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Product information "AMD TG Delidded CPU - AMD Ryzen™ 7 9850X3D"

The TG Delidded CPU is a processor delidded by our specialists and subsequently validated. Delidding (to delid: "to remove the lid") a CPU involves removing the processor's heat spreader. While delidding and using appropriate Direct-Die cooling solutions can significantly lower temperatures under load, delidding voids the manufacturer’s warranty. For the TG Delidded CPU, Thermal Grizzly provides a warranty in addition to the legally mandated retailer guarantee!

AMD TG Delidded CPU before packaging

Properties

  • Delidded processor
  • Warranty guaranteed by TG
  • Includes test protocol (screenshot stored on USB stick)
  • Optimal for TG Direct-Die cooling solutions

After the delidding process, the TG Delidded CPU undergoes a thorough cleaning before being subjected to a functionality test. The measured temperature during testing is recorded via screenshot and saved on a USB stick, which is included with the processor. Additionally, the USB stick contains a microscope image of the delidded processor.

Best possible cooling performance in combination with our products

For optimal thermal performance, we recommend using Conductonaut Extreme on the CPU die or chiplets in combination with our direct-die cooling solutions (Mycro Direct-Die, Mycro Direct-Die Pro, High Performance Heatspreader). 

When using liquid metal, the exposed electronic components (SMDs) on the CPU package should be protected with a TG Kapton Insulation Sheet or TG Shield.

⚠️ Attention: Important Warranty Notice Regarding Use of the Original Heatspreader!

The stock heatspreader included with the product must never be used under any circumstances! 

Using the AMD heatspreader will void the warranty provided by Thermal Grizzly! 

Liquid metal and other thermal interface materials cannot fully bridge the height difference between the CPU chiplets and the original heatspreader, which can lead to processor damage.


Everything related to the TG Delidded CPU

More information about the provided warranty can be found here.

In case of any issues with the products or questions regarding warranty and guarantee, the Thermal Grizzly customer service team can be contacted at any time. The best way to do so is by using the contact form on the Thermal Grizzly shop website.

Important Note:

The TG Delidded CPU AMD Ryzen™ 7 9850X3D is not compatible with AMD Direct Die Frames! 

The CPU is cleaned after delidding. However, residues may remain on the silicon of the chiplets due to the testing process. During the delidding process, cosmetic imperfections (small cracks or chips) may appear on the PCB or the dies. These do not affect functionality, as validated by the testing process.


Scope of Delivery

  • TG Delidded CPU
  • Heat spreader of the CPU
  • USB stick
AMD TG Delidded CPU package contents

Product information "AMD TG Delidded CPU - AMD Ryzen™ 7 9850X3D"

The TG Delidded CPU is a processor delidded by our specialists and subsequently validated. Delidding (to delid: "to remove the lid") a CPU involves removing the processor's heat spreader. While delidding and using appropriate Direct-Die cooling solutions can significantly lower temperatures under load, delidding voids the manufacturer’s warranty. For the TG Delidded CPU, Thermal Grizzly provides a warranty in addition to the legally mandated retailer guarantee!

AMD TG Delidded CPU before packaging

Properties

  • Delidded processor
  • Warranty guaranteed by TG
  • Includes test protocol (screenshot stored on USB stick)
  • Optimal for TG Direct-Die cooling solutions

After the delidding process, the TG Delidded CPU undergoes a thorough cleaning before being subjected to a functionality test. The measured temperature during testing is recorded via screenshot and saved on a USB stick, which is included with the processor. Additionally, the USB stick contains a microscope image of the delidded processor.

Best possible cooling performance in combination with our products

For optimal thermal performance, we recommend using Conductonaut Extreme on the CPU die or chiplets in combination with our direct-die cooling solutions (Mycro Direct-Die, Mycro Direct-Die Pro, High Performance Heatspreader). 

When using liquid metal, the exposed electronic components (SMDs) on the CPU package should be protected with a TG Kapton Insulation Sheet or TG Shield.

⚠️ Attention: Important Warranty Notice Regarding Use of the Original Heatspreader!

The stock heatspreader included with the product must never be used under any circumstances! 

Using the AMD heatspreader will void the warranty provided by Thermal Grizzly! 

Liquid metal and other thermal interface materials cannot fully bridge the height difference between the CPU chiplets and the original heatspreader, which can lead to processor damage.


Everything related to the TG Delidded CPU

More information about the provided warranty can be found here.

In case of any issues with the products or questions regarding warranty and guarantee, the Thermal Grizzly customer service team can be contacted at any time. The best way to do so is by using the contact form on the Thermal Grizzly shop website.

Important Note:

The TG Delidded CPU AMD Ryzen™ 7 9850X3D is not compatible with AMD Direct Die Frames! 

The CPU is cleaned after delidding. However, residues may remain on the silicon of the chiplets due to the testing process. During the delidding process, cosmetic imperfections (small cracks or chips) may appear on the PCB or the dies. These do not affect functionality, as validated by the testing process.


Scope of Delivery

  • TG Delidded CPU
  • Heat spreader of the CPU
  • USB stick
AMD TG Delidded CPU package contents
Downloads "AMD TG Delidded CPU"
CPU Type: AM5
CPU model: Ryzen™ 7 9850X3D
Socket manufacturer: AMD

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Mycro Direct-Die Pro
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Heatspreader
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TG Kapton Insulation Sheet
Electrically non-conductive polyamide adhesive tape

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TG Shield
High-temperature protective coating, protects against liquid metal, thermal paste, and short circuits

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Conductonaut Extreme
Liquid metal with minimal layer thickness for ultra-high-performance thermal conductivity in overclocking with increased material compatibility

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Conductonaut
Liquid metal for overclocking: Highest efficiency and ultra-high thermal conductivity, perfect for experienced users

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