Advance can be used in laptops for VRAM, VRMs or other contact areas designed to have a gap. The correct thickness and sufficient mounting pressure are essential. Particularly in laptops, pads that are too thick or too firm can lift the cooler. On CPU and GPU dies, use the thermal interface material intended for that purpose.

Is Minus Pad Advance suitable for direct-die cooling or a delidded CPU?

No. Minus Pad Advance is intended for larger gaps around components such as VRAM and VRMs. For direct contact with a CPU or GPU die, you need the thin thermal interface material specified for the cooler. An incorrect pad thickness can prevent other components from making contact or exert excessive forces on the die.

Can I use Minus Pad Advance in a games console?

Minus Pad Advance can replace suitable thermal pads on memory, voltage regulators or other gap contact areas in a console. Follow the requirements of the specific console model for pad positions and thicknesses. A universal thickness in millimeters is not reliable. On the main chip, this type of pad is normally not a replacement for the intended paste or liquid metal interface.