Delid-Die-Mate
$70.08
Product information "Delid-Die-Mate Intel 13. Gen"
The Delid-Die-Mate Intel 13th Gen is a tool for removing the heat spreader ("delidden") on Intel processors for socket LGA1700. By removing the heat spreader, the CPUs can be cooled via "direct die", for example. With the so-called "direct die", the CPU cooler is mounted directly on the processor chip. By omitting the heat spreader in the cooling circuit, a significantly optimised heat transfer from the die to the CPU cooler is possible.
Properties
- Compatible with 12th/13th/14th Intel Core generation
- Delidding tool
- Made of aluminium
Compatible with 12th, 13th and 14th Gen Intel Core
Delidding tool
optimized cooling performance
made of aluminium
Why "Delidding" & Direct Die method for Intel processors?
Delidding is the process of removing the processor's heat spreader. On unsoldered processors, delidding is typically used to replace the thermal interface material (TIM) between the CPU die and the heat spreader with high-quality thermal compound or liquid metal before the heat spreader is reinstalled. However, since the 13th generation Intel Core processors are soldered, this is not an option, as removing the indium solder would create too large a gap between the IHS and CPU dies.
Therefore, the 13th/14th Gen Intel Core CPUs are primarily delidded for possible mounting of the CPU cooler directly on the CPU dies. By omitting the heat spreader and mounting the CPU cooler directly on the dies, experience shows that temperatures can be reduced by 10-15 °C if liquid metal such as Conductonaut is used as TIM. A corresponding test with an Intel Core i9-13900K was carried out by content creator and Tech-YouTuber Roman "der8auer" Hartung, professional overclocker and engineer.
Scope of Delivery
- 1x Delid-Die-Mate Intel 13. Gen
- 1x Angle wrenches (hex key)
- 1x TG Scraper
| Color: | black, red |
|---|---|
| Material: | Aluminum |
| Socket manufacturer: | Intel |
| Socket type: | LGA 1700 |
Goes perfectly with it:
Liquid metal with minimal layer thickness for ultra-high-performance thermal conductivity in overclocking with increased material compatibility
Liquid metal for overclocking: Highest efficiency and ultra-high thermal conductivity, perfect for experienced users
Efficient applicators for the precise distribution of liquid metal thermal paste like Conductonaut
Allows mounting the cooler directly on the chiplets of the AMD Ryzen 7000 CPU for lower temperatures and better cooling
High-performance heat spreader for Intel and AMD CPUs: maximum heat dissipation through nickel-plated copper and larger precision surface
Pro version of the Intel and AMD direct-die water cooler with an effectively enlarged cooling surface, reduced flow resistance, and integrated RGB lighting.