Go to homepage

Direct Die Frame

The AMD Ryzen 7000 Direct Die Frame is a CPU mounting frame for mounting without the integrated heatspreader. By omitting the heatspreader, the CPU cooler can be mounted directly onto the processor's chiplets, allowing for significantly lower temperatures.

$22.11

Content: 1 pcs.

Prices incl. VAT plus shipping costs

CPU Type
EAN: 4260711990694
MPN: TG-DDF-R7000

Product information "Ryzen 7000 Direct Die Frame"

The AMD Ryzen 7000 Direct Die Frame is a CPU mounting frame for mounting Ryzen 7000 processors without the integrated heat spreader. By omitting the heat spreader, the CPU cooler can be mounted directly on the processor's chiplets, allowing for significantly lower temperatures during operation. This is not only interesting for extreme overclockers on the hunt for records, but also for gamers and content creators.

Direct Die Frame eingebaut in Mainboard

Optimal CPU Cooling Through Delidding and Direct Die

For gaming PCs and desktop workstations, cooling the processor is important so that they are not slowed down during rendering operations, for example, or enable the highest possible FPS when gaming. Silent PCs for multimedia applications also benefit from better heat dissipation from the processor. In addition to a good cooling solution, PC enthusiasts use "delidding" CPUs to optimise heat Dissipation.

When delidding a CPU, the heat spreader of the processor is removed. Often this is done to replace the thermal conductive materials used by the manufacturer with higher quality thermal pastes or liquid metal such as Thermal Grizzly's Conductonaut before the heat spreader is remounted. With the so-called "direct die", the heat spreader is completely omitted so that the base plate of the CPU cooler has direct contact with the CPU.

Direct Heat Transfer and Chiplet Protection

When the CPU cooler is mounted directly on the CPU chips, the heat that is generated during operation of the CPU is dissipated directly to the cooler and does not first have to be transferred through the heat spreader. This makes heat dissipation more efficient and the CPU is cooled better. The purpose of the AMD Ryzen 7000 Direct Die Frame is to protect the exposed chiplets of the Ryzen 7000 CPU. Without a direct die frame, the CPU's function can be impaired by the contact pressure of the CPU cooler. Here, problems with the RAM in particular are very common and, in the worst case, the CPU can become unusable.

properties

  • Compatible with AMD Ryzen 7000
  • Allows mounting of delidded Ryzen CPUs
  • Easy mounting
  • Anodised aluminium
Rückseite Direct Die Frame
Zubehör Direct Die Frame

Scope of delivery

  • 1× Ryzen 7000 Direct Die Frame
  • 4× pan-head screws UNC thread 1/4"
  • 1× hexagon socket wrench 5/64"
  • 1× angle wrench Torx T20

Compatibility Note:

The Ryzen 7000 Direct Die Frame V2 is NOT COMPATIBLE with the APUs of the Ryzen 8000G series as well as the CPUs of the Ryzen 9000 series, including the X3D variants.

(as of March 2025)


Attention:

Removing the heatspreader (“delidding”) of a processor is at your own risk! The manufacturer's warranty expires when the CPU is delidded! Damage caused by delidding the CPU is not covered by the manufacturer's warranty! 

Removing the Socket Actuation Mechanism (SAM) of the mainboard may invalidate the manufacturer's warranty of the mainboard manufacturer!


Product information "Ryzen 7000 Direct Die Frame"

The AMD Ryzen 7000 Direct Die Frame is a CPU mounting frame for mounting Ryzen 7000 processors without the integrated heat spreader. By omitting the heat spreader, the CPU cooler can be mounted directly on the processor's chiplets, allowing for significantly lower temperatures during operation. This is not only interesting for extreme overclockers on the hunt for records, but also for gamers and content creators.

Direct Die Frame eingebaut in Mainboard

Optimal CPU Cooling Through Delidding and Direct Die

For gaming PCs and desktop workstations, cooling the processor is important so that they are not slowed down during rendering operations, for example, or enable the highest possible FPS when gaming. Silent PCs for multimedia applications also benefit from better heat dissipation from the processor. In addition to a good cooling solution, PC enthusiasts use "delidding" CPUs to optimise heat Dissipation.

When delidding a CPU, the heat spreader of the processor is removed. Often this is done to replace the thermal conductive materials used by the manufacturer with higher quality thermal pastes or liquid metal such as Thermal Grizzly's Conductonaut before the heat spreader is remounted. With the so-called "direct die", the heat spreader is completely omitted so that the base plate of the CPU cooler has direct contact with the CPU.

Rückseite Direct Die Frame

Direct Heat Transfer and Chiplet Protection

When the CPU cooler is mounted directly on the CPU chips, the heat that is generated during operation of the CPU is dissipated directly to the cooler and does not first have to be transferred through the heat spreader. This makes heat dissipation more efficient and the CPU is cooled better. The purpose of the AMD Ryzen 7000 Direct Die Frame is to protect the exposed chiplets of the Ryzen 7000 CPU. Without a direct die frame, the CPU's function can be impaired by the contact pressure of the CPU cooler. Here, problems with the RAM in particular are very common and, in the worst case, the CPU can become unusable.

properties

  • Compatible with AMD Ryzen 7000
  • Allows mounting of delidded Ryzen CPUs
  • Easy mounting
  • Anodised aluminium
Zubehör Direct Die Frame

Scope of delivery

  • 1× Ryzen 7000 Direct Die Frame
  • 4× pan-head screws UNC thread 1/4"
  • 1× hexagon socket wrench 5/64"
  • 1× angle wrench Torx T20

Compatibility Note:

The Ryzen 7000 Direct Die Frame V2 is NOT COMPATIBLE with the APUs of the Ryzen 8000G series as well as the CPUs of the Ryzen 9000 series, including the X3D variants.

(as of March 2025)


Attention:

Removing the heatspreader (“delidding”) of a processor is at your own risk! The manufacturer's warranty expires when the CPU is delidded! Damage caused by delidding the CPU is not covered by the manufacturer's warranty! 

Removing the Socket Actuation Mechanism (SAM) of the mainboard may invalidate the manufacturer's warranty of the mainboard manufacturer!


Goes perfectly with it:

Conductonaut Extreme
Conductonaut Extreme
Liquid metal with minimal layer thickness for ultra-high-performance thermal conductivity in overclocking with increased material compatibility

From $24.45
Conductonaut
Conductonaut
Liquid metal for overclocking: Highest efficiency and ultra-high thermal conductivity, perfect for experienced users

From $15.09
TG Kapton Insulation Sheet
TG Kapton Insulation Sheet
Electrically non-conductive polyamide adhesive tape

From $6.90
TG Remove
TG Remove
Effective acetone-based nano-cleaner for removing thermal paste and liquid metal

$13.92
TG Applicator
TG Applicator
Efficient applicators for the precise distribution of liquid metal thermal paste like Conductonaut

$5.73
TG Cleaning Wipes
TG Cleaning Wipes
Wet and dry cleaning wipes for cleaning surfaces

$12.75
TG Shield
TG Shield
High-temperature protective coating, protects against liquid metal, thermal paste, and short circuits

$13.92
Duronaut
Duronaut
High thermal conductivity and exceptional long-term stability, ideal for overclocking and demanding industrial cooling systems

From $13.92
KryonaKryonautut
Kryonaut
High thermal conductivity and long-term stability, ideal for overclocking and critical cooling systems in the industrial sector

From $11.58
Kryonaut Extreme
Kryonaut Extreme
Maximum thermal conductivity and performance for extreme overclocking, high stability, and improved low-temperature resilience

From $27.96
Downloads "Direct Die Frame"
Color: black
Material: Aluminum
Socket manufacturer: AMD
Socket type: AM5
This website uses cookies to ensure the best experience possible. More information …