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Product information "TG Putty Advance"

TG Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for height differences, making it ideal as a replacement for thermal pads on GPUs. 

Graphics cards typically feature several types of thermal pads of varying thicknesses from the factory, requiring different pads during replacement or when converting the cooler to a GPU water cooler.


Variants and Thermal Conductivity

TG Putty is available in three versions that mainly differ in their thermal conductivity.

Each variant is designed for different requirements in heat dissipation and is available in 30 g and 100 g sizes.

  • TG Putty Basic – medium thermal conductivity
  • TG Putty Advance – good thermal conductivity
  • TG Putty Pro – very good thermal conductivity
Variants TG Putty
2-Content_Putty_Advance

Recommended TG Putty Amount

For modifying a single, smaller graphics card without an active backplate (e.g., GeForce GTX 1060), approximately one 30-gram container of TG Putty is required. For larger graphics cards, such as a GeForce RTX 4090, one 30-gram container is generally sufficient for the memory (VRAM) and voltage regulators (VRM) on the front side. On the backside, there is often a uniform, larger gap between the PCB and the backplate on larger graphics cards. In this case, approximately two 30-gram containers are needed to completely fill this gap.

thermal_conductivity_TG
Good thermal conductivity

flexible_TG
Flexible gap filler

check_TG
Easy to use

electrically_non-conductive_TG
Electrically non-conductive

Comparison table Pads
Comparison table Pads

Notes

TG Putty is not suitable for use on processors (IHS or Direct Die) or directly on the GPU die!

Before application, the target surface should be thoroughly cleaned and degreased, for example, using TG Cleaning Wipes or conventional isopropanol.

TG Putty Advance

TG Putty Advance is an electrically non-conductive gap filler for contact areas such as VRAM and VRMs. It compensates for height differences of approximately 0.2 to 3.0 mm. Putty is not intended for the CPU IHS or for direct use on CPU and GPU dies. Use the thin thermal interface material specified by the cooler manufacturer there.
TG Putty Basic, Advance and Pro are moldable gap fillers for the same intended use. Thermal performance increases within the series from Basic to Advance to Pro. The correct amount, suitable gap height and full contact remain essential. Thermal Grizzly has not published general W/(m·K) ratings since the end of 2020. Putty generally performs slightly better than traditional pads. In terms of performance, TG Putty Basic is comparable to Minus Pad Advance, while TG Putty Advance sits between Minus Pad Advance and Minus Pad Pro. TG Putty Pro performs slightly better than Minus Pad Pro.
Use TG Putty Advance on its own at the respective gap contact area. Do not mix it with paste, liquid metal or other putty products, and do not layer it over old pads. At the same time, a different suitable thermal interface material may be used on the main CPU/GPU chip. The materials are then located in separate areas.
If correctly installed, TG Putty Advance can remain in the system for an extended period. Routine annual replacement is not necessary. Monitor temperatures under comparable operating conditions. If contact, consistency or cleanliness has changed significantly, replace the material and check the cooler setup at the same time. An unlimited service life cannot be guaranteed.
Clean the intended contact areas and apply TG Putty Advance only where a gap between a component and the cooler needs to be bridged. Use a clean spatula or gloves to form suitably sized portions. The amount needed depends on the contact area and gap height. A small amount of excess putty can move sideways, provided there is enough room. When installing the cooler, use the same mounting pressure as when assembling it with thermal pads. The putty must fully touch both contact surfaces without lifting the cooler off the main chip. On the CPU or GPU die itself, use the thin thermal interface material intended for that purpose.
TG Putty Advance can replace suitable pads or existing putty on VRAM, VRMs and other gap contact areas in laptops. Observe the specified gap range and bear in mind that the cooler often has limited rigidity. Use the appropriate thin thermal interface material on the CPU and GPU themselves. After assembly, check that all main contact surfaces still make contact.
TG Putty Advance can generally be reused within one to two years. However, this depends on the temperature range in which the putty was used and whether it has been contaminated, for example by dust. If in doubt, apply new putty.
Check that TG Putty Advance actually touches the intended components and the cooler, and that excess material is not lifting the cooler off the main chip. It must not be used on the CPU/GPU die instead of the specified TIM. Also check the cooler installation, pad or putty positions and airflow. More material does not automatically mean better cooling.
If your TG Putty Advance package includes an authentication card, check the code on the official website printed on it. A missing code or different packaging alone does not prove that a product is counterfeit, as package contents and packaging can vary by product and batch. If the code is invalid, send us photos of the product, packaging, code and proof of purchase so we can check them. Whenever possible, buy from a retailer on our reseller list.
TG Putty Advance has an operating temperature range of −40 to +120 °C. The temperature limits of the components being cooled also apply. Putty is used to thermally bridge suitable gaps, not as a mechanical adhesive. For a continuous special application, gap height, contact surfaces and temperature profile must be assessed together.
TG Putty Advance is not electrically conductive. An additional protective coating is therefore not required solely because of the putty. Nevertheless, keep sockets and connector contacts clean and apply the material only at the intended heat transfer interfaces. Putty is not a certified insulator for high-voltage applications.
The package includes TG Putty Advance in the selected quantity, two gloves and three TG Spatula Pro spatulas. If an explicitly listed spatula or another accessory is missing, send us proof of purchase and a photo of the package contents.
Store TG Putty Advance in its tightly sealed original container in a dry place, protected from direct sunlight and major temperature fluctuations. Only use clean tools to remove material from the container. Check older or previously opened products for contamination and noticeable changes. Unopened putty has a shelf life of approximately 10 years. Once opened, it should be used within 5 years.
Available instructions, technical data sheets, safety data sheets and conformity documents for TG Putty Advance can be found in the downloads section of the product page. Check the exact product name and item number. A technical data sheet does not replace a safety data sheet. If a document or language version is missing, tell us the item number and which document you need.
TG Putty Advance can be used as a gap filler at suitable memory or voltage regulator contact areas in a console. Check the positions and clearances of the specific model. It is not a replacement for the thermal paste or liquid metal on the main chip, nor is it an adhesive for attaching heatsinks.
Operating temperature: -40°C to +120°C

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